公开(公告)号：US20140054074A1

公开(公告)日：2014-02-27

申请号：US13858102

申请日：2013-04-08

申请人： FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. ,  ZHEN DING TECHNOLOGY CO., LTD.

发明人： FU-YUN SHEN ,  ZHI-TIAN WANG ,  BO MING

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K1/092 ,  H05K3/005 ,  H05K3/10 ,  H05K3/281 ,  H05K3/427 ,  H05K2201/0195 ,  H05K2201/09036 ,  H05K2201/09145 ,  Y10T29/49155

摘要： A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

摘要翻译： 印刷电路板包括以上述顺序布置的第一导电电路图案，基底层，粘合片和第二导电电路图案。 印刷电路板包括单层导电电路区域。 粘合片在空间上限定对应于单层导电电路区域的第一开口。 粘合片包括围绕第一开口的第一内侧壁。 第二导电电路图案限定在空间上对应于单层导电电路区域的第二开口。 第二导电电路图案包括围绕第二开口的第二内侧壁。 第一内侧壁和第二内侧壁不是完全共面的。

公开(公告)号：US08648261B2

公开(公告)日：2014-02-11

申请号：US13117159

申请日：2011-05-27

申请人： Feng-Yan Huang

发明人： Feng-Yan Huang

IPC分类号： H05K1/02

CPC分类号： H05K1/0259 ,  H05K1/0218 ,  H05K3/281 ,  H05K3/323 ,  H05K2201/029 ,  H05K2201/0715

摘要： A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth structure comprises an anisotropic conductive adhesive connected to the connecting pad, an insulating layer, and a metallic deposition layer arranged between the anisotropic conductive adhesive and the insulating layer. The shielding structure comprises a shielding metal layer, an adhesive matrix, and a number of electrically conductive particles electrically connected to the shielding metal layer. The insulating layer defines a number of through holes corresponding to the particles, the particles is arranged in the through holes respectively and electrically connected the metallic deposition layer and the shielding metal layer. A method for manufacturing the above PCB is also provided.

摘要翻译： 印刷电路板包括电路基板，导电布结构和屏蔽结构。 电路基板包括形成在接地电路层上的基极层，接地电路层和连接焊盘。 布结构包括连接到连接垫的各向异性导电粘合剂，绝缘层和布置在各向异性导电粘合剂和绝缘层之间的金属沉积层。 屏蔽结构包括屏蔽金属层，粘合剂基质和电连接到屏蔽金属层的多个导电颗粒。 绝缘层限定了与颗粒相对应的多个通孔，颗粒分别布置在通孔中并电连接金属沉积层和屏蔽金属层。 还提供了制造上述PCB的方法。

公开(公告)号：US20140036465A1

公开(公告)日：2014-02-06

申请号：US13863400

申请日：2013-04-16

申请人： ZHEN DING TECHNOLOGY CO., LTD.

发明人： CHU-CHIN HU ,  SHIH-PING HSU ,  E-TUNG CHOU

IPC分类号： H05K1/18 ,  H05K3/40

CPC分类号： H05K1/181 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/0097 ,  H05K3/4038 ,  Y10T29/49165 ,  H01L2924/00014

摘要： A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.

摘要翻译： 封装基板包括铜箔基板，溅射铜层，电介质层，多个导电连接点以及导电图案层。 在铜箔基板上形成溅射铜层。 导电连接点形成在溅射铜层的远离铜箔衬底的表面上。 电介质层夹在导电图案层和溅射铜层之间。 多个第一通孔形成在第一电介质层中。 导电图案层包括多个导电迹线和多个连接焊盘。 每个导电连接点通过第一盲通孔电连接到导电迹线。

公开(公告)号：US08591692B2

公开(公告)日：2013-11-26

申请号：US13207438

申请日：2011-08-11

申请人： Ming-De Wang ,  Li Huang

发明人： Ming-De Wang ,  Li Huang

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H05K3/4691 ,  H05K3/4652 ,  H05K2201/09127 ,  H05K2203/1461

摘要： A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate.

摘要翻译： 用于制造刚挠柔性印刷电路板的方法包括一些步骤。 提供了包括暴露部分和附接部分的柔性基板。 提供限定开口的粘合片和刚性覆铜层压板。 刚性覆铜层压板包括绝缘层和铜层。 在绝缘层中限定盲目的第一狭缝。 层压柔性基板，粘合片和覆铜层压板。 在铜层中形成外部电路。 在覆铜层压板中限定第二狭缝，并且第二狭缝与第一狭缝连通。 去除覆铜层压板的一部分以暴露柔性基板的柔性部分。

公开(公告)号：US20130220683A1

公开(公告)日：2013-08-29

申请号：US13537073

申请日：2012-06-29

申请人： ZONG-QING CAI

发明人： ZONG-QING CAI

IPC分类号： H05K1/09 ,  H05K3/12 ,  H05K3/02

CPC分类号： H05K3/4652 ,  H05K2201/09227 ,  H05K2201/09881 ,  H05K2201/09909 ,  Y10T29/49156

摘要： A printed circuit board includes an inner substrate, a stuffing layer, an adhesive layer and a plurality of second copper trace layer. The inner substrate includes an insulating layer and an copper trace layer formed on a surface of the insulating layer. The first surface includes a low copper density region. In the low copper density region, the area of first surface covered by the copper trace layer is less than 60 percent of the area of the low copper density region. The stuffing layer is only formed on the first inner substrate in the region. The present disclosure also provides a method for manufacturing the printed circuit board.

