公开(公告)号：US20200185323A1

公开(公告)日：2020-06-11

申请号：US16792619

申请日：2020-02-17

Applicant: Texas Instruments Incorporated

Inventor： Saumya Gandhi ,  Matthew David Romig ,  Abram Castro

IPC: H01L23/50 ,  H01L23/532 ,  H01L23/31 ,  H01G4/005 ,  H01L49/02 ,  H01L25/065 ,  H01L23/522 ,  H01L23/495 ,  H01G4/38 ,  H01G4/40 ,  H01C1/02 ,  H01G4/224

Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

公开(公告)号：US10566276B2

公开(公告)日：2020-02-18

申请号：US15807114

申请日：2017-11-08

Applicant: Texas Instruments Incorporated

Inventor： Saumya Gandhi ,  Matthew David Romig ,  Abram Castro

IPC: H01L23/50 ,  H01L23/522 ,  H01L25/065 ,  H01L49/02 ,  H01G4/005 ,  H01L23/31 ,  H01L23/532

Abstract: A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

公开(公告)号：US10284172B2

公开(公告)日：2019-05-07

申请号：US14698616

申请日：2015-04-28

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer ,  Abram Castro

IPC: H03H9/10 ,  H01L41/08

Abstract: An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.

公开(公告)号：US10199348B2

公开(公告)日：2019-02-05

申请号：US15194293

申请日：2016-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  B29C45/14 ,  B29C45/00 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L23/495

Abstract: The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

公开(公告)号：US09601414B2

公开(公告)日：2017-03-21

申请号：US14968234

申请日：2015-12-14

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/562 ,  H01L24/03 ,  H01L24/04 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635

Abstract: The invention is directed to a method for inhibiting or preventing delamination at the interface of the die attach/mold compound and the die pad of a semiconductor device and a semiconductor device formed by such method. The method includes providing a leadframe having a top surface; coating the top surface of the leadframe with first and second silane coating; heating the silane coatings to form a porous layer having a porosity of at least 10%; applying a die to the porous layer; securing the die to the porous layer by a die attaching compound; and after the curing of die attach material and wire bonding, a mold compound is applied through molding.

公开(公告)号：US20160307866A1

公开(公告)日：2016-10-20

申请号：US15194293

申请日：2016-06-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/00 ,  C08K7/14 ,  C08K3/36 ,  C08K3/10 ,  H01L23/495 ,  H01B3/40

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 通过从芯片跨越到基板的导线（201）将附接到基板（103）的芯片（101）的组装装载到模具的加热空腔（402）中; 线表面涂覆有杂环化合物（302）的分子的吸附层; 模具的压力室（404）装载有包括可聚合树脂的包装材料的固体颗粒（410），该室连接到空腔; 在填充模具腔之前，在加热固体颗粒以使其半液体并通过流道（403）对其加压的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，由此 通过被吸附的杂环化合物分子将到达空腔的树脂分子交联到电线表面上的绝缘的至少一个单层的聚合物结构。

公开(公告)号：US09305869B1

公开(公告)日：2016-04-05

申请号：US14587629

申请日：2014-12-31

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaged semiconductor device (100) comprising a leadframe having a pad (101) with an assembled semiconductor chip (110), a plurality of straps (102) connecting the pad to side edges of the device package, leads (103), and a package (150) of plastic compound adhering to the leadframe; at least one surface (102a) of the straps covered with a layer (120) of a compound both non-adhesive to polymeric compounds and hydrophobic; the compound (220) selected from a group including fluorinated thiol compounds, fluorinated amine compounds, fluorinated aminesilanes, organosilanes, and their derivatives; or the compound (330) selected from a group including open-pore microcellular metal foams and polymer foams. Further, the package may include an array of holes through the plastic compound, extending from the package surface to the strap surface.

