公开(公告)号：US20070006453A1

公开(公告)日：2007-01-11

申请号：US11426719

申请日：2006-06-27

申请人： Shunji Onobori ,  Shozo Minamitani ,  Shuichi Hirata ,  Tomoaki Nakanishi

发明人： Shunji Onobori ,  Shozo Minamitani ,  Shuichi Hirata ,  Tomoaki Nakanishi

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0465 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/758 ,  H01L2924/01087 ,  H01L2924/07811 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  H01L2924/00

摘要： In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

摘要翻译： 在具有片上芯片结构的集成部件通过将上部芯片安装在下部芯片上而形成的部件安装装置中。 通过部件承载头从部件承载单元拾取的下部芯片被放置在安装台上，并且通过部件传送头从第二部件托盘拾取的上部芯片围绕旋转轴线垂直翻转， 在组件传送位置传送到安装头，则由安装头保持的上部芯片通过焊接粘合下降并通过安装台保持的下部芯片在部件安装位置安装。 通过安装形成的集成部件通过部件传送头从安装台进行，并被存储在部件存储单元中的第一部件托盘中。

公开(公告)号：US06544377B1

公开(公告)日：2003-04-08

申请号：US09554721

申请日：2000-05-18

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B32B3120

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

公开(公告)号：US07938929B2

公开(公告)日：2011-05-10

申请号：US12350334

申请日：2009-01-08

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B29C65/02 ,  B29C65/18 ,  B32B37/06 ,  B32B37/10 ,  C08J5/12 ,  H05K3/30

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过利用具有加热装置（122）的接触构件（1211）对电子部件进行加热加压，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。

公开(公告)号：US07637714B2

公开(公告)日：2009-12-29

申请号：US10568501

申请日：2004-09-07

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

IPC分类号： B29C63/00

CPC分类号： H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

摘要翻译： 在与半导体芯片的粘接区域相对应的压敏粘合片的底面侧区域的附近被吸引保持时，移除部件的多个突出部与底面 的半导体芯片通过粘合片在粘合区域。 此外，粘合片被吸入各个突出部分之间，以便改变半导体芯片与粘合片的粘合表面粘结以进行点焊。 此外，移除构件沿着半导体芯片的底表面移动，以便改变点接合的位置，并降低粘合剂粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：US07296727B2

公开(公告)日：2007-11-20

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US07290331B2

公开(公告)日：2007-11-06

申请号：US11426719

申请日：2006-06-27

申请人： Shunji Onobori ,  Shozo Minamitani ,  Shuichi Hirata ,  Tomoaki Nakanishi

发明人： Shunji Onobori ,  Shozo Minamitani ,  Shuichi Hirata ,  Tomoaki Nakanishi

IPC分类号： H05K3/30

CPC分类号： H05K13/0465 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/758 ,  H01L2924/01087 ,  H01L2924/07811 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  H01L2924/00

摘要： In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

摘要翻译： 在具有片上芯片结构的集成部件通过将上部芯片安装在下部芯片上而形成的部件安装装置中。 通过部件承载头从部件承载单元拾取的下部芯片被放置在安装台上，并且通过部件传送头从第二部件托盘拾取的上部芯片围绕旋转轴线垂直翻转， 在组件传送位置传送到安装头，则由安装头保持的上部芯片通过焊接粘合下降并通过安装台保持的下部芯片在部件安装位置安装。 通过安装形成的集成部件通过部件传送头从安装台进行，并被存储在部件存储单元中的第一部件托盘中。

公开(公告)号：US20060285965A1

公开(公告)日：2006-12-21

申请号：US10568501

申请日：2004-09-07

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

IPC分类号： B65G1/133

CPC分类号： H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

摘要翻译： 在与半导体芯片（1）的粘合区域（R 1）对应的粘合片（3）的底面侧区域的附近被吸住并保持的情况下，将多个突起部（30） 移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。 此外，粘合片被吸入各个突出部分之间，以便将半导体芯片与粘合片的表面粘合改变为点粘合，并且还可以沿着半导体的底表面移动移除构件 从而改变点粘合的位置，并通过粘合降低粘合片的粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：US20050098610A1

公开(公告)日：2005-05-12

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K1/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US06246789B1

公开(公告)日：2001-06-12

申请号：US09143364

申请日：1998-08-28

申请人： Naoto Hosotani ,  Koichi Morita ,  Shunji Onobori ,  Shozo Minamitani ,  Kenichi Nishino

发明人： Naoto Hosotani ,  Koichi Morita ,  Shunji Onobori ,  Shozo Minamitani ,  Kenichi Nishino

IPC分类号： G06K932

CPC分类号： G06T7/80 ,  G06T2207/30141 ,  H05K13/0818

摘要： A component mounting apparatus includes a component holding and conveying device for holding and conveying a component and mounting the component onto a circuit board, a circuit board holding device for holding the circuit board, an image recognition optical system for performing recognition of the component and the circuit board with different fields of view, respectively, and a control section. The control section repeatedly determines an optical axis shift amount with the two fields of view between a position of the component and a position of the circuit board recognized by the image recognition optical system. Based on these determination results, the control section determines an optical axis shift amount for calibration, wherein calibration of the image recognition optical system is performed based on the optical-axis shift amount for calibration determined by the control section. Then, the component is mounted onto the circuit board.

摘要翻译： 元件安装装置包括用于保持和传送部件并将部件安装到电路板上的部件保持和传送装置，用于保持电路板的电路板保持装置，用于执行部件的识别的图像识别光学系统和 电路板分别具有不同的视野，以及一个控制部分。 控制部分通过图像识别光学系统识别的部件的位置和电路板的位置之间的两个视场重复地确定光轴偏移量。 基于这些确定结果，控制部确定用于校准的光轴偏移量，其中，基于由控制部确定的用于校准的光轴偏移量来执行图像识别光学系统的校准。 然后，将部件安装到电路板上。

公开(公告)号：US20090120998A1

公开(公告)日：2009-05-14

申请号：US12350334

申请日：2009-01-08

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B23K31/02

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过具有加热装置（122）的接触构件（1211）加热和加压电子部件，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。