摘要:
A method of manufacturing a semiconductor device includes forming at least one sacrificial layer on a substrate during a complementary metal-oxide-semiconductor (CMOS) process. An absorber layer is deposited on top of the at least one sacrificial layer. A portion of the at least one sacrificial layer beneath the absorber layer is removed to form a gap over which a portion of the absorber layer is suspended. The sacrificial layer can be an oxide of the CMOS process with the oxide being removed to form the gap using a selective hydrofluoric acid vapor dry etch release process. The sacrificial layer can also be a polymer layer with the polymer layer being removed to form the gap using an O2 plasma etching process.
摘要:
Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.
摘要:
An infrared sensing element is provided and includes a substrate, a supporting electrical insulating layer formed on the substrate; a first electrode formed on the supporting electrical insulating layer, a pyroelectric layer formed on the first electrode, and a second electrode formed on the pyroelectric layer. The pyroelectric layer has a light receiving area of 1×102 to 1×104 μm2, has a thickness of 0.8 to 10 μm, and contains therein a compound expressed as Pb(ZrxTi1-x)O3, where 0.57
摘要翻译:提供一种红外感测元件,包括:基板,形成在基板上的支撑电绝缘层; 形成在支撑电绝缘层上的第一电极,形成在第一电极上的热电层和形成在热电层上的第二电极。 热电层的光接收面积为1×102〜1×104μm2,厚度为0.8〜10μm,其中含有表示为Pb(Zr x Ti 1-x)O 3的化合物,其中0.57
摘要:
The invention provides a sensor including a first sensor element formed in a first substrate and at least one optical element formed in a second substrate, the first and second substrates being configured relative to one another such that the second substrate forms a cap over the first sensor element. The cap includes a diffractive optical element and an aperture stop which collectively determine the wavelength of incident radiation that is allowed through the cap and onto the at least one optical element.
摘要:
An infrared ray detection device has a detection cell which has a thermoelectric converting part and an infrared ray absorption layer formed via a space on a semiconductor substrate, a first wiring part formed on the semiconductor substrate, and a supporting part, the detection cell being formed via the space on the semiconductor substrate and supports the detection cell. The supporting part includes a plurality of supporting legs which have a second wiring part electrically connecting the first wiring part to the detection cell and an insulating part covering a surrounding are of the second wiring part, and at least one connection part made of an insulating material connecting the plurality of supporting legs to each other.
摘要:
An infrared photosensitive area is constituted by an infrared ray absorbing part that is heated by infrared rays, a thermal detector that detects the temperature change of the infrared ray absorbing part, and electrodes that are electrically connected to the thermal detector. The infrared photosensitive area is held up above one surface of a substrate by supports. The electrodes of the infrared photosensitive area are electrically connected to contact pads on the substrate by wiring material that constitutes the support. A shield projects from portions of the infrared ray absorbing part other than portions that correspond to the electrodes. The contact pads of the substrate and the surfaces of the electrodes and the supports that are directed away from the substrate are covered by the shield with an interposed space. This configuration enables an increase in the fill factor of the picture elements of the thermal infrared detector and enables greater absorption of infrared light.
摘要:
An infrared photosensitive area is constituted by an infrared ray absorbing part that is heated by infrared rays, a thermal detector that detects the temperature change of the infrared ray absorbing part, and electrodes that are electrically connected to the thermal detector. The infrared photosensitive area is held up above one surface of a substrate by supports. The electrodes of the infrared photosensitive area are electrically connected to contact pads on the substrate by wiring material that constitutes the support. A shield projects from portions of the infrared ray absorbing part other than portions that correspond to the electrodes. The contact pads of the substrate and the surfaces of the electrodes and the supports that are directed away from the substrate are covered by the shield with an interposed space. This configuration enables an increase in the fill factor of the picture elements of the thermal infrared detector and enables greater absorption of infrared light.
摘要:
An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.
摘要:
A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate.
摘要:
The invention refers to an electromagnetic radiation sensor micro device for detecting electromagnetic radiation, which device comprises a substrate and a cover at least in part consisting of an electromagnetic radiation transparent material, and comprising a reflection reducing coating and providing a hermetic sealed cavity and an electromagnetic radiation detecting unit arranged within the cavity. The reflection reducing coating is arranged in form of a multi-layer thin film stack, which comprises a first layer and a second layer arranged one upon the other. The first layer has a first refractive index and the second layer has a second refractive index different from the one of said first layer. First and second layer are of such layer thickness that for a certain wavelength there is destructive interference. The invention also refers to a wafer element as well as method for manufacturing such a device.