公开(公告)号：US20090093136A1

公开(公告)日：2009-04-09

申请号：US12234581

申请日：2008-09-19

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K1/00 ,  H01R43/20

CPC分类号： G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

摘要： A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

摘要翻译： 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US20120030943A1

公开(公告)日：2012-02-09

申请号：US13274188

申请日：2011-10-14

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K3/10

CPC分类号： G06F1/1632 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R12/57 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53209 ,  H01L2224/85 ,  H01L2924/00014

摘要： A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

摘要翻译： 双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。 每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。 使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯 。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

公开(公告)号：US07789680B2

公开(公告)日：2010-09-07

申请号：US12487523

申请日：2009-06-18

申请人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC分类号： H01R13/44

CPC分类号： H01R13/44 ,  A45C2011/188 ,  H01R13/5213 ,  H01R13/6395

摘要： A USB device including a housing and a protective cap that are slidably and/or pivotably connected together such that the protective cap is able to slide and/or pivot between an open position, in which a plug connector extending from the front of the housing is exposed for operable coupling to a host system, and a closed position, in which the protective cap is disposed over the front end portion of the housing to protect the plug connector. A pivoting/sliding mechanism is provided on the housing and cap that secures the protective cap to the housing at all times, including during transitional movements of the protective cap between the opened and closed positions.

摘要翻译： 一种USB设备，包括壳体和保护盖，其可滑动地和/或可枢转地连接在一起，使得保护盖能够在打开位置之间滑动和/或枢转，在该打开位置中，从壳体前部延伸的插头连接器 暴露以用于可操作地联接到主机系统，以及关闭位置，其中保护盖设置在壳体的前端部分上以保护插头连接器。 在壳体和盖上提供枢转/滑动机构，其将保护帽一直固定到壳体，包括在保护盖在打开位置和关闭位置之间的过渡运动期间。

公开(公告)号：US20100110647A1

公开(公告)日：2010-05-06

申请号：US12684841

申请日：2010-01-08

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K5/00 ,  H05K3/30

CPC分类号： H05K3/284 ,  H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09472 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10446 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

摘要： A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot.

摘要翻译： 一种安全数字设备，包括使用表面贴装技术（SMT）技术安装在PCB上的无源元件的PCBA以及使用板上（COB）技术安装的有源组件（例如，控制器和闪存）。 组件仅安装在PCB的一侧，然后在PCB的两侧形成模制塑料外壳，使得部件被包裹在塑料中，并且在PCB表面上形成薄的塑料层 组件。 模制的塑料外壳形成为包括露出设置在PCB上的金属触点的开口和分开开口的肋。 模制的塑料外壳限定了预先模制的开关槽，其有助于插入开关组装过程以安装写保护开关。 写保护开关包括接合在开关槽中的可移动开关按钮和固定在开关槽上的开关帽。

公开(公告)号：US20100105251A1

公开(公告)日：2010-04-29

申请号：US12649233

申请日：2009-12-29

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H01R27/02 ,  B32B37/24

CPC分类号： G06F1/1632 ,  H05K1/117 ,  H05K3/202 ,  H05K3/4092 ,  H05K5/0282 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/49126

摘要： A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.

摘要翻译： microSD-SD适配器卡包括具有引线框架结构的基底基板，形成包围引线框架结构的八个microSD接触销的腔室的保护盖，以及形成在保护帽和暴露部分上的热固性塑料外壳 基板为适配卡提供标准的SD卡尺寸。 后开口便于插入标准microSD卡，由此microSD卡上的八个接触垫与室内的八个microSD接触针接触，以使由microSD卡产生的电信号通过以下方式传输到主机系统： 标准SD插座。 夹紧销钉设置在腔室内以与设置在microSD卡上的把手接合部接合。 在模制塑料外壳上设有一个预先模制的开关槽，并在模制后安装插入式写保护开关。

公开(公告)号：US07687921B2

公开(公告)日：2010-03-30

申请号：US12115482

申请日：2008-05-05

申请人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic device includes multiple IC dies stacked in an offset stacking arrangement on a substrate. Each IC die includes electrically isolated step pads that facilitates transmitting a dedicated signal between a (beginning) substrate bonding pad and a selected (terminal) contact pad of any die by way of short bonding wires that extend up the stack between the electrically isolated step pads. A memory devices includes stacked memory IC die, wherein “shared” signal transmission paths are formed by associated bonding wires that link corresponding contact pads of each memory die, and dedicated select/control signals are transmitted to each memory die by separate transmission paths formed in part by associated electrically isolated step pads. Substrate space overhung by the stack is used for passive components and IC dies. Memory controller die may be mounted on the stack and connected by dedicated transmission paths utilizing the electrically isolated step pads.