摘要翻译： 印刷电路板包括内基板，填充层，粘合层和多个第二铜迹线层。 内部基板包括形成在绝缘层的表面上的绝缘层和铜迹线层。 第一表面包括低铜密度区域。 在低铜密度区域中，由铜迹线层覆盖的第一表面的面积小于低铜密度区域的面积的60％。 填充层仅形成在该区域中的第一内基板上。 本公开还提供了一种用于制造印刷电路板的方法。

公开(公告)号：US08516694B2

公开(公告)日：2013-08-27

申请号：US13091152

申请日：2011-04-21

申请人： Xue-Jun Cai ,  Zhi-Yong Li

发明人： Xue-Jun Cai ,  Zhi-Yong Li

IPC分类号： H01K3/10

CPC分类号： H05K3/4697 ,  H05K2201/09127 ,  H05K2203/013 ,  H05K2203/308

摘要： A method for manufacturing printed circuit board includes steps below. An inner substrate including a first electrically conductive layer is provided. A first electrically conductive pattern is formed in the first electrically conductive layer. The first electrically conductive pattern includes an exposed region and an attaching region. A protective layer is formed on the entire exposed region. A first adhesive layer and a second electrically conductive layer are laminated on a surface of the first electrically conductive pattern in the attaching region and a surface of the protective layer. A slit along a boundary of the exposed region passing through the second electrically conductive pattern and the first adhesive layer is defined. The second electrically conductive layer corresponding to the exposed region, the first adhesive layer corresponding to the exposed region and the protective layer is removed.

摘要翻译： 制造印刷电路板的方法包括以下步骤。 提供了包括第一导电层的内基板。 在第一导电层中形成第一导电图案。 第一导电图案包括曝光区域和附着区域。 在整个曝光区域上形成保护层。 第一粘合剂层和第二导电层层叠在附着区域中的第一导电图案的表面和保护层的表面上。 限定通过第二导电图案和第一粘合剂层的暴露区域的边界的狭缝。 对应于暴露区域的第二导电层，对应于暴露区域的第一粘合剂层和保护层被去除。

公开(公告)号：US08453324B2

公开(公告)日：2013-06-04

申请号：US13306811

申请日：2011-11-29

申请人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

发明人： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC分类号： H01K3/10

CPC分类号： H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

摘要翻译： FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

公开(公告)号：US08453321B2

公开(公告)日：2013-06-04

申请号：US13164776

申请日：2011-06-21

申请人： Jun-Qing Zhang ,  Chih-Yi Tu ,  Szu-Min Huang

发明人： Jun-Qing Zhang ,  Chih-Yi Tu ,  Szu-Min Huang

IPC分类号： H05K3/46

CPC分类号： H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

摘要翻译： 一种制造多层FPCB的方法，包括提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的所述导电层中形成第二狭缝，所述第二狭缝被形成为与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板 的层次在不同的地区。

公开(公告)号：US08448571B2

公开(公告)日：2013-05-28

申请号：US13171464

申请日：2011-06-29

申请人： Xiao-Fei Zheng

发明人： Xiao-Fei Zheng

IPC分类号： B41M1/12 ,  B41C1/14 ,  B41L13/00 ,  H05K1/03

CPC分类号： H05K3/1216 ,  H05K1/0269 ,  H05K2201/09936 ,  H05K2203/166

摘要： A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen Si+1 so as to form an (i+1)th printing pattern on the copper foil layer and covers the (i+1)th Mark Mi+1 at the (i+1)th opening, if the ith mark is covered by the printing material.

摘要翻译： 丝网印刷印刷电路板基板的方法包括以下步骤。 提供了包括铜箔层的印刷电路板基板。 在铜箔层上形成多个标记。 提供了多个印刷屏幕，每个印刷屏幕包括一个屏幕图案和一个对应于相应标记的开口。 打印材料应用于第i个屏幕Si上，形成第i个印刷图案，并在第i个开口处覆盖第i个印记，第i个打印图案符合第i个屏幕图案; 检查当i小于N时第i个标记是否被打印材料覆盖。在第（i + 1）个屏幕Si + 1上施加印刷材料，以便在铜上形成第（i + 1）印刷图案 如果第i个标记被打印材料覆盖，则在第（i + 1）个开口处覆盖第（i + 1）个Mark Mi + 1。

公开(公告)号：US08377317B2

公开(公告)日：2013-02-19

申请号：US12853304

申请日：2010-08-10

申请人： Yao-Wen Bai ,  Pan Tang ,  Xiao-Ping Li

发明人： Yao-Wen Bai ,  Pan Tang ,  Xiao-Ping Li

IPC分类号： H01B13/00

CPC分类号： H05K3/00

摘要： A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.

摘要翻译： 制造印刷电路板的方法包括以下步骤。 提供了包括与第一表面相对的第一表面和第二表面的第一导电层。 直接形成在第二表面上的多个第一迹线。 第一绝缘层形成在第一导电层的第二表面和第一迹线的表面上。 蚀刻导电层以形成多个第二迹线，第二迹线叠加第一迹线，第一迹线和第二迹线构成电路图案。