公开(公告)号：US09966370B2

公开(公告)日：2018-05-08

申请号：US15036794

申请日：2014-10-23

Applicant: OSRAM Opto Semiconductors Gmbh

Inventor： Jürgen Moosburger ,  Markus Pindl ,  Simon Jerebic ,  Frank Singer

IPC: H01L33/48 ,  H01L25/00 ,  H01L33/46 ,  H01L33/60 ,  H01L33/54

CPC classification number: H01L25/50 ,  H01L33/46 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

公开(公告)号：US20170243850A1

公开(公告)日：2017-08-24

申请号：US15589427

申请日：2017-05-08

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Thomas BEMMERL ,  Simon Jerebic ,  Markus Pindl

IPC: H01L23/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  H01L25/16 ,  H01L33/32 ,  H01L33/06 ,  H01L23/31 ,  H01L21/56 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

Abstract: An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.

公开(公告)号：US20150255313A1

公开(公告)日：2015-09-10

申请号：US14436578

申请日：2013-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Martin Brandl ,  Markus Boss ,  Markus Pindl ,  Simon Jerebic ,  Herbert Brunner ,  Tobias Gebuhr

IPC: H01L21/56 ,  H01L21/78

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract translation: 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。

公开(公告)号：US20150214450A1

公开(公告)日：2015-07-30

申请号：US14682258

申请日：2015-04-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Jürgen Moosburger ,  Simon Jerebic

IPC: H01L33/60 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L33/20 ,  H01L33/44 ,  H01L33/48 ,  H01L33/486 ,  H01L33/501 ,  H01L33/56 ,  H01L2933/0091

Abstract: An optoelectronic component includes a carrier; a semiconductor chip having an active layer that generates radiation and is arranged on a carrier; a dispersed material including a matrix material and particles embedded therein arranged on the semiconductor chip and/or the carrier at least in regions, and is integral therewith; and a separating edge between the dispersed material and matrix material formed at a chip edge of the semiconductor chip.

Abstract translation: 光电子部件包括载体; 半导体芯片，具有产生辐射并且被布置在载体上的有源层; 包括基质材料和嵌入其中的颗粒的分散材料，其至少在区域中布置在半导体芯片和/或载体上，并与其成为一体; 以及形成在半导体芯片的芯片边缘处的分散材料和基质材料之间的分离边缘。