公开(公告)号：US20090122432A1

公开(公告)日：2009-05-14

申请号：US12269099

申请日：2008-11-12

Applicant: Naoki KIKUCHI ,  Eiichi ITO ,  Jun MIZUNO

Inventor： Naoki KIKUCHI ,  Eiichi ITO ,  Jun MIZUNO

IPC: G02B7/182 ,  B44C1/22

CPC classification number: B81C3/002 ,  B81B2201/045

Abstract: A micro-device includes a frame configured to form a cavity surrounded thereby, the frame having a first opening and a second opening opposite to the first opening, a movable portion provided in the cavity, a supporting portion configured to support the movable portion in the cavity, a first sealing member configured to be bonded with the frame and to seal the first opening of the frame, and a second sealing member configured to be bonded with the frame and to seal the second opening of the frame. The frame includes an alignment structure configured to align at least one of the first sealing member and the second sealing member relative to the frame.

Abstract translation: 微型装置包括构造成形成由其包围的空腔的框架，框架具有第一开口和与第一开口相对的第二开口，设置在空腔中的可移动部分，支撑部分，其构造成将活动部分支撑在 空腔，构造成与框架结合并密封框架的第一开口的第一密封构件和构造成与框架结合并密封框架的第二开口的第二密封构件。 框架包括对准结构，其构造成相对于框架对准第一密封构件和第二密封构件中的至少一个。

公开(公告)号：US20090097095A1

公开(公告)日：2009-04-16

申请号：US11870465

申请日：2007-10-11

Applicant: John N. Border ,  Herbert James Erhardt ,  J. Kelly Lee ,  Marek W. Kowarz

Inventor： John N. Border ,  Herbert James Erhardt ,  J. Kelly Lee ,  Marek W. Kowarz

IPC: G02F1/03

CPC classification number: B81B7/04 ,  B81B2201/045 ,  G02B26/02 ,  G02B26/0841

Abstract: A microshutter array has a frame having a light transmissive portion. Linear microshutter elements extend across the light transmissive portion and in parallel to each other. Each microshutter element has a flat blade extended in a length direction and first and second torsion arms extending outwards from each side of the blade in the length direction, the blade extending across the light transmissive portion. There is at least one electrode associated with each linear microshutter element and extended in the length direction parallel to the microshutter element.

Abstract translation: 微型扫描器阵列具有具有透光部分的框架。 线性微型振荡器元件延伸穿过光透射部分并且彼此平行。 每个微型振动元件具有在长度方向上延伸的平坦叶片，并且第一和第二扭转臂在长度方向上从叶片的每侧向外延伸，叶片延伸穿过透光部分。 至少有一个电极与每个线性微型切割器元件相关联并且在长度方向上平行于微型振动器元件延伸。

公开(公告)号：US07422928B2

公开(公告)日：2008-09-09

申请号：US10572554

申请日：2004-09-12

Applicant: Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

Inventor： Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

IPC: H01L21/00 ,  H02N1/00

CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

Abstract: A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

Abstract translation: 一种用于制造由固定地支撑在下基板上的固定部件和可移动地支撑在下基板上的可移动部件的微机电系统（MEMS）的制造方法。 该方法利用与下基板分开的上基板。 在其顶层中选择性地蚀刻上基板，以在其中形成多个从上基板的底层共同突出的柱。 支柱包括要固定到下基板的固定部件和仅弹性地支撑到一个或多个固定部件以相对于固定部件可移动的可动部件。 下基板在其顶表面上形成有至少一个凹部。 然后将上基板以这样的方式上下连接到下基板的顶部，以将固定部件直接放置在下基板上并将可移动部件放置在凹部的上方。 最后，去除上基板的底层以从底层释放可移动部件，用于使可移动部件浮动在凹部上方并允许​​它们相对于下基板移动，同时保持固定部件固定在 下基板。

公开(公告)号：US07399652B2

公开(公告)日：2008-07-15

申请号：US10821263

申请日：2004-04-08

Applicant: Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

Inventor： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC: H01L21/58

CPC classification number: H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

Abstract translation: 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一半导体材料层的第一半导体晶片和配置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20070068308A1

公开(公告)日：2007-03-29

申请号：US11233197

申请日：2005-09-22

Applicant: Dennis Greywall

Inventor： Dennis Greywall

IPC: G05G11/00

CPC classification number: G02B26/0841 ,  B81B3/004 ,  B81B2201/045 ,  B81B2203/058 ,  Y10T74/2036

Abstract: A rigid actuator arm is an appendage of a moveable drive plate that is coupled across at least one end of each of two deformable spring bars that are anchored at their opposite end to a support structure that keeps the end of the moveable drive plate that is not coupled to the to the deformable spring bars from touching the substrate. The moveable drive plate mates with an opposing fixed drive plate so that applying a potential difference between the moveable drive plate and the fixed drive plate causes the moveable drive plate to move toward the fixed drive plate with a rotation type motion. The rigid actuator arm likewise rotates about an axis that is through the point of attachment of the rigid actuator to the moveable drive plate. Consequently, the opposite end of the rigid actuator arm moves as well, with an amplification of the rotation motion.

