公开(公告)号：US20070243704A1

公开(公告)日：2007-10-18

申请号：US11634059

申请日：2006-12-06

申请人： Wei-Chang Tai ,  Chi-Chih Chu ,  Meng-Jung Chuang ,  Cheng-Yin Lee ,  Yao-Ting Huang ,  Kuang-Lin Lo

发明人： Wei-Chang Tai ,  Chi-Chih Chu ,  Meng-Jung Chuang ,  Cheng-Yin Lee ,  Yao-Ting Huang ,  Kuang-Lin Lo

IPC分类号： H01L21/44

CPC分类号： H05K3/3452 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2203/0588 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

摘要翻译： 本发明涉及一种具有焊接掩模的基片结构及其制造方法。 该方法包括：（a）提供具有顶表面的基底，顶表面具有管芯焊盘和多个焊盘; （b）在所述顶表面上形成第一焊料掩模，所述第一焊料掩模具有多个开口，每个开口对应于每个焊盘，以暴露所述焊盘的至少一部分; 和（c）在第一焊料掩模上形成第二焊料掩模。 由此，本发明的基板结构可以用于包装较厚的模具，以防止模具裂纹，并避免模塑料的溢流。

公开(公告)号：US07280543B2

公开(公告)日：2007-10-09

申请号：US10226050

申请日：2002-08-23

申请人： Cheng-Yin Lee ,  Amr Elkady

发明人： Cheng-Yin Lee ,  Amr Elkady

IPC分类号： H04L12/28 ,  H04L12/56

CPC分类号： H04L41/00 ,  H04Q3/0025 ,  H04Q11/04 ,  H04Q2213/13034 ,  H04Q2213/13039 ,  H04Q2213/1305 ,  H04Q2213/1307 ,  H04Q2213/13109 ,  H04Q2213/13162 ,  H04Q2213/13176 ,  H04Q2213/13216 ,  H04Q2213/1329 ,  H04Q2213/13292 ,  H04Q2213/13298 ,  H04Q2213/13348 ,  H04Q2213/13349 ,  H04Q2213/13389 ,  H04Q2213/13395

摘要： A method of processing OAM messages by network elements in a communications network is described. Elements in the network are provided with configuration information respecting OAM messages together with connection signaling upon setting up a call through the network. Each network element interprets the OAM messages and derives therefrom configuration information for use in executing an OAM function.

摘要翻译： 描述了通信网络中的网元处理OAM消息的方法。 在通过网络建立呼叫时，网络中的元件被提供有关于OAM消息的配置信息以及连接信令。 每个网络元素解释OAM消息并从中导出用于执行OAM功能的配置信息。

公开(公告)号：US20070090507A1

公开(公告)日：2007-04-26

申请号：US11332293

申请日：2006-01-17

申请人： Chian-Chi Lin ,  Cheng-Yin Lee

发明人： Chian-Chi Lin ,  Cheng-Yin Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip package structure includes a first substrate, a first chip, a sub-package, and a first molding compound. The first substrate has a first surface and a second surface. The first chip is attached to the first surface of the first substrate by flip-chip bonding so as to reduce a step of wire bonding and reduce the total height of the package structure. The sub-package includes a second substrate, a second chip, and a second molding compound. The second substrate has a first surface and a second surface. The second substrate is a flexible substrate and is directly connected to the first surface of the first substrate so as to reduce another step of wire bonding.

摘要翻译： 多芯片封装结构包括第一衬底，第一芯片，子封装和第一模塑料。 第一基板具有第一表面和第二表面。 第一芯片通过倒装芯片接合附接到第一基板的第一表面，以减少引线接合的步骤并降低封装结构的总高度。 子组件包括第二衬底，第二芯片和第二模塑料。 第二基板具有第一表面和第二表面。 第二基板是柔性基板，并且直接连接到第一基板的第一表面，以便减少引线接合的另一步骤。

公开(公告)号：US20060182120A1

公开(公告)日：2006-08-17

申请号：US11058274

申请日：2005-02-16

申请人： Cheng-Yin Lee

发明人： Cheng-Yin Lee

IPC分类号： H04L12/56 ,  H04J3/22 ,  H04L12/28 ,  H04J3/16

CPC分类号： H04L12/4641

摘要： Systems and methods for using VPLS to provide communications between IP devices connected to a provider service network (PSN) by a non-Ethernet access link and IP devices connected to a PSN by an Ethernet access link are described. In accordance with the systems and methods standard IP devices connected to existing and heterogeneous access technologies can communicate with each other as if they were connected to a common LAN segment. In particular the invention relates to the interworking of IP and VPLS.

