公开(公告)号：US07470998B2

公开(公告)日：2008-12-30

申请号：US11373154

申请日：2006-03-13

申请人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

发明人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

IPC分类号： H01L23/84 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.

摘要翻译： 本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接， 其制造方法。 根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。 第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。 基本上所有的第一基板的所有后表面被结合到布线结构的主表面。 形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

公开(公告)号：US20080305434A1

公开(公告)日：2008-12-11

申请号：US11631514

申请日：2005-07-13

申请人： Takanori Nishi ,  Takahiro Kitano ,  Katsuya Okumura

发明人： Takanori Nishi ,  Takahiro Kitano ,  Katsuya Okumura

IPC分类号： G03F7/20 ,  G03D3/00

CPC分类号： G03F7/3021 ,  G03F7/26 ,  G03F7/38 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67178

摘要： A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle.

摘要翻译： 显影装置具有用于保持基板的基板保持器，设置在基板保持器中的加热器，并且加热用于通过PEB处理抗蚀剂膜的基板保持器上的基板，冷却器以冷却基板保持器上的基板， 显影溶液喷嘴将显影液供给到基板保持器上的基板，以及控制器，用于控制加热器，冷却器和显影喷嘴。

公开(公告)号：US20080302185A1

公开(公告)日：2008-12-11

申请号：US11662478

申请日：2005-09-09

申请人： Masami Yakabe ,  Toshiyuki Matsumoto ,  Naoki Ikeuchi ,  Katsuya Okumura

发明人： Masami Yakabe ,  Toshiyuki Matsumoto ,  Naoki Ikeuchi ,  Katsuya Okumura

IPC分类号： G01H1/00

CPC分类号： G01N29/14 ,  B81C99/005 ,  G01N29/4427 ,  G01N2291/2695 ,  G01N2291/2697

摘要： Voltage is applied to a chip TP by a voltage drive unit 30 through a probe needle P to move a movable part of a microstructure. A sound produced in response to motion of the movable part of the microstructure is detected by a microphone 3. Then, the sound detected by the microphone 3 is measured by a measurement unit 25. The control unit 20 evaluates the characteristics of the tested chip TP by comparing with a sound detected from an ideal chip TP.

摘要翻译： 通过电压驱动单元30通过探针P将电压施加到芯片TP，以移动微结构的可移动部分。 通过麦克风3检测响应于微结构的可动部分的运动而产生的声音。然后，由测量单元25测量由麦克风3检测到的声音。控制单元20评估测试芯片TP的特性 通过与从理想芯片TP检测到的声音进行比较。

公开(公告)号：US07435769B2

公开(公告)日：2008-10-14

申请号：US10550014

申请日：2004-03-24

申请人： Daishiro Kishimoto ,  Toru Makino ,  Katsuya Okumura ,  Juji Uchida

发明人： Daishiro Kishimoto ,  Toru Makino ,  Katsuya Okumura ,  Juji Uchida

IPC分类号： C08K5/34

CPC分类号： D01F6/92 ,  C08K5/0066 ,  C08K5/5313 ,  C08L101/00 ,  D01F1/07 ,  D01F6/90 ,  C08L55/02

摘要： A flame-retardant synthetic resin composition characterized by comprising 1-40 parts by weight of at least one type of organic phosphorus compound represented by the following general formula (1): (wherein R1 represents alkyl, aralkyl, etc.) with respect to 100 parts by weight of a synthetic resin.

摘要翻译： 一种阻燃性合成树脂组合物，其特征在于包含1-40重量份的由以下通式（1）表示的至少一种有机磷化合物：其中R 1表示烷基，芳烷基 等）相对于100重量份的合成树脂。

公开(公告)号：US07335517B2

公开(公告)日：2008-02-26

申请号：US10902391

申请日：2004-07-30

申请人： Nobuo Hayasaka ,  Katsuya Okumura ,  Keiichi Sasaki ,  Mie Matsuo

发明人： Nobuo Hayasaka ,  Katsuya Okumura ,  Keiichi Sasaki ,  Mie Matsuo

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/4763 ,  G01R31/26

CPC分类号： H01L23/642 ,  H01L21/76898 ,  H01L23/367 ,  H01L23/481 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/00

摘要： A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.

摘要翻译： 公开了一种多芯片半导体器件，其中堆叠芯片，每个芯片包括形成在顶部的半导体衬底和电路部件，以及形成在半导体衬底顶部的层间绝缘膜。 至少一个芯片具有穿过半导体衬底和层间绝缘膜的通孔中形成的金属的连接插头。 具有连接插头的芯片通过该连接插头与另一个芯片电连接。

公开(公告)号：US07195846B2

公开(公告)日：2007-03-27

申请号：US10724734

申请日：2003-12-02

申请人： Hideo Kaneko ,  Yukio Inazuki ,  Tetsushi Tsukamoto ,  Masayuki Mogi ,  Katsuya Okumura

发明人： Hideo Kaneko ,  Yukio Inazuki ,  Tetsushi Tsukamoto ,  Masayuki Mogi ,  Katsuya Okumura

IPC分类号： G03F1/00 ,  G03C5/00

CPC分类号： G03F1/82 ,  G03F1/26 ,  G03F1/32 ,  G03F1/68

摘要： A photomask blank having a film of at least one layer formed on a substrate is manufactured by forming a film on a substrate and irradiating the film with light from a flash lamp. A photomask is manufactured from the thus manufactured photomask blank by forming a patterned resist on the film on the blank by photolithography, etching away those portions of the film which are not covered with the resist, and removing the resist. The photomask blank and photomask have minimized warpage and improved chemical resistance.

