公开(公告)号：US11881344B2

公开(公告)日：2024-01-23

申请号：US18117374

申请日：2023-03-03

Applicant: Delta Electronics, Inc.

Inventor： Yahong Xiong ,  Da Jin ,  Qinghua Su

IPC: H05K1/14 ,  H01F27/28 ,  G05F1/575 ,  H01F27/02 ,  H01F27/29 ,  G06F1/18 ,  H01F17/04 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/158 ,  H05K1/11 ,  H01F17/06 ,  H02M3/00 ,  H01F27/24 ,  H05K3/28

CPC classification number: H01F27/2804 ,  G05F1/575 ,  G06F1/183 ,  H01F17/04 ,  H01F17/06 ,  H01F27/02 ,  H01F27/24 ,  H01F27/292 ,  H01L25/16 ,  H01R12/52 ,  H01R12/58 ,  H02M3/003 ,  H02M3/1584 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/117 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/186 ,  H05K3/284 ,  H05K7/1427 ,  H05K7/2089 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

公开(公告)号：US20240021374A1

公开(公告)日：2024-01-18

申请号：US18036426

申请日：2021-10-19

Applicant: XIAMEN FARATROINIC CO., LTD.

Inventor： Jintao LIN ,  Shaohan LAN ,  Wengang ZHANG

IPC: H01G4/224 ,  H01G4/33 ,  H05K1/18

CPC classification number: H01G4/224 ,  H01G4/33 ,  H05K1/18 ,  H05K2201/10015

Abstract: A thin-film capacitor core that has a core body, a covering film and a sprayed metal coating provided at two ends of the core body to form electrodes. The covering film is wound around an outer circumferential surface of the core body; the covering film has a base film and a waterproof layer attached to the base film. A waterproof covering process for the thin-film capacitor core can be performed by means of winding using a winding machine for producing a core body, such that on the premise of ensuring production efficiency of the thin-film capacitor core, the moisture resistance of the thin-film capacitor core is improved. A thin-film capacitor loaded with the thin-film capacitor core, and a printed circuit board loaded with the thin-film capacitor are also provided.

公开(公告)号：US11870412B2

公开(公告)日：2024-01-09

申请号：US17460412

申请日：2021-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Toujo

IPC: H03H7/01 ,  H01F27/28 ,  H01F27/29 ,  H01G4/30 ,  H05K1/18 ,  H03H1/00

CPC classification number: H03H7/0115 ,  H01F27/2804 ,  H01F27/29 ,  H01G4/30 ,  H05K1/181 ,  H03H2001/0085 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10015

Abstract: A multilayer substrate includes a multilayer body, an internal wire, land electrodes, and a ground electrode. The internal wire extends toward the land electrode from a position where the internal wire overlaps the land electrode when viewed from a first surface and is electrically connected to the land electrode by a via conductor. The internal wire is electrically connected to the ground electrode by a via conductor that is provided in a region from a position where a capacitor is located where the via conductor at least partially overlaps the land electrode when viewed from the first surface.

公开(公告)号：US11856700B2

公开(公告)日：2023-12-26

申请号：US17225209

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chunghyun Ryu ,  Byungok Kang ,  Su-Yong An ,  Jongwoo Jang ,  Insub Kwak ,  Teck Su Oh ,  Geurim Jung ,  Sang-Ho Park ,  Sung-Ki Lee

IPC: H01G9/08 ,  H05K1/18 ,  H01G9/008 ,  H01G9/045

CPC classification number: H05K1/182 ,  H01G9/08 ,  H01G9/008 ,  H01G9/045 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10015

Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.

公开(公告)号：US20230411365A1

公开(公告)日：2023-12-21

申请号：US18462259

申请日：2023-09-06

Applicant: NVIDIA Corp.