摘要翻译： 描述了使用VPLS来提供通过非以太网接入链路连接到提供商服务网络（PSN）的IP设备与通过以太网接入链路连接到PSN的IP设备之间的通信的系统和方法。 根据系统和方法，连接到现有和异构接入技术的标准IP设备可以彼此通信，就像它们连接到公共LAN段一样。 特别地，本发明涉及IP和VPLS的互通。

公开(公告)号：US20060140190A1

公开(公告)日：2006-06-29

申请号：US11020503

申请日：2004-12-23

申请人： Cheng-Yin Lee

发明人： Cheng-Yin Lee

IPC分类号： H04L12/56

CPC分类号： H04L45/22 ,  H04L45/04 ,  H04L45/128 ,  H04L45/245 ,  H04L45/28 ,  H04L45/34 ,  Y02D50/30

摘要： A method and apparatus for configuring a communication path which traverses different network domains are provided. A set-up signal for configuring the communication path is generated and includes both an identifier for identifying one or more network resources in one network domain and a domain identifier associated with the resource identifier which identifies the resource(s) as belonging to that network domain. The domain identifier allows resource identifiers unique to one domain to be included in an inter-domain communication path set-up signal. An inter-domain set-up signal may include a group identifier for identifying resources of a primary path in place of a specific identification of each resource.

摘要翻译： 提供一种用于配置穿过不同网络域的通信路径的方法和装置。 生成用于配置通信路径的设置信号，并且包括用于标识一个网络域中的一个或多个网络资源的标识符和与将资源标识为属于该网络域的资源标识符相关联的域标识符 。 域标识符允许将一个域唯一的资源标识符包含在域间通信路径建立信号中。 域间建立信号可以包括用于标识主路径的资源以代替每个资源的特定标识的组标识符。

公开(公告)号：US20060133265A1

公开(公告)日：2006-06-22

申请号：US11020437

申请日：2004-12-22

申请人： Cheng-Yin Lee

发明人： Cheng-Yin Lee

IPC分类号： H04L1/00

CPC分类号： H04L12/4641 ,  H04L63/0272

摘要： Virtual private networking methods and systems are disclosed. A label switched path (LSP) is established between network elements which provide access to different autonomous systems (ASs). A record of resources which are used for the LSP is maintained, and a backup LSP is established between the network elements. The backup LSP excludes resources which were used for the LSP. Labeled routes associated with each AS are then redistributed to the network element within the other AS using the LSP or the backup LSP. In another embodiment, VPN labeled routes used by a first network element in a first AS and belonging to a VPN are aggregated into an aggregated inter-AS VPN labeled route, which is distributed to a second AS and redistributed to a second network element, in the second AS, which belongs to the VPN. A data structure for mapping VPN labeled routes to an aggregated inter-AS labeled route is also disclosed.

摘要翻译： 虚拟专用网络方法和系统被公开。 在提供对不同自治系统（AS）的访问的网元之间建立标签交换路径（LSP）。 维护用于LSP的资源记录，并在网元之间建立备份LSP。 备份LSP不包括用于LSP的资源。 然后使用LSP或备份LSP将与每个AS相关联的标记路由重新分发到其他AS内的网元。 在另一实施例中，由第一AS中的第一网元使用并属于VPN的VPN标记的路由被聚合成聚合的跨AS VPN标记的路由，其被分配到第二AS并重新分发给第二网元 属于VPN的第二个AS。 还公开了用于将VPN标记的路由映射到聚合的跨AS标记路由的数据结构。

公开(公告)号：US20060110849A1

公开(公告)日：2006-05-25

申请号：US11210700

申请日：2005-08-25

申请人： Cheng-Yin Lee ,  Wei-Chang Tai

发明人： Cheng-Yin Lee ,  Wei-Chang Tai

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a method for stacking BGA packages. At first, a first BGA package is provided. The first BGA package includes a first substrate, at least one first chip and a plurality of first connecting balls. The first substrate has a first upper surface and a first bottom surface. The first chip is disposed on the first upper surface. The first connecting balls are disposed on a plurality of first connecting pads of the first upper surface. Then, a second BGA package is provided. The second BGA package includes a second substrate, at least one second chip and a plurality of second connecting balls. The second substrate has a second upper surface and a second bottom surface. The second connecting balls are disposed on a plurality of second connecting pads of the second bottom surface. The second BGA package is stacked on the first BGA package for the second connecting balls to contact the corresponding first connecting balls. Then, the first connecting balls and the corresponding second connecting balls are reflowed into a plurality of integrated spacer balls. The spacer balls connect the first connecting pads and the second connecting pads for providing a stack gap.