Abstract translation: 刚性致动器臂是可移动驱动板的附件，其连接在两个可变形弹簧杆中的每一个的至少一端上，所述两个可变形弹簧杆的相对端固定在支撑结构上，所述支撑结构保持可移动驱动板的端部不是 耦合到可变形弹簧杆以接触基板。 可移动驱动板与相对的固定驱动板配合，使得可移动驱动板和固定驱动板之间施加电位差使得可动驱动板以旋转型运动朝向固定驱动板移动。 刚性致动器臂同样围绕通过刚性致动器的附接点到可移动驱动板的轴线旋转。 因此，刚性致动器臂的相对端也随着旋转运动的放大而移动。

公开(公告)号：US07189625B2

公开(公告)日：2007-03-13

申请号：US11243550

申请日：2005-10-04

Applicant: Hiromu Ishii ,  Yasuyuki Tanabe ,  Katsuyuki Machida ,  Masami Urano ,  Shouji Yagi ,  Tomomi Sakata

Inventor： Hiromu Ishii ,  Yasuyuki Tanabe ,  Katsuyuki Machida ,  Masami Urano ,  Shouji Yagi ,  Tomomi Sakata

IPC: H01L21/20 ,  H01L21/469 ,  H01L29/82

CPC classification number: B81B3/0008 ,  B81B2201/045 ,  B81C2201/112

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract translation: 在根据本发明的微型机器中，在每个电极的表面上形成聚酰亚胺膜。 聚酰亚胺膜如下形成。 将具有每个电极和反电极的基板浸渍在电沉积聚酰亚胺溶液中，并向电极施加正电压。 溶解在电沉积聚酰亚胺溶液中的材料沉积在暴露在溶液中的正电压施加电极的表面上，从而在表面上形成聚酰亚胺膜。

公开(公告)号：US20070041682A1

公开(公告)日：2007-02-22

申请号：US10953619

申请日：2004-09-28

Applicant: Shinichi Takeuchi ,  Tsuyoshi Yamamoto

Inventor： Shinichi Takeuchi ,  Tsuyoshi Yamamoto

IPC: G02B6/26

CPC classification number: G02B26/0833 ,  B81B3/004 ,  B81B7/0003 ,  B81B2201/045 ,  G02B6/3518 ,  G02B6/3556 ,  G02B6/3566 ,  G02B6/3584

Abstract: The micro mirror unit includes a substrate, on which are provided a micro mirror reflecting light, a torsion bar supporting the micro mirror, a frame rotatably supporting the torsion bar, and a deformative supporting part which deforms itself to lift the frame away from the substrate and supports the frame in such a lifted condition. This arrangement makes it possible to realize an increased space between the micro mirror and the substrate, thereby realizing an enlarged mirror tilt angel, without increasing the thickness of the sacrifice layer.

Abstract translation: 微反射镜单元包括：基板，在其上设置有反光镜的微反射镜，支撑微反射镜的扭力杆，可旋转地支撑扭杆的框架，以及变形支撑部件，其自身变形以使框架远离基板 并在这种提升状态下支撑框架。 这种布置使得可以实现微反射镜和基板之间的增加的空间，从而实现放大的反射镜倾斜角，而不增加牺牲层的厚度。

公开(公告)号：US20060279169A1

公开(公告)日：2006-12-14

申请号：US11443471

申请日：2006-05-30

Applicant: Mitsuhiro Yoda ,  Keiji Isamoto ,  Hiroshi Toshiyoshi

Inventor： Mitsuhiro Yoda ,  Keiji Isamoto ,  Hiroshi Toshiyoshi

IPC: G02B26/08 ,  H02N1/00

CPC classification number: B81B3/004 ,  B81B2201/042 ,  B81B2201/045 ,  H02N1/008

Abstract: An actuator that can be driven at a reduced voltage and manufactured with ease, and a method for manufacturing the same are provided. The actuator includes second supporting portions 31 and 32 secured to a supporting substrate 4 through a spacer, fixed portions 33 and 34 secured to the supporting substrate 4 with no intervention of the spacer, fixed comb electrodes 331 and 341 integrally formed the fixed portions 33 and 34 and meshing with movable comb electrodes 211 and 212 in a spaced-apart relationship, and bridge portions 35 and 36 for connecting the fixed portions 33 and 34 to the second supporting portions 31 and 32. The fixed portions 33 and 34 are affixed to the supporting substrate 4 in a condition that they are deflected toward the supporting substrate 4 with respect to the second supporting portions 31 and 32 while bending the bridge portions 35 and 36, thereby initially deflecting the fixed comb electrodes 331 and 341 so as to be out of alignment with the movable comb electrodes 211 and 212 in a thickness direction of the supporting substrate 4.

