ANTENNA STRUCTURE AND PLASMA GENERATING DEVICE
    331.
    发明申请

    公开(公告)号:US20160150629A1

    公开(公告)日:2016-05-26

    申请号:US15010440

    申请日:2016-01-29

    Inventor: Yong Kwan LEE

    CPC classification number: H05H1/46 H01J37/3211 H01J2237/327 H05H2001/4667

    Abstract: An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded.

    SUBSTRATE TREATING APPARATUS
    332.
    发明申请
    SUBSTRATE TREATING APPARATUS 审中-公开
    基板处理装置

    公开(公告)号:US20160121374A1

    公开(公告)日:2016-05-05

    申请号:US14930206

    申请日:2015-11-02

    Applicant: Semes Co., Ltd

    Abstract: A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.

    Abstract translation: 公开了一种基板处理装置。 所述装置可以包括壳体,所述壳体包括彼此联接以限定处理空间的上主体和下体,所述下体设置在所述上​​身下方,支撑单元联接到所述上身,所述支撑单元支撑 设置在处理空间中的基板,配置成向处理空间供给流体的流体供给单元,设置在上下体之间并与上下体接触的密封构件,密封构件使处理空间与外部空间隔离,以及 安装在密封构件和支撑单元之间的隔离板。 隔离板可以设置成面对密封构件。

    APPARATUS AND METHOD FOR TREATING A SUBSTRATE
    333.
    发明申请
    APPARATUS AND METHOD FOR TREATING A SUBSTRATE 有权
    用于处理基板的装置和方法

    公开(公告)号:US20160089686A1

    公开(公告)日:2016-03-31

    申请号:US14862729

    申请日:2015-09-23

    CPC classification number: B05D1/002 H01L21/6708

    Abstract: In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.

    Abstract translation: 在根据本发明构思的示例性实施方案的设备和方法中,可以使用两种或更多种处理溶液来处理衬底。 基板处理装置可以包括提供处理空间的处理容器,设置在处理容器中以支撑基板的基板支撑单元,以及在由基板支撑单元支撑的基板上供给处理溶液的溶液供给单元。 溶液供给单元可以包括在由基板支撑单元支撑的基板的边缘区域上提供蚀刻溶液的蚀刻溶液供应喷嘴和在基板的中心区域上提供防腐蚀溶液的防蚀溶液(EPS)供应喷嘴 由基板支撑单元支撑。 因此,可以防止基板的中心区域被干燥。

    SUBSTRATE TREATING APPARATUS
    334.
    发明申请
    SUBSTRATE TREATING APPARATUS 审中-公开
    基板处理装置

    公开(公告)号:US20150380216A1

    公开(公告)日:2015-12-31

    申请号:US14744427

    申请日:2015-06-19

    CPC classification number: H01J37/32192 H01J37/32477

    Abstract: The inventive concepts provide a substrate treating apparatus. The apparatus includes a process chamber, a substrate support unit, a gas supply unit, a microwave applying unit, an antenna plate, a slow-wave plate, a dielectric plate, and an exhaust baffle, and a liner. The liner includes a body having a ring shape facing an inner sidewall of the process chamber, and a flange extending from the body into a wall portion of the process chamber. The flange prevents an electric field of a microwave and a process gas from being provided into a gap between the process chamber and the body. Thus, it is possible to inhibit particles from being generated by damage of the inner sidewall of the process chamber by plasma, and drift distances of the particles can be reduced to inhibit the particles from reaching a substrate.