摘要翻译： 本发明涉及一种用于堆叠BGA封装的方法。 首先，提供了第一个BGA封装。 第一BGA封装包括第一衬底，至少一个第一芯片和多个第一连接球。 第一基板具有第一上表面和第一底表面。 第一芯片设置在第一上表面上。 第一连接球设置在第一上表面的多个第一连接焊盘上。 然后，提供第二个BGA封装。 第二BGA封装包括第二衬底，至少一个第二芯片和多个第二连接球。 第二基板具有第二上表面和第二底表面。 第二连接球设置在第二底面的多个第二连接垫上。 第二个BGA封装堆叠在第一个BGA封装上，用于第二个连接球接触相应的第一个连接球。 然后，将第一连接球和相应的第二连接球回流到多个集成的间隔球。 间隔球连接第一连接焊盘和第二连接焊盘，以提供堆叠间隙。

公开(公告)号：US20060029033A1

公开(公告)日：2006-02-09

申请号：US10911692

申请日：2004-08-05

申请人： Cheng-Yin Lee

发明人： Cheng-Yin Lee

IPC分类号： H04L12/28

CPC分类号： H04L45/00 ,  H04L45/121 ,  H04L45/124 ,  H04L45/22 ,  H04L45/28 ,  H04L45/302 ,  H04L47/2433

摘要： A method of forwarding traffic in a connectionless communications network from a source location to a destination location. The traffic is associated with a predetermined category of transmission service. The method involves assigning a principal path to the traffic. The principal path operatively connects the source and destination locations. The principal path is determined on the basis that transmission of the traffic from the source location to the destination location does not exceed a specified maximum delay for transmission. An alternate path is also assigned to the traffic. The alternate path is selected on the basis that the alternate path does not exceed a specified maximum delay for involving the alternate path in order to forward the traffic along the alternate path in the event the principal path is unavailable for forwarding the traffic.

摘要翻译： 一种将无连接通信网络中的流量从源位置转发到目的地位置的方法。 流量与预定类别的传输服务相关联。 该方法涉及为流量分配主路径。 主路径可操作地连接源和目的地位置。 主要路径是基于从源位置到目的地位置的业务的传输不超过规定的传输最大延迟的基础。 一个替代路径也被分配给流量。 选择替代路径是基于备用路径不超过用于涉及备用路径的指定的最大延迟，以便在主路径不可用于转发流量的情况下沿着备用路径转发流量。

公开(公告)号：US07719094B2

公开(公告)日：2010-05-18

申请号：US12203314

申请日：2008-09-03

申请人： Chia-Fu Wu ,  Cheng-Yin Lee

发明人： Chia-Fu Wu ,  Cheng-Yin Lee

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/49572 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

摘要翻译： 半导体封装包括引线框，至少一个芯片和封装。 引线框架具有多个引线，并且每个引线包括至少一个第一导电部件，至少一个第二导电部件和至少一个第三导电部件。 第一导电部不与第二导电部电连接，第二导电部与第三导电部电连接。 芯片电连接到第一导电部件。 封装封装芯片和引线框架的至少一部分，并形成与第一表面相对的第一表面和第二表面。 第一导电部分和第三导电部分从第一表面暴露，并且第二导电部分从第二表面露出。

公开(公告)号：US20090091015A1

公开(公告)日：2009-04-09

申请号：US12237035

申请日：2008-09-24

申请人： Chi-Chih Shen ,  Cheng-Yin Lee ,  Wei-Chung Wang

发明人： Chi-Chih Shen ,  Cheng-Yin Lee ,  Wei-Chung Wang

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked-type chip package structure including a first package structure, a second package structure, and a first molding compound is provided. The first package structure includes a first substrate, and a first chip stacked thereon and electrically connected thereto. The second package structure is stacked on the first package structure, and includes a second substrate, a second chip, and a plurality of solder blocks. The second chip is electrically connected to the second substrate, and the second substrate is electrically connected to the first substrate. The second chip is fixed on the first chip through an adhesive layer. The solder blocks are disposed on the back of the second substrate. The first molding compound is disposed on the first substrate and encapsulates the first package structure and the second package structure. The first molding compound has a recess for exposing the solder blocks.

摘要翻译： 提供了包括第一封装结构，第二封装结构和第一模塑料的堆叠型芯片封装结构。 第一封装结构包括第一衬底和堆叠在其上并与其电连接的第一芯片。 第二封装结构堆叠在第一封装结构上，并且包括第二衬底，第二芯片和多个焊料块。 第二芯片电连接到第二基板，第二基板电连接到第一基板。 第二芯片通过粘合剂层固定在第一芯片上。 焊料块设置在第二基板的背面。 第一模塑料被设置在第一衬底上并封装第一封装结构和第二封装结构。 第一模塑料具有用于暴露焊料块的凹部。