Inventor： Shuo Zhang ,  Eric Zhu ,  Minto Zheng ,  Michael Zhai ,  Town Zhang ,  Jie Ma

IPC: H01L25/10 ,  H01L25/16 ,  H01L23/538 ,  H05K1/18

CPC classification number: H01L25/105 ,  H01L25/16 ,  H01L23/5386 ,  H05K1/181 ,  H01L2225/1094 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10704 ,  H01L2225/107 ,  H05K2201/10015

Abstract: Layout techniques for circuits on substrates are disclosed that address the multivariate problem of minimizing routing distances for high-speed I/O pins between circuits while simultaneously providing for the rapid provision of transient power demands to the circuits. The layout techniques may also enable improved thermal management for the circuits.

公开(公告)号：US20230403785A1

公开(公告)日：2023-12-14

申请号：US18267115

申请日：2021-03-09

Applicant: Mitsubishi Electric Corporation

Inventor： Masatoshi TOYONAGA ,  Satoru ISHIZAKA

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/0233 ,  H05K1/0225 ,  H05K2201/10015 ,  H05K2201/1006

Abstract: In a circuit board (700A), a first capacitor (410) extends from a wiring pattern (110) to a region located on one side of the wiring pattern (110) in the width direction. A second capacitor (420) extends from the wiring pattern (110) to a region located on the other side of the wiring pattern (110) in the width direction. With a semiconductor device (300) mounted on the circuit board (700A), a power supply terminal (320) is electrically connected to the wiring pattern (110). The semiconductor device (300), the wiring pattern (110), the first capacitor (410), a first interlayer joint (510), a ground plane (210), and a third interlayer joint (530) constitute a first closed circuit. The semiconductor device (300), the wiring pattern (110), the second capacitor (420), a second interlayer joint (520), the ground plane (210), and the third interlayer joint (530) constitute a second closed circuit.

公开(公告)号：US20230386742A1

公开(公告)日：2023-11-30

申请号：US18232050

申请日：2023-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： A Ra Cho ,  Dong Hwi Shin ,  Seon Young Yoo

IPC: H01G4/008 ,  H05K1/11 ,  H01G4/30 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/008 ,  H05K1/111 ,  H01G4/30 ,  H01G4/232 ,  H05K1/181 ,  H05K2201/10015

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.

公开(公告)号：US11818844B2

公开(公告)日：2023-11-14

申请号：US17826013

申请日：2022-05-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yuya Karakawa ,  Mitsutoshi Hasegawa ,  Takashi Aoki ,  Noritake Tsuboi

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L23/49816 ,  H05K3/3452 ,  H05K3/3485 ,  H05K1/148 ,  H05K2201/0989 ,  H05K2201/10015 ,  H05K2201/1053 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/048 ,  H05K2203/306

Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

公开(公告)号：US20230345639A1

公开(公告)日：2023-10-26

申请号：US18215711

申请日：2023-06-28

Applicant: Micron Technology, Inc.

Inventor： Kelvin Tan Aik Boo ,  Chin Hui Chong ,  Seng Kim Ye ,  Hong Wan Ng ,  Hem P. Takiar

IPC: H01L23/498 ,  H01L25/065 ,  H05K1/18 ,  H01L23/13 ,  H01L23/64

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/642 ,  H01L25/0657 ,  H05K1/181 ,  H01L23/49816 ,  H05K2201/10015 ,  H05K2201/10159

Abstract: An apparatus includes a primary layer of a substrate. The apparatus includes a secondary layer of the substrate having a first open area that extends through the secondary layer to an inner layer of the substrate. The apparatus includes the inner layer of the substrate that is positioned between the primary layer and the secondary layer. The inner layer includes first component bond pads that are disposed on the inner layer and that are exposed via the first open area of the secondary layer.

公开(公告)号：US20230337362A1

公开(公告)日：2023-10-19

申请号：US18245633

申请日：2021-08-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin SHI

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10984

Abstract: Embodiments of this application disclose an electronic component and an electronic device. The electronic component is disposed on a printed circuit board (PCB). The electronic component includes an electronic component body. The electronic component body is soldered to the PCB by using a connecting component. The connecting component is provided with at least one cushioning structure.