    Abstract translation: 本发明的概念提供了一种基板处理装置。 该装置包括处理室,基板支撑单元,气体供应单元,微波施加单元,天线板,慢波板,电介质板和排气挡板以及衬垫。 衬套包括具有面向处理室的内侧壁的环形形状的主体和从主体延伸到处理室的壁部分的凸缘。 凸缘防止微波和工艺气体的电场被提供到处理室和主体之间的间隙中。 因此,可以通过等离子体损坏处理室的内侧壁来抑制颗粒的产生,并且可以减少颗粒的漂移距离以抑制颗粒到达基板。

    SUBSTRATE TREATING APPARATUS AND METHOD
    336.
    发明申请
    SUBSTRATE TREATING APPARATUS AND METHOD 有权
    基板处理装置和方法

    公开(公告)号:US20150155158A1

    公开(公告)日:2015-06-04

    申请号:US14556334

    申请日:2014-12-01

    CPC classification number: F26B21/003 H01L21/67017 H01L21/67034 H01L21/67051

    Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.

    Abstract translation: 提供了一种基板处理装置。 基板处理装置包括第一单元,第二单元,将第一单元连接到第二单元的供应线,以将超临界流体从第一单元供应到第二单元,设置在供给管线中的流量调节构件,以及 设置在供给管线中以除去异物的过滤器。 设置在流量调节构件和过滤器之间的供给管线被设置为脱离直线。

    SUPPORT UNIT AND SUBSTRATE TREATING DEVICE INCLUDING THE SAME
    337.
    发明申请
    SUPPORT UNIT AND SUBSTRATE TREATING DEVICE INCLUDING THE SAME 有权
    支持单元和基板处理设备,包括它们

    公开(公告)号:US20150116689A1

    公开(公告)日:2015-04-30

    申请号:US14527606

    申请日:2014-10-29

    Abstract: Provided is a method of manufacturing a support unit that supports a substrate. The method includes: providing a support plate formed of a non-conductive material and supporting a substrate; providing a base plate disposed below the support plate and formed of a material including a conductive material; and depositing a metallic layer at a bottom of the support plate and coupling the metallic layer and the base plate through brazing.

    Abstract translation: 提供一种制造支撑基板的支撑单元的方法。 该方法包括:提供由非导电材料形成并支撑基板的支撑板; 提供设置在所述支撑板下方并由包括导电材料的材料形成的基板; 以及在所述支撑板的底部沉积金属层,并通过钎焊将所述金属层和所述基板联接。

    CHEMICAL SUPPLYING UNIT, SUBSTRATE TREATMENT APPARATUS, AND METHOD OF TREATING SUBSTRATE USING THE SUBSTRATE TREATMENT APPPARATUS
    338.
    发明申请
    CHEMICAL SUPPLYING UNIT, SUBSTRATE TREATMENT APPARATUS, AND METHOD OF TREATING SUBSTRATE USING THE SUBSTRATE TREATMENT APPPARATUS 审中-公开
    化学供应单元,基板处理装置和使用基板处理装置处理基板的方法

    公开(公告)号:US20140290698A1

    公开(公告)日:2014-10-02

    申请号:US14228512

    申请日:2014-03-28

    Abstract: Provided is a substrate treatment apparatus including a housing, a supporting unit located inside the housing and supporting a substrate, a nozzle unit supplying chemicals to the substrate disposed on the supporting unit, and a chemical supplying unit supplying the chemicals to the nozzle unit. Herein, the chemical supplying unit includes a chemical supply source, a first tank and a second tank storing the chemicals, a chemical supplying line supplying the chemicals from the chemical supply source to the first tank and the second tank, a chemical discharge line supplying the chemicals from the first tank and the second tank to the nozzle unit, a circulation line allowing the chemicals to circulate through the first tank and the second tank, respectively, a member installed on the circulation line, and a controller controlling the member.