Abstract translation: 一种封装半导体器件（100），包括具有带有组装的半导体芯片（110）的焊盘（101）的引线框架，将焊盘连接到器件封装的侧边缘的多个带（102），引线（103）和 附着在引线框上的塑料复合物的封装（150） 所述带的至少一个表面（102a）覆盖有与所述聚合物非粘合剂和疏水性的化合物的层（120）; 选自含氟化硫醇化合物，氟化胺化合物，氟化胺硅烷，有机硅烷及其衍生物的化合物（220） 或选自包括开孔微孔金属泡沫和聚合物泡沫的组的化合物（330）。 此外，包装可以包括从包装表面延伸到带表面的穿过塑料化合物的孔阵列。

公开(公告)号：US20150357238A1

公开(公告)日：2015-12-10

申请号：US14831163

申请日：2015-08-20

Applicant: Texas Instruments Incorporated

Inventor： Bernardo Gallegos ,  Abram Castro

IPC: H01L21/768 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L21/76858 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4871 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76885 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/03436 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Methods of fabricating integrated circuits are disclosed herein. A die having a side is provided. A conductive stud extends from the side in a direction that is substantially normal to the side. A first dielectric layer is affixed to the side of the die. The first dielectric layer has a first side and a second side. The first side of the first dielectric layer is affixed to the side of the die. The conductive stud pierces the first side of the first dielectric layer. A first via is formed through the first dielectric layer between the conductive stud and the second side. The first via is electrically connected to the conductive stud.

Abstract translation: 本文公开了制造集成电路的方法。 提供具有侧面的模具。 导电螺柱从基本上垂直于侧面的方向从侧面延伸。 第一电介质层固定在模具的侧面。 第一电介质层具有第一侧和第二侧。 第一介电层的第一侧固定在模具的侧面。 导电柱刺穿第一介电层的第一侧。 第一通孔在导电柱和第二侧之间通过第一电介质层形成。 第一通孔电连接到导电柱。

公开(公告)号：US20150037938A1

公开(公告)日：2015-02-05

申请号：US14520406

申请日：2014-10-22

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 将芯片连接到基板上，从芯片到基板的导线被装载在模具的加热空腔中。 线表面涂覆有杂环化合物分子的吸附层。 模具的压力室装有包括可聚合树脂的包装材料的固体颗粒。 腔室连接到腔体。 在加热固体颗粒以使其呈半液体并在填充模腔之前通过流道对其进行加压所需的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，其中树脂分子 通过吸附的杂环化合物分子到达空腔中的电绝缘的至少一层聚合物结构在电线表面上。

公开(公告)号：US20130277825A1

公开(公告)日：2013-10-24

申请号：US13751663

申请日：2013-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/293 ,  H01L21/56 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: The packaging of an electric contact including a semiconductor chip (102) having terminals (101) of a first metal and connecting wires (111, 112) of a second metal, the wires forming at the terminals regions (113) of intermetallic compounds of the first and second metals; a solution of an aromatic azole compound dissolved in ethanol is dispensed onto the surfaces of the wire spans and the intermetallic regions, thereby forming on the surfaces layers (301) of adsorbed molecules of the aromatic azole compound; chip and wire bonds are encapsulated in a polymerizable resin (401), thereby exploiting the adsorbed aromatic azole molecules as catalysts to cross-link resin molecules into polymerized structures (402) having a mesh density capable of inhibiting the diffusion of impurity ions (410) and thus protecting the surface of the intermetallic regions.

Abstract translation: 包括具有第一金属的端子（101）和第二金属的连接线（111,112）的半导体芯片（102）的电接触的包装，在第二金属的金属间化合物的端子区域（113）处形成的电线 第一和第二金属; 将溶解在乙醇中的芳族唑化合物的溶液分配到线跨和金属间区域的表面上，从而在芳族唑化合物的吸附分子的表面（301）上形成; 芯片和引线键被封装在可聚合树脂（401）中，从而利用吸附的芳族唑分子作为催化剂将树脂分子交联成具有能够抑制杂质离子（410）扩散的网孔的聚合结构（402） 从而保护金属间区域的表面。