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    Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems
    21.
    发明授权
    Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems 失效
    基于遥爪聚合物的粘合剂和密封剂和具有双重固化体系的异焦螯合聚合物

    公开(公告)号：US5910542A

    公开(公告)日：1999-06-08

    申请号：US78336

    申请日：1998-05-13

    Applicant: David John St. Clair ,  James Robert Erickson

    Inventor： David John St. Clair ,  James Robert Erickson

    IPC: C09K3/10 ,  C08G18/62 ,  C08G18/69 ,  C08G59/18 ,  C08G59/34 ,  C08J3/24 ,  C08L53/00 ,  C09J4/06 ,  C09J119/00 ,  C09J153/00 ,  C09J161/34 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J201/02 ,  C08L9/00 ,  C08L33/14 ,  C08L53/02

    CPC classification number: C08G59/027 ,  C08G18/6208 ,  C08G18/69 ,  C08G18/698 ,  C08G59/18 ,  C08J3/243 ,  C09J119/006 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J4/06 ,  C08G2170/40 ,  C08G2190/00

    Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.

    Abstract translation: 压敏结构粘合剂和密封剂组合物，其包含：（a）包含95至15重量％的遥爪聚合物和5至85重量％的异丙炔基聚合物的聚合物体系，其中至少一个其上的官能团相同 作为遥爪聚合物上的功能，和（b）双重固化系统，其中固化体系的一个元素固化遥爪聚合物，并且杂多聚乙烯聚合物上的共同官能团固化，而另一个元素固化在异极性聚合物上的功能，但不固化 在固化遥爪聚合物以形成结构粘合剂或密封剂组合物所需的条件下。 在一个优选的实施方案中，聚合物体系由羟基官能的遥爪二醇或多元醇聚合物组成，并且所述聚异戊烯聚合物是也具有环氧化烯烃官能团的单羟基化聚二烯烃聚合物。 双重固化体系优选由异氰酸酯固化剂组成，以在环境温度下固化通过羟基以形成压敏粘合剂或密封剂和氨基树脂，以在烘烤时通过环氧官能团固化以形成结构粘合剂或密封剂。

    Aqueous dispersed resin composition
    23.
    发明授权
    Aqueous dispersed resin composition 失效
    水分散树脂组合物

    公开(公告)号：US5472996A

    公开(公告)日：1995-12-05

    申请号：US224521

    申请日：1994-04-07

    Applicant: Ryutaro Hayashi ,  Masahiro Aoki ,  Toyoji Tomita ,  Yoshinori Kato ,  Takeo Tsukamoto ,  Takeshi Awata

    Inventor： Ryutaro Hayashi ,  Masahiro Aoki ,  Toyoji Tomita ,  Yoshinori Kato ,  Takeo Tsukamoto ,  Takeshi Awata

    IPC: C08L101/02 ,  C08F291/00 ,  C08K5/25 ,  C08L51/00 ,  C08L101/00 ,  C09D5/00 ,  C09D5/02 ,  C09D5/28 ,  C09D151/00 ,  C09D201/02 ,  C09J201/00 ,  C09J201/02 ,  C08F8/30

    CPC classification number: C09D151/00 ,  C08F291/00 ,  C08K5/25 ,  C08L51/003 ,  Y10S525/902

    Abstract: An aqueous dispersed resin composition comprising (A) an aqueous dispersion of carbonyl-containing resin particles having an inner layer and an outermost layer, which is obtained by emulsion polymerization of a monomer mixture comprising (a) not less than 0.5% by weight of a carbonyl-containing monomer containing at least one aldo group or keto group and one polymerizable unsaturated double bond in the molecule thereof, (b) not less than 0.5% by weight of an ethylenically unsaturated carboxylic acid, (c) not more than 99% by weight of a monomer having a water-solubility of not more than 8 g/100 ml at 20.degree. C., and (d) not more than 99% by weight of an unsaturated monomer other than the monomers (a) to (c) in the presence of dispersed resin particles serving as an inner layer and (B) a hydrophilic compound comprising a hydrazine derivative containing at least two hydrazino groups in the molecule thereof, in which the resin constituting the outermost layer of the carbonyl-containing resin particles has a degree of solubilization of at least 5% by weight, and the resin constituting the inner layer has a degree of solubilization lower than that of the resin constituting the outermost layer. The composition provides a film excellent in water resistance, adhesion to a substrate, smoothness, gloss, and resistance to whitening on contact with water.

    Abstract translation: 一种含水分散树脂组合物，其包含（A）具有内层和最外层的含羰基树脂颗粒的水分散体，其通过单体混合物的乳液聚合获得，所述单体混合物包含（a）不小于0.5重量％ 在分子中含有至少一个醛基或酮基和一个可聚合不饱和双键的含羰基单体，（b）不小于0.5重量％的烯属不饱和羧酸，（c）不大于99重量％ 在20℃下水溶性不超过8g / 100ml的单体的重量，和（d）不大于99重量％的单体（a）至（c）以外的不饱和单体， 在作为内层的分散树脂粒子的存在下，和（B）包含其分子中含有至少两个肼基的肼衍生物的亲水性化合物，其中构成含羰基的res的最外层的树脂 颗粒的增溶度为至少5重量％，构成内层的树脂的溶解度低于构成最外层的树脂的增溶度。 该组合物提供了耐水性，对基材的粘合性，平滑性，光泽度和与水接触时的美白抗性优异的膜。

    Preadhered melt spun spin-drawn polyester filaments
    24.
    发明授权
    Preadhered melt spun spin-drawn polyester filaments 失效
    预先熔融纺丝纺丝聚酯长丝