    Abstract translation: 本发明提供一种基板处理装置,其具备壳体,位于壳体内部并支撑基板的支撑单元,向设置在支撑单元上的基板供给化学物质的喷嘴单元,以及向喷嘴单元供给化学品的化学供给单元。 这里,化学品供应单元包括化学品供应源,第一罐和储存化学品的第二罐,将化学品从化学品供应源提供给第一罐和第二罐的化学品供应管线, 从第一罐和第二罐到喷嘴单元的化学品,分别允许化学品通过第一罐和第二罐循环的循环管线,安装在循环管线上的部件和控制该部件的控制器。

    RECYCLING UNIT AND SUBSTRATE TREATING APPARATUS
    339.
    发明申请
    RECYCLING UNIT AND SUBSTRATE TREATING APPARATUS 有权
    回收单元和基板处理设备

    公开(公告)号:US20140290093A1

    公开(公告)日:2014-10-02

    申请号:US14228731

    申请日:2014-03-28

    CPC classification number: H01L21/00 H01L21/67028 H01L21/67034 H01L21/67051

    Abstract: The substrate treating apparatus includes a drying chamber in which an organic solvent remaining on a substrate is dissolved by using a fluid, and a recycling unit including a separator for separating the organic solvent from the fluid discharged from the drying chamber to recycle the fluid. The separator includes a distiller in which a fluid containing an organic solvent having a first concentration is introduced, a heating unit heating a fluid containing an organic solvent having a second concentration discharged from the distiller, and supplying an evaporated fluid containing an organic solvent having a third concentration into the distiller, and a condensation unit liquefying a fluid containing an organic solvent having a fourth concentration discharged from the distiller. The organic solvent has the second concentration, the first concentration, the third concentration, and the fourth concentration which are successively lowered in concentration.

    Abstract translation: 基板处理装置包括通过使用流体溶解残留在基板上的有机溶剂的干燥室,以及包括用于从有机溶剂与从干燥室排出的流体分离以使循环流体的分离器的再循环单元。 分离器包括:蒸馏器,其中引入含有具有第一浓度的有机溶剂的流体;加热单元,加热含有从蒸馏器排出的第二浓度的有机溶剂的流体,以及供给包含有机溶剂的蒸发流体, 第三浓度进入蒸馏器,以及冷凝单元液化含有从蒸馏器排出的第四浓度的有机溶剂的流体。 有机溶剂具有浓度连续降低的第二浓度,第一浓度,第三浓度和第四浓度。

    RECYCLING UNIT, SUBSTRATE TREATING APPARATUS AND RECYCLING METHOD USING THE RECYCLING UNIT
    340.
    发明申请
    RECYCLING UNIT, SUBSTRATE TREATING APPARATUS AND RECYCLING METHOD USING THE RECYCLING UNIT 审中-公开
    回收单元,基板处理装置和使用回收单元的循环方法

    公开(公告)号:US20140290092A1

    公开(公告)日:2014-10-02

    申请号:US14228562

    申请日:2014-03-28

    Abstract: The substrate treating apparatus includes a process chamber in which an organic solvent remaining on a substrate is dissolved by using a fluid, that is provided as a supercritical fluid, to dry the substrate and a recycling unit including a recycler separating the organic solvent from the fluid discharged from the process chamber to recycle the fluid. The recycler includes a column having a space in which an absorbent for absorbing the organic solvent is stored, a supply tube supplying the fluid discharged from the process chamber into the space of the column, a discharge tube discharging the fluid from which the organic solvent is separated in the column, a gas supply tube supplying a purge gas into the column so that the organic solvent is separated from the absorbent, and an exhaust tube exhausting the purge gas containing the organic solvent to the outside of the column.

    Abstract translation: 基板处理装置包括:处理室,其中残留在基板上的有机溶剂通过使用被设置为超临界流体的流体溶解以干燥基板;以及回收单元,其包括将有机溶剂与流体分离的再循环器 从处理室排出以再循环流体。 回收机包括具有空间的柱,其中存储吸收有机溶剂的吸收剂,将从处理室排出的流体供应到塔的空间中的供给管,将排出有机溶剂的流体的排出管 在塔中分离出气体供给管,其将净化气体供应到塔中,使得有机溶剂与吸收剂分离,以及排气管将含有有机溶剂的吹扫气体排出到塔的外部。

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