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公开(公告)号：US20240090121A1
公开(公告)日：2024-03-14
申请号：US18517393
申请日：2023-11-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung BYUN , Jung Soo KIM , Sang Hyun SIM , Chang Min HA , Tae Hong MIN , Jin Won LEE
IPC: H05K1/02
CPC classification number: H05K1/0218 , H05K1/024 , H05K1/0256 , H05K1/0298 , H05K2201/0141
Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
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公开(公告)号：US20240032208A1
公开(公告)日：2024-01-25
申请号：US18115871
申请日：2023-03-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Eun Su KWON
CPC classification number: H05K3/4626 , H05K1/036 , H05K3/4007 , H05K3/1258 , H05K2203/049 , H05K2203/176 , H05K2201/10204
Abstract: A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.
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Patent Agency Ranking
公开(公告)号：US20220301975A1
公开(公告)日：2022-09-22
申请号：US17339451
申请日：2021-06-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Hyung HAM , Gun Hwi HYUNG , Jun Hyeong JANG , Tae Hong MIN
IPC: H01L23/373 , H05K1/02 , H05K1/18 , H05K1/03 , H01L23/367 , H01L23/13 , H01L23/498 , H01L21/48
Abstract: An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber reinforced polymer (CFRP).
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公开(公告)号：US20180122555A1
公开(公告)日：2018-05-03
申请号：US15655655
申请日：2017-07-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Seok KIM , Ye Jeong KIM , Tae Hong MIN , Myung Sam KANG , Kwang Hee KWON
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F2027/2809
Abstract: Embodiments disclosed are directed to a multilayer electronic component and a method of manufacturing the same. The multilayer electronic component may includ a multilayer body having a plurality of insulating layers and internal coil parts disposed on the insulating layers. The plurality of insulating layers and internal coil parts are stacked. The multilayer electronic component may also include and external electrodes disposed on external surfaces of the multilayer body and connected to the internal coil parts. The internal coil parts include a first metal and a second metal having electrical conductivity higher than that of a first metal is disposed on the internal coil parts and surrounds the internal coil parts.
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公开(公告)号：US20160309575A1
公开(公告)日：2016-10-20
申请号：US15198110
申请日：2016-06-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Myung Sam KANG , Jung Han LEE , Young Gwan KO
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0204 , H05K1/0207 , H05K1/0209 , H05K1/0298 , H05K1/111 , H05K1/181 , H05K1/185 , H05K3/4602 , H05K3/4608 , H05K2201/0195 , H05K2201/0323 , H05K2201/0338 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10416 , H05K2201/10674 , H05K2201/10727
Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.
Abstract translation: 电路板包括绝缘部分，其包括绝缘层，设置在绝缘层上的金属层，每个穿过绝缘层中的至少一个绝缘层的通孔，并将金属层中的至少两个金属层连接在一起; 包括导热材料的第一导热结构，所述导热结构的至少一部分插入到所述绝缘部分中，具有与所述第一导热结构接触的一个表面的第一通孔，第一金属图案与所述第一导热结构的第一 通孔，连接到第一金属图案的第一接合构件以及在布置在绝缘部分的最外表面上的金属层的最外表面上连接有第一电子部件的焊盘，所述焊盘至少在第一区域中 以及具有比第一区域更高的温度的第二区域。
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公开(公告)号：US20150114553A1
公开(公告)日：2015-04-30
申请号：US14460434
申请日：2014-08-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Suk Hyeon Cho , Sang Hoon Kim , Hye Jin Kim , Young Gwan Ko , Jung Han Lee
CPC classification number: B32B37/18 , B32B38/0004 , B32B38/0008 , B32B38/0036 , B32B38/10 , B32B2311/12 , B32B2315/08 , B32B2457/08 , H01L21/481 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K3/022 , H05K3/4605 , H05K2203/1545 , H01L2924/00
Abstract: Disclosed herein is a method of manufacturing a glass core capable of continuously manufacturing the glass core by an automated process. The method includes: providing a glass sheet; laminating an insulating sheet on the glass sheet; laminating a copper clad sheet on the insulating sheet to manufacture the glass core; laminating a buffering sheet on the copper clad sheet; pressing and temporarily hardening the buffering sheet; delaminating the temporarily hardened buffering sheet; thermally hardening the glass core by a heater after the delaminating of the temporarily hardened buffering sheet; and cutting the glass core at a predetermined size after the thermal hardening of the glass core.
Abstract translation: 本文公开了一种制造能够通过自动化方法连续制造玻璃核心的玻璃核心的方法。 该方法包括：提供玻璃板; 在玻璃板上层叠绝缘片; 在绝缘片上层叠铜箔片以制造玻璃芯; 将缓冲片层压在铜包覆片上; 按压并暂时硬化缓冲片; 剥离临时硬化的缓冲片; 在暂时硬化的缓冲片分层之后，通过加热器对玻璃芯进行热硬化; 并且在玻璃芯的热硬化之后将玻璃芯切割成预定尺寸。
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公开(公告)号：US20140357147A1
公开(公告)日：2014-12-04
申请号：US14068389
申请日：2013-10-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Sang Hoon KIM , Hye Jin KIM
CPC classification number: H05K1/0271 , H05K1/0306 , H05K1/038 , H05K3/022 , H05K3/4605 , H05K2201/0212 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09136 , H05K2203/1545 , Y10T428/249921 , Y10T442/2861 , Y10T442/2902
Abstract: Disclosed herein is a core made of a glass material so as to be capable of preventing generation of warpage in a printed circuit board due to a difference in a coefficient of thermal expansion at the time of manufacturing the printed circuit board. The core includes: an organic cloth; and a glass having the organic cloth formed therein. The core is manufactured in a form in which rigidity thereof is increased by impregnating the organic cloth having a negative coefficient of thermal expansion is impregnated in a liquid-phase glass, thereby making it possible to effectively prevent generation of warpage in the printed circuit board due to the difference in a coefficient of thermal expansion.
Abstract translation: 这里公开了一种由玻璃材料制成的芯体，以便能够防止由于印刷电路板制造时的热膨胀系数的差异而在印刷电路板中产生翘曲。 核心包括：有机布; 以及其中形成有机布的玻璃。 通过将具有负的热膨胀系数的有机布浸渍浸渍在液相玻璃中，使其硬度提高的形式制造芯，由此能够有效地防止由于印刷电路板产生翘曲 到热膨胀系数的差异。
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