摘要翻译： 通过在基板上形成膜并用来自闪光灯的光照射薄膜来制造具有形成在基板上的至少一层的膜的光掩模坯料。 通过光刻法在坯料上的膜上形成图案化的抗蚀剂，蚀刻掉未被抗蚀剂覆盖的膜的那些部分，并除去抗蚀剂，由这样制造的光掩模坯料制造光掩模。 光掩模坯料和光掩模具有最小的翘曲和改善的耐化学性。

公开(公告)号：US07108589B2

公开(公告)日：2006-09-19

申请号：US11187944

申请日：2005-07-25

申请人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

发明人： Norio Kimura ,  Mitsuhiko Shirakashi ,  Katsuya Okumura ,  You Ishii ,  Junji Kunisawa ,  Hiroyuki Yano

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  B24B9/065 ,  B24B37/12 ,  H01L21/67046

摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

摘要翻译： 抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属 电影。 抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光 用于抛光衬底的外周部分的机构。

公开(公告)号：US20050279170A1

公开(公告)日：2005-12-22

申请号：US11149176

申请日：2005-06-10

申请人： Katsuya Okumura ,  Toshiyuki Matsumoto ,  Naoki Ikeuchi ,  Masami Yakabe

发明人： Katsuya Okumura ,  Toshiyuki Matsumoto ,  Naoki Ikeuchi ,  Masami Yakabe

IPC分类号： B81C99/00 ,  G01C19/56 ,  G01C25/00 ,  G01N29/00 ,  G01N29/09 ,  G01N29/12 ,  G01N29/30 ,  G01N29/42 ,  G01N29/46 ,  G01P15/12 ,  G01P21/00 ,  H01L29/84

CPC分类号： G01C19/5719 ,  B81C99/005 ,  G01C25/005 ,  G01N29/12 ,  G01N29/30 ,  G01N29/42 ,  G01N29/46 ,  G01N2291/2695 ,  G01N2291/2697 ,  G01P15/123 ,  G01P21/00 ,  G01P2015/0842

摘要： Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.

摘要翻译： 测试声波从扬声器输出。 作为被测试芯片TP的微结构的三轴加速度传感器的可动部分由于扬声器输出的压缩波的测试声波的到来而移动，即由于空气振动 。 基于通过探针提供的输出电压来测量根据该移动而变化的电阻值的变化。 控制部件基于测量的属性值，即测量数据来确定三轴加速度传感器的特性。

公开(公告)号：US20050087853A1

公开(公告)日：2005-04-28

申请号：US10855889

申请日：2004-05-28

申请人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

发明人： Katsuya Okumura ,  Koji Maruyama ,  Kazuya Nagaseki ,  Akiteru Rai

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/12 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L23/02 ,  H05K7/02

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.

摘要翻译： 本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接， 其制造方法。 根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。 第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。 基本上所有的第一基板的所有后表面被结合到布线结构的主表面。 形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

公开(公告)号：US06788985B2

公开(公告)日：2004-09-07

申请号：US09867465

申请日：2001-05-31

申请人： Kunihiro Mitsutake ,  Katsuya Okumura

发明人： Kunihiro Mitsutake ,  Katsuya Okumura

IPC分类号： G06F1900

CPC分类号： G06Q30/06 ,  G06Q30/0601

摘要： An electronic commerce for semiconductor products comprises a network, a client terminal, a connection server, a virtual production line, and a real production line. The real production line actually manufactures semiconductor products. The virtual production line provides a computer with substantially the same functions as the real production line and computes an optimal lot progress. The connection server connects the virtual production line to the client terminal via the network. When a condition is entered from the client terminal, the connection server transfers this condition to the virtual production line. Simulation is performed realtime for determining whether a product flows in the virtual production line under the transferred condition. The connection server transfers a simulation result to the client terminal. Based on the simulation result, a electronic commerce is conducted.

摘要翻译： 半导体产品的电子商务包括网络，客户终端，连接服务器，虚拟生产线和实际生产线。 实际生产线实际上是生产半导体产品。 虚拟生产线为计算机提供与实际生产线基本相同的功能，并计算最佳批量进度。 连接服务器通过网络将虚拟生产线连接到客户终端。 当从客户终端输入条件时，连接服务器将该条件传送到虚拟生产线。 实时进行模拟，以确定产品是否在转移条件下在虚拟生产线中流动。 连接服务器将模拟结果传送到客户终端。 基于模拟结果，进行电子商务。