Abstract translation: 提供能够以降低的电压驱动并且容易制造的致动器及其制造方法。 致动器包括通过间隔件固定到支撑基板4的第二支撑部分31和32，固定在支撑基板4上的固定部分33和34，而不需要间隔件，固定梳状电极331和341一体地形成固定部分33和 并且与间隔开的可动梳状电极211和212啮合，以及用于将固定部分33和34连接到第二支撑部分31和32的桥接部分35和36。 固定部分33和34在弯曲桥接部分35和36的同时相对于第二支撑部分31和32偏转到支撑基板4的状态被固定到支撑基板4上，从而使固定的梳子 电极331和341在支撑基板4的厚度方向上与可动梳状电极211和212不对准。

公开(公告)号：US20050266598A1

公开(公告)日：2005-12-01

申请号：US11134521

申请日：2005-05-23

Applicant: Jong-pal Kim ,  Sang-woo Lee ,  Byeung-Leul Lee

Inventor： Jong-pal Kim ,  Sang-woo Lee ,  Byeung-Leul Lee

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G02B26/08 ,  H01L21/00

CPC classification number: B81C1/00626 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81C2201/014 ,  G01P15/0802 ,  G01P15/125 ,  G02B26/0841

Abstract: A method for fabricating a vertical offset structure that forms a complete vertical offset on a wafer includes a first trench forming step of forming first trenches on a wafer; a first etching step of performing a first patterning for determining etching positions of second and third trenches by depositing a first thin film on the wafer, performing a second patterning for temporarily protecting the etching position of the third trench by depositing a second thin film on the first thin film and the wafer, and then forming the second trenches by etching the wafer; a second etching step of forming a protection layer on side surfaces of the second trenches and then vertically extending the second trenches by etching the wafer; a third etching step of removing the second thin film and then forming the third trench by etching a position from which the second thin film is removed; and a fourth etching step of horizontally extending the second trenches vertically extended at the second etching step and the third trench by etching the wafer.

Abstract translation: 用于制造在晶片上形成完整的垂直偏移的垂直偏移结构的方法包括在晶片上形成第一沟槽的第一沟槽形成步骤; 第一蚀刻步骤，通过在晶片上沉积第一薄膜来执行用于确定第二和第三沟槽的蚀刻位置的第一图案化，执行用于暂时保护第三沟槽的蚀刻位置的第二图案化， 第一薄膜和晶片，然后通过蚀刻晶片形成第二沟槽; 第二蚀刻步骤，在所述第二沟槽的侧表面上形成保护层，然后通过蚀刻所述晶片垂直延伸所述第二沟槽; 第三蚀刻步骤，通过蚀刻除去第二薄膜的位置来去除第二薄膜，然后形成第三沟槽; 以及第四蚀刻步骤，通过蚀刻晶片水平延伸在第二蚀刻步骤和第三沟槽处垂直延伸的第二沟槽。

公开(公告)号：US06967760B2

公开(公告)日：2005-11-22

申请号：US10703827

申请日：2003-11-07

Applicant: James A. Hunter

Inventor： James A. Hunter

IPC: G02B5/18 ,  G02B26/00 ,  G02B26/08 ,  G02F1/00 ,  G02F1/03 ,  G02F1/07 ,  G02F1/13 ,  G02F1/1368 ,  H01L21/00 ,  H01L21/28 ,  H01L21/302 ,  H01L21/82 ,  H01L21/8234 ,  H01L27/06 ,  H01L29/423 ,  H01L29/49 ,  H01L31/153

CPC classification number: G02B26/0808 ,  B81B2201/045 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2201/016 ,  B81C2203/0735 ,  B81C2203/0778 ,  H01L27/0611

Abstract: An integrated device including one or more device drivers and a diffractive light modulator monolithically coupled to the one or more driver circuits. The one or more driver circuits are configured to process received control signals and to transmit the processed control signals to the diffractive light modulator. A method of fabricating the integrated device preferably comprises fabricating a front-end portion for each of a plurality of transistors, isolating the front-end portions of the plurality of transistors, fabricating a front-end portion of a diffractive light modulator, isolating the front end portion of the diffractive light modulator, fabricating interconnects for the plurality of transistors, applying an open array mask and wet etch to access the diffractive light modulator, and fabricating a back-end portion of the diffractive light modulator, thereby monolithically coupling the diffractive light modulator and the plurality of transistors.

Abstract translation: 包括一个或多个器件驱动器和单片耦合到所述一个或多个驱动器电路的衍射光调制器的集成器件。 一个或多个驱动器电路被配置为处理接收到的控制信号并将经处理的控制信号传送到衍射光调制器。 一种制造集成器件的方法优选包括制造用于多个晶体管中的每一个晶体管的前端部分，隔离多个晶体管的前端部分，制造衍射光调制器的前端部分，将前部 衍射光调制器的端部，制造用于多个晶体管的互连，施加开放阵列掩模和湿蚀刻以访问衍射光调制器，以及制造衍射光调制器的后端部分，从而将衍射光 调制器和多个晶体管。