摘要翻译： 电子设备包括以衬底上的偏移堆叠布置堆叠的多个IC管芯。 每个IC芯片包括电隔离的步进焊盘，其有助于通过在电隔离的步进焊盘之间延伸堆叠的短接合导线在（开始）衬底焊盘和任何裸片的选定（端子）接触焊盘之间传输专用信号 。 存储器件包括堆叠存储器IC管芯，其中“共享”信号传输路径由链接每个存储管芯的相应接触焊盘的相关联的接合线形成，并且专用的选择/控制信号通过形成在 部分由相关的电隔离步进垫。 用于堆叠的衬底空间被用于无源组件和IC模具。 存储器控制器管芯可以安装在堆叠上并且通过利用电隔离的步进焊盘的专用传输路径连接。

公开(公告)号：US20090273096A1

公开(公告)日：2009-11-05

申请号：US12115482

申请日：2008-05-05

申请人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

IPC分类号： H01L23/49 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic device includes multiple IC dies stacked in an offset stacking arrangement on a substrate. Each IC die includes electrically isolated step pads that facilitates transmitting a dedicated signal between a (beginning) substrate bonding pad and a selected (terminal) contact pad of any die by way of short bonding wires that extend up the stack between the electrically isolated step pads. A memory devices includes stacked memory IC die, wherein “shared” signal transmission paths are formed by associated bonding wires that link corresponding contact pads of each memory die, and dedicated select/control signals are transmitted to each memory die by separate transmission paths formed in part by associated electrically isolated step pads. Substrate space overhung by the stack is used for passive components and IC dies. Memory controller die may be mounted on the stack and connected by dedicated transmission paths utilizing the electrically isolated step pads.

摘要翻译： 电子设备包括以衬底上的偏移堆叠布置堆叠的多个IC管芯。 每个IC芯片包括电隔离的步进焊盘，其有助于通过在电隔离的步进焊盘之间延伸堆叠的短接合导线在（开始）衬底焊盘和任何裸片的选定（端子）接触焊盘之间传输专用信号 。 存储器件包括堆叠存储器IC管芯，其中“共享”信号传输路径由链接每个存储管芯的相应接触焊盘的相关联的接合线形成，并且专用的选择/控制信号通过形成在 部分由相关的电隔离步进垫。 用于堆叠的衬底空间用于无源组件和IC模具。 存储器控制器管芯可以安装在堆叠上并且通过利用电隔离的步进焊盘的专用传输路径连接。

公开(公告)号：US20080235939A1

公开(公告)日：2008-10-02

申请号：US12033851

申请日：2008-02-19

申请人： Siew S. Hiew ,  Charles C. Lee ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Charles C. Lee ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/20 ,  G11C11/34

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/10159 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有平行排布置的多个PCB区域的PCB面板。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制层。 然后使用激光切割方法，磨料水射流切割方法和机械研磨方法之一将面板切片，使得所得PCB基板和塑料外壳具有由MicroSD规格规定的宽度，高度和长度。 然后执行前沿倒角处理。

公开(公告)号：US20110003514A1

公开(公告)日：2011-01-06

申请号：US12884732

申请日：2010-09-17

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H01R24/00

CPC分类号： H01R13/6658

摘要： An extended USB plug connector includes a connector substrate including a frontend having a first set of electrical contact pins disposed thereon and a backend having a second set of electrical contact pins disposed thereon. The first set includes a first row of electrical contact pins disposed on a top surface of the connector substrate and a second row of electrical contact pins disposed in parallel with the first row of electrical contact pins and interior to the first row of electrical contact pins, where the second row includes more electrical contact pins than the first row. The second set of electrical contact pins includes a number of electrical contact pins equal to the first row and second row of electrical contact pins in total. The second set of electrical contact pins are used to connect to corresponding electrical contact pads disposed on a printed circuit board assembly having a USB controller and flash memory devices disposed thereon.

摘要翻译： 扩展的USB插头连接器包括连接器基板，该连接器基板包括前端，前端具有设置在其上的第一组电接触针和具有设置在其上的第二组电接触针的后端。 第一组包括设置在连接器基板的顶表面上的第一排电接触针和与第一排电接触销平行布置并且位于第一排电触针的内部的第二排电接触针， 其中第二行包括比第一行更多的电接触引脚。 第二组电接触引脚包括总共等于第一行和第二排电接触引脚的多个电接触引脚。 第二组电接触针用于连接到布置在具有设置在其上的USB控制器和闪存器件的印刷电路板组件上的相应电接触焊盘。

公开(公告)号：US08297987B2

公开(公告)日：2012-10-30

申请号：US13211100

申请日：2011-08-16

申请人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： David Nguyen ,  Nan Nan ,  Jim Chin-Nan Ni ,  Frank I-Kang Yu ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K5/03

CPC分类号： G06K19/07732

摘要： An extended universal serial bus (USB) storage device is described herein. According to one embodiment, an extended USB storage device includes a printed circuit board assembly (PCBA) having a flash memory device and a flash controller mounted thereon, and an extended USB connector plug coupled to the PCBA for providing a USB compatible interface between an external device and the flash memory device and the flash controller, wherein the extended USB connector plug includes a first end used to couple to the external device and a second end coupled to the flash memory device and the flash controller. The extended USB connector plug includes multiple communication interfaces. Other methods and apparatuses are also described.

摘要翻译： 本文描述了扩展通用串行总线（USB）存储设备。 根据一个实施例，扩展的USB存储设备包括具有闪存设备和安装在其上的闪存控制器的印刷电路板组件（PCBA），以及耦合到PCBA的扩展USB连接器插头，用于在外部 设备和闪存设备和闪存控制器，其中扩展的USB连接器插头包括用于耦合到外部设备的第一端和耦合到闪存设备和闪存控制器的第二端。 扩展的USB连接器插头包括多个通信接口。 还描述了其它方法和装置。