摘要:
A BiCMOS circuit includes a CMOS circuit for inverting data applied to an input terminal and a first bipolar transistor, having a base connected to an output point of this CMOS circuit, a collector connected to a power supply voltage and an emitter connected to an output terminal, for charging the output terminal. The BiCMOS circuit also includes a second bipolar transistor, having a collector connected to the output terminal, for discharging the output terminal, a first MOS transistor of a first conductivity type connected in parallel between the base and the collector of the second bipolar transistor and a second MOS transistor of the first conductivity type connected in series with the first MOS transistor and having a gate connected to an output point of the CMOS circuit. The Bi-CMOS circuit further includes a third MOS transistor of the first conductivity type connected between the input terminal and the gate of the first MOS transistor of the first conductivity type and having a gate receiving a first reference voltage, and a fourth MOS transistor of a second conductivity type connected between the first reference voltage and the gate of the first MOS transistor. A large variation width of an output voltage can be ensured, and hence the Bi-CMOS circuit normally operates even at a low voltage without any deterioration in terms of delay time.
摘要:
A memory cell array includes static memory cells arranged in an array of n rows.times.m columns. Each of the memory cells includes MOS transistors formed in a semicondutor substrate and in a corresponding one of well regions of the conductivity type opposite to that of the semiconductor substrate. The well regions are independently formed for each row or for every two or more rows of the memory cell array. The well regions are connected to the respective sources of MOS transistors formed in the well regions. The source and backgate of each of the MOS transistors formed in the well regions are connected to the common source wirings for each of the independently formed well regions. Isolation circuits are respectively connected between the common source wirings for the repective well regions and the power source. A row of the memory cell array to which a defective memory cell is connected is isolated from the power source by means of the isolation circuits.
摘要:
A valve train for an internal combustion engine including a plurality of cylinders having different valve mechanism constructions, in which the valve train has a correcting member for correcting a difference in valve lift amount that is produced between the plurality of cylinders due to a difference in construction between valve mechanisms so as to make valve lift amounts of the plurality of cylinders substantially uniform.
摘要:
A semiconductor device has an internal circuit (2), a PAD, a NMOS Tr (QN) as a protective transistor formed between a node (N) on a signal line and a first power source (Vss), and a NOR gate (G1) as a logical gate connected to a gate as a control terminal of the NMOS transistor (QN). The internal circuit (2) is connected to the PAD through the signal line. The NOR gate (G1) keeps the protective transistor (QN) an OFF state during a normal operation of the internal circuit (2). In addition, the semiconductor device further includes a test circuit (21). The output from the NOR gate (G1), whose one input is the output from the test circuit (21), is supplied to the gate of the NMOS transistor (QN). The output from the test circuit (21) is thereby output to outside through the NMOS transistor (QN) and the PAD.
摘要:
A semiconductor device comprises: a first circuit (11) formed in a first well (N-type) and a second well (P-type) of a semiconductor substrate, supplied with a first supply voltage (V.sub.ss) and a second supply voltage (V.sub.cc) higher than the first supply voltage, and activated when a first well bias voltage (V.sub.BP1) is applied to the first well (N-type) and a second well bias voltage (V.sub.BN1) is applied to the second well (P-type); a second circuit (201; 202) formed in a third well (N-type) and a fourth well (P-type) of the same semiconductor substrate as above, supplied with the first supply voltage (V.sub.ss) and a third supply voltage (V.sub.cc2) higher than the first supply voltage but different from the second supply voltage (V.sub.cc), and activated when a third well bias voltage (V.sub.BP2) is applied to the third well (N-type) and a fourth well bias voltage (V.sub.BN2) is applied to the fourth well (P-type); a first bias circuit (20) supplied with the first and second supply voltages (V.sub.ss and V.sub.cc), for generating and outputting the first well bias voltage (V.sub.BP1); a second bias circuit (21) supplied with the first and second supply voltages (V.sub.ss and V.sub.cc), for generating and outputting the second well bias voltage (V.sub.BN1); a third bias circuit (16) supplied with the first and third supply voltages (V.sub.ss and V.sub.cc2) for generating and outputting the third well bias voltage (V.sub.BP2); and a fourth bias circuit (17) supplied with the first and third supply voltages (V.sub.ss and V.sub.cc2) for generating and outputting the fourth well bias voltage (V.sub.BN2). In the semiconductor device, even if any of the second supply voltage (V.sub.cc) and the third supply voltage (V.sub.cc2) is first supplied, it is possible to prevent the latch-up phenomenon caused by the floated substrate potential.
摘要:
A semiconductor memory device having a normal mode of reading and writing data from and to a selected memory cell of a memory cell array. The semiconductor memory device is characterized by control means for switching the normal operation mode to a test mode in response to a test mode signal applied to a certain input terminal, selecting all desired memory cells of the memory cell array at a time, and allowing data applied to a data input terminal to be written to all the selected and desired memory cells at one time.
摘要:
A semiconductor IC device including a main circuit block and at least one subcircuit block, each having a ground terminal, a supply voltage terminal and an input or output terminal. A first ground line is connected to the ground terminal of the main circuit block and arranged within a wiring domain of the main circuit block and adjacent to the subcircuit blocks. A second ground line is connected to the ground terminal of the subcircuit block and arranged within a wiring domain of the subcircuit block and adjacent to the main circuit block. Protective elements are connected between the first and second ground lines so as to form short circuits through at least one of the first and second ground lines. In the IC device thus configured, all of the input and output terminals resist overvoltage, in every case where any one of the ground terminals and the supply voltage terminals is determined as a reference potential terminal, without complicating the protective element wiring arrangement or increasing the chip area and the cost thereof.
摘要:
An integrated circuit includes an input buffer circuit and an output buffer circuit. The source voltage to the input buffer circuit and the output buffer circuit are supplied through bonding pads formed independently on a semiconductor chip, and electrically connected to a source potential lead pin. The input node of the input buffer circuit is coupled to the source potential of the output buffer circuit with a capacitor.
摘要:
A semiconductor device includes a package substrate having a chip mounting surface with at least a plurality of first substrate-side pads and a plurality of second substrate-side pads, a rectangular first semiconductor chip having a first main surface fixed on the chip mounting surface, a plurality of first bonding wires through which a plurality of first pads arranged along one side of a second main surface of the first semiconductor chip and the first substrate-side pads are bonded to each other, a rectangular second semiconductor chip having a third main surface fixed on the second main surface, and a plurality of second bonding wires through which a plurality of second pads arranged along one side of a fourth main surface of the second semiconductor chip and the second substrate-side pads are bonded to each other.
摘要:
An improved semiconductor memory device capable of easily detecting the location of a defective bit line and a defective memory cell as a leakage current path for a short time is provided. A region flowing a leakage current no smaller than a predetermined value is determined by detecting one of a first large region and a remaining second large region, either of said first and second large regions being selected by simultaneously selecting a predetermined number of said column selection lines. Then, a region flowing a leakage current no smaller than a predetermined value is determined by detecting one of a first small region and a remaining second small region, said first and second small regions constituting said one of the first and second large regions, either of said first and second small regions being selected by simultaneously selecting a predetermined number of said column selection lines. For this purpose, an address signal output control circuit is provided within the semiconductor memory device. The address signal output control circuit is supplied with an address output control signal as externally given as a control signal for the purpose of selecting said row selection line by taking control of said row addressing signal in order to perform the control process as described above.