    公开(公告)号：US5352483A

    公开(公告)日：1994-10-04

    申请号：US774012

    申请日：1991-10-08

    Applicant: Remy Humbrecht ,  Peter Beutler ,  Armin Mueller

    Inventor： Remy Humbrecht ,  Peter Beutler ,  Armin Mueller

    IPC: C08J5/06 ,  D06M15/55 ,  B05D3/10 ,  C09J201/02

    CPC classification number: C08J5/06 ,  D06M15/55 ,  C08J2321/00 ,  Y10S156/91 ,  Y10T428/2938 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31786

    Abstract: The present invention discloses preadhered, melt-spun, spin-drawn polyester filaments having improved adhesive properties towards rubber and processes for making the same. The process for making these filaments include the following steps:(a) spin-drawing polyester filaments at an up-take speed ranging between about 2,000 and about 6,000 meters per minute by using an integrated spin-drawing process; and(b) immediately after spin-drawing, applying to the polyester filament a composition which has simultaneously about 0.05 to about 0.5% by weight of a polyepoxide and about 5 to about 140 ppm of a tertiary amine with linear functional groups.The resulting polyester filament has a minimum adherence towards rubber in the Strip-test of about 16.0 to about 21.5 daN.

    Abstract translation: 本发明公开了具有改进的对橡胶的粘合性能的预粘合，熔纺，旋涂聚酯长丝及其制备方法。 制造这些长丝的方法包括以下步骤：（a）通过使用集成的旋转拉伸工艺以约2000至约6,000米/分钟的上升速度旋转拉伸聚酯长丝; 和（b）在旋转拉伸后立即向聚酯长丝施加同时具有约0.05至约0.5重量％的聚环氧化物和约5至约140ppm具有线性官能团的叔胺的组合物。 所得的聚酯长丝在条带试验中对橡胶的粘附性为约16.0至约21.5DaN。

    Adhesive compositions
    25.
    发明授权
    Adhesive compositions 失效
    粘合剂组合物

    公开(公告)号：US3879337A

    公开(公告)日：1975-04-22

    申请号：US50715574

    申请日：1974-09-18

    Applicant: LORD CORP

    Inventor： MANINO LOUIE G ,  SEXSMITH FREDERICK H

    IPC: C08J5/06 ,  C08J5/12 ,  C09J201/02 ,  C08G22/00

    CPC classification number: C08J5/06 ,  C08J5/124 ,  C08J2321/00 ,  C08K3/013 ,  C08K5/29 ,  C08K5/32 ,  C08L2666/28 ,  C08L2666/54 ,  C09J201/02 ,  C08L101/02

    Abstract: Shelf-stable adhesive compositions for bonding metal and textile substrates to elastomers during vulcanization comprising a solution of at leasts one polyisocyanate and at least one halogen-containing polymer in which a poly-C-nitroso aromatic compound is suspended, said adhesive compositions having incorporated therein at least one inert filler material.

    Abstract translation: 用于在硫化期间将金属和纺织物基材粘合到弹性体上的稳定的粘合剂组合物，其包含至少一种多异氰酸酯和至少一种含有C的亚硝基芳族化合物的含卤素聚合物的溶液，其中所述粘合剂组合物已经并入其中 至少一种惰性填料。

    Electrically conductive adhesive
    26.
    发明授权
    Electrically conductive adhesive 有权

    公开(公告)号：US12152179B2

    公开(公告)日：2024-11-26

    申请号：US18472523

    申请日：2023-09-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jing Fang ,  Dong Yang ,  Jeffrey W. McCutcheon

    IPC: H01B1/22 ,  C09J9/02 ,  C09J201/02

    Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive first particles dispersed in the adhesive material and having a first shape; and a plurality of electrically conductive second particles dispersed in the adhesive material and having a second shape different from the first shape. A ratio of a total weight of the first particles to a total weight of the second particles is in a range from about 2 to about 10. The adhesive layer has an average thickness in a range from about 5 micrometers to about 35 micrometers. An electrical conductance of the adhesive layer in a thickness, but not in an in-plane, direction is at least 5% greater than a comparative adhesive layer having the same construction except that it does not include the second particles.

    ELECTRICALLY CONDUCTIVE ADHESIVE
    27.
    发明公开
    ELECTRICALLY CONDUCTIVE ADHESIVE 审中-公开

    公开(公告)号：US20240010882A1

    公开(公告)日：2024-01-11

    申请号：US18472523

    申请日：2023-09-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jing Fang ,  Dong Yang ,  Jeffrey W. McCutcheon

    IPC: C09J9/02 ,  C09J201/02 ,  H01B1/22

    CPC classification number: C09J9/02 ,  C09J201/02 ,  H01B1/22 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/314

    Abstract: An electrically conductive adhesive layer includes an adhesive material; a plurality of electrically conductive first particles dispersed in the adhesive material and having a first shape; and a plurality of electrically conductive second particles dispersed in the adhesive material and having a second shape different from the first shape. A ratio of a total weight of the first particles to a total weight of the second particles is in a range from about 2 to about 10. The adhesive layer has an average thickness in a range from about 5 micrometers to about 35 micrometers. An electrical conductance of the adhesive layer in a thickness, but not in an in-plane, direction is at least 5% greater than a comparative adhesive layer having the same construction except that it does not include the second particles.

    Pressure-sensitive adhesive tape for protecting semiconductor
    30.
    发明授权
    Pressure-sensitive adhesive tape for protecting semiconductor 有权

    公开(公告)号：US11254844B2

    公开(公告)日：2022-02-22

    申请号：US16579656

    申请日：2019-09-23

    Applicant: NITTO DENKO CORPORATION

    Inventor： Takatoshi Sasaki ,  Kouji Mizuno ,  Takayuki Toda

    IPC: C09J7/38 ,  C09J201/02

    Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa·N).

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