Abstract:
An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded.
Abstract:
A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.
Abstract:
In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.
Abstract:
The inventive concepts provide a substrate treating apparatus. The apparatus includes a process chamber, a substrate support unit, a gas supply unit, a microwave applying unit, an antenna plate, a slow-wave plate, a dielectric plate, and an exhaust baffle, and a liner. The liner includes a body having a ring shape facing an inner sidewall of the process chamber, and a flange extending from the body into a wall portion of the process chamber. The flange prevents an electric field of a microwave and a process gas from being provided into a gap between the process chamber and the body. Thus, it is possible to inhibit particles from being generated by damage of the inner sidewall of the process chamber by plasma, and drift distances of the particles can be reduced to inhibit the particles from reaching a substrate.
Abstract:
Provided is a transfer unit. The transfer unit includes a robot transferring a substrate and a controller controlling a speed of the robot according to the number of substrates to be transferred by the robot for a preset period. When the number of substrates to be transferred for the preset period increases, the robot increases in moving speed by the controller.
Abstract:
Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.
Abstract:
Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.
Abstract:
Provided is a substrate treatment apparatus including a housing, a supporting unit located inside the housing and supporting a substrate, a nozzle unit supplying chemicals to the substrate disposed on the supporting unit, and a chemical supplying unit supplying the chemicals to the nozzle unit. Herein, the chemical supplying unit includes a chemical supply source, a first tank and a second tank storing the chemicals, a chemical supplying line supplying the chemicals from the chemical supply source to the first tank and the second tank, a chemical discharge line supplying the chemicals from the first tank and the second tank to the nozzle unit, a circulation line allowing the chemicals to circulate through the first tank and the second tank, respectively, a member installed on the circulation line, and a controller controlling the member.
Abstract:
The substrate treating apparatus includes a drying chamber in which an organic solvent remaining on a substrate is dissolved by using a fluid, and a recycling unit including a separator for separating the organic solvent from the fluid discharged from the drying chamber to recycle the fluid. The separator includes a distiller in which a fluid containing an organic solvent having a first concentration is introduced, a heating unit heating a fluid containing an organic solvent having a second concentration discharged from the distiller, and supplying an evaporated fluid containing an organic solvent having a third concentration into the distiller, and a condensation unit liquefying a fluid containing an organic solvent having a fourth concentration discharged from the distiller. The organic solvent has the second concentration, the first concentration, the third concentration, and the fourth concentration which are successively lowered in concentration.
Abstract:
The substrate treating apparatus includes a process chamber in which an organic solvent remaining on a substrate is dissolved by using a fluid, that is provided as a supercritical fluid, to dry the substrate and a recycling unit including a recycler separating the organic solvent from the fluid discharged from the process chamber to recycle the fluid. The recycler includes a column having a space in which an absorbent for absorbing the organic solvent is stored, a supply tube supplying the fluid discharged from the process chamber into the space of the column, a discharge tube discharging the fluid from which the organic solvent is separated in the column, a gas supply tube supplying a purge gas into the column so that the organic solvent is separated from the absorbent, and an exhaust tube exhausting the purge gas containing the organic solvent to the outside of the column.