Abstract:
The instant invention relates to a method for changing characteristics of a plastic component, wherein a medium is introduced into the plastic component, which encompasses a porosity and wherein the medium forms a homogenous compound with the plastic component by at least partially dissolving the plastic component.
Abstract:
Exemplary pressurization and coating systems, methods, and apparatuses are described herein. In certain embodiments, pressurization systems, methods, and apparatuses are used in conjunction with coating systems, methods, and apparatuses to control pressure about a substrate after a coating material is applied to a surface of the substrate. An exemplary system includes a die tool configured to apply a coating material to a substrate passing through the die tool and a pressurization apparatus attached to the die tool and forming a pressurization chamber. The pressurization apparatus is configured to receive the substrate from the die tool and control pressure about the substrate in the pressurization chamber. In certain embodiments, the die tool forms a coating chamber and is configured to apply the coating material on at least one surface of the substrate in the coating chamber.
Abstract:
A semi-automated coating system for providing medical devices with antimicrobial coatings is disclosed. The semi-automated coating system extends the coating solution's usable life span by minimizing exposure to light, air and temperature extremes. Moreover, the disclosed semi-automated coating system minimizes operator and environmental exposure to the coating solutions. Methods disclose techniques for preparing coating solutions, setting up the coating system and operating the device. Moreover, the systems and methods described herein minimize operator intervention with the coating processes and provide superior product consistency.
Abstract:
A semi-automated coating system for providing medical devices with antimicrobial coatings is disclosed. The semi-automated coating system extends the coating solution's usable life span by minimizing exposure to light, air and temperature extremes. Moreover, the disclosed semi-automated coating system minimizes operator and environmental exposure to the coating solutions. Methods for coating medical devices using the semi-automated coating system are also provided. The methods disclose techniques for preparing coating solutions, setting up the coating system and operating the device. Moreover, the systems and methods described herein minimize operator intervention with the coating processes and provide superior product consistency.
Abstract:
A semi-automated coating system for providing medical devices with antimicrobial coatings is disclosed. The semi-automated coating system extends the coating solution's usable life span by minimizing exposure to light, air and temperature extremes. Moreover, the disclosed semi-automated coating system minimizes operator and environmental exposure to the coating solutions. Methods disclose techniques for preparing coating solutions, setting up the coating system and operating the device. Moreover, the systems and methods described herein minimize operator intervention with the coating processes and provide superior product consistency.
Abstract:
A gas-tight oven containing an adhesive well in external contact with tape to be coated and in internal communication with the oven atmosphere. Heating the oven reduces adhesive viscosity and increases pressure, forcing adhesive into contact with moving tape. Parts requiring frequent cleaning such as doctor blades, adhesive rollers or the like are eliminated. An alternative embodiment utilizes an external source of pressure.
Abstract:
The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:
Providing a substrate with a substrate surface comprising at least one recess, applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and plating the recess.
Abstract:
A device and method is provided for treating surfaces, in particular for colouring moulded parts, said device comprising a container for receiving moulded parts and a first cover. The container can be closed, preferably, by using the first cover. A system is also provided for introducing liquid and/or powdery surface treatment agents into an inner chamber of the closed container. The system comprises a capsule in which the surface treatment agents which are to be introduced are accommodated.
Abstract:
A device for metal coating of fibers, for example ceramic fibers, by a liquid process, the device including a crucible containing a liquid metal bath through which a fiber is drawn to be coated with the metal, and a cooling system positioned downstream from the metal bath to solidify the metal sheath created around the fiber by capillarity. The cooling system includes at least one nozzle for ejecting a compressed gas towards the coated fiber, and the system is sized such as to solidify the metal on the periphery of the coated fiber over a length of no more than 200 mm.
Abstract:
A substrate processing apparatus includes one or more substrate processing units 11 to 18 each processing a substrate 3 with a processing fluid; processing fluid supply units 19 and 20 supplying the heated processing fluid to the substrate processing units 11 to 18; and a controller 21 controlling the processing fluid supply units 19 and 20. The processing fluid supply units 19 and 20 include a storage tank 35 storing the processing fluid; a heating heat exchanger 51 heating the processing fluid; and a supply path 52 supplying the processing fluid to the substrate processing units 11 to 18. The supply path 52 includes a bypass path 71 bypassing the heating heat exchanger 51 at an upstream of the substrate processing units 11 to 18. The processing fluid heated by the heating heat exchanger 51 and the processing fluid supplied from the bypass path 71 are mixed to be supplied.