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公开(公告)号：US12051758B2
公开(公告)日：2024-07-30
申请号：US17425596
申请日：2020-01-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , Daniel Richter
IPC: H01L31/0232 , G02B6/42 , H01L31/173 , H01L25/16 , H04B10/40
CPC classification number: H01L31/02327 , G02B6/4214 , G02B6/4215 , H01L31/173 , H01L25/167 , H04B10/40
Abstract: In an embodiment an optoelectronic sensor arrangement includes a carrier substrate, an illuminating device, a frequency-selective optical element and a photodetector, wherein the illuminating device and the photodetector form a stacked arrangement on or with the carrier substrate, wherein the frequency-selective optical element is arranged between the illuminating device and the photodetector, wherein the photodetector is arranged in a cavity of the carrier substrate which is covered by the illuminating device and/or the frequency-selective optical element, and wherein the frequency-selective optical element includes a divider mirror and an optical filter.
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公开(公告)号：US11967668B2
公开(公告)日：2024-04-23
申请号：US17283493
申请日：2019-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Zeljko Pajkic , David Racz , Luca Haiberger
CPC classification number: H01L33/502 , H01L33/0093 , H01L33/52 , H01L33/62
Abstract: The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.
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公开(公告)号：US20210399180A1
公开(公告)日：2021-12-23
申请号：US17283493
申请日：2019-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Zeljko Pajkic , David Racz , Luca Haiberger
Abstract: The invention relates to an optoelectronic component, comprising: at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation during operation; at least one connecting element, which is electrically conductive, flexible and extensible; and a shaped body, which surrounds the at least two optoelectronic semiconductor chips and the at least one connecting element at least in some locations, wherein the optoelectronic semiconductor chips are each arranged on a carrier. The invention further relates to a method for producing an optoelectronic component.
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Patent Agency Ranking
公开(公告)号：US11069844B2
公开(公告)日：2021-07-20
申请号：US16382008
申请日：2019-04-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , Sam Chou , Martin Brandl
Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
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公开(公告)号：US10944033B2
公开(公告)日：2021-03-09
申请号：US16066552
申请日：2017-01-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , David Racz , Matthias Sperl
IPC: H01L33/00 , H01L33/62 , H01L31/024 , H01L33/64 , H01L31/0224 , H01L31/02 , H01L33/38 , H01L33/54 , H01L31/0304 , H01L31/0352 , H01L33/06 , H01L33/30
Abstract: An optoelectronic component includes a radiation side, a contact side opposite a radiation side with at least two electrically conductive contact elements for external electrical contacting of the component, and a semiconductor layer sequence arranged between the radiation side and the contact side with an active layer that emits or absorbs electromagnetic radiation during normal operation, wherein the contact elements are spaced apart from each other at the contact side and are completely or partially exposed at the contact side in the unmounted state of the component, the region of the contact side between the contact elements is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in plan view of the contact side the cooling element covers one or both contact elements partially.
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公开(公告)号：US10115713B2
公开(公告)日：2018-10-30
申请号：US14430625
申请日：2013-09-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , Markus Wicke , Yanqi Wang
Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.
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公开(公告)号：US10020433B2
公开(公告)日：2018-07-10
申请号：US15308648
申请日：2015-05-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger
CPC classification number: H01L33/56 , H01L33/486 , H01L33/502 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0058 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
Abstract: An optoelectronic component includes a housing, wherein a cavity is formed on an upper side of the housing, which is delimited by a wall, the housing has an empty space, the wall is arranged between the cavity and the empty space, the housing has a surface, the empty space is arranged between the surface of the housing and the wall, the wall and the surface are arranged at least partially parallel to each other, the wall includes an optically transparent material, and the wall has a wall thickness of 1 μm to 100 μm.
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28.发明申请公开(公告)号：US20150236000A1
公开(公告)日：2015-08-20
申请号：US14430625
申请日：2013-09-26
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Luca Haiberger , Markus Wicke , Yanqi Wang
IPC: H01L25/16 , H01L31/0232 , H05B33/08 , H01L31/14
CPC classification number: H01L25/167 , H01L2224/0603 , H01L2224/48091 , H01L2224/49107 , H01L2224/49113 , H01L2224/49175 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: An optoelectronic assembly includes at least one first component that emits first electromagnetic radiation and at least one first photosensitive component that controls the first component. The first photosensitive component connects in parallel to the first component and has a first radiation-sensitive region in a beam path of the first electromagnetic radiation.
Abstract translation: 光电组件包括发射第一电磁辐射的至少一个第一部件和控制第一部件的至少一个第一光敏部件。 第一感光部件与第一部件并联连接，并且在第一电磁辐射的光束路径中具有第一辐射敏感区域。
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