Electrode diffusions in two-terminal non-volatile memory devices
    32.
    发明授权
    Electrode diffusions in two-terminal non-volatile memory devices 有权
    双端非易失性存储器件中的电极扩散

    公开(公告)号:US08592793B2

    公开(公告)日:2013-11-26

    申请号:US13100657

    申请日:2011-05-04

    Abstract: A non-volatile memory device includes a plurality of pillars, where each of the plurality of pillars contains a non-volatile memory cell containing a steering element and a storage element and at least one of a top corner or a bottom corner of each of the plurality of pillars is rounded. A method of making non-volatile memory device includes forming a stack of device layers, and patterning the stack to form a plurality of pillars, where each of the plurality of pillars contains a non-volatile memory cell that contains a steering element and a storage element, and where at least one of top corner or bottom corner of each of the plurality of pillars is rounded.

    Abstract translation: 非易失性存储器件包括多个支柱,其中多个支柱中的每个支柱包含含有转向元件和存储元件的非易失性存储单元,并且每个的顶角或底角中的至少一个 多个柱子是圆形的。 制造非易失性存储器件的方法包括形成器件层堆叠,以及图案化堆叠以形成多个柱,其中多个柱中的每个柱包含含有转向元件和存储器的非易失性存储单元 并且其中所述多个柱中的每一个的顶角或底角中的至少一个是圆形的。

    Integration methods for carbon films in two- and three-dimensional memories formed therefrom
    35.
    发明授权
    Integration methods for carbon films in two- and three-dimensional memories formed therefrom 有权
    由其形成的二维和三维记忆中的碳膜的积分方法

    公开(公告)号:US08093123B2

    公开(公告)日:2012-01-10

    申请号:US12541075

    申请日:2009-08-13

    CPC classification number: H01L27/101 H01L27/1021 H01L27/1052

    Abstract: Methods of forming memory cells are disclosed which include forming a pillar above a substrate, the pillar including a steering element and a memory element, and performing one or more etches vertically through the pillar to form multiple memory cells. Memory cells formed from such methods, as well as numerous other aspects are also disclosed.

    Abstract translation: 公开了形成存储器单元的方法,其包括在衬底上形成柱,所述柱包括转向元件和存储元件,并且通过柱垂直地执行一个或多个蚀刻以形成多个存储单元。 还公开了由这些方法形成的存储单元以及许多其它方面。

    MEMORY CELL THAT INCLUDES A CARBON-BASED MEMORY ELEMENT AND METHODS OF FORMING THE SAME
    36.
    发明申请
    MEMORY CELL THAT INCLUDES A CARBON-BASED MEMORY ELEMENT AND METHODS OF FORMING THE SAME 有权
    包含基于碳的存储元件的存储器单元及其形成方法

    公开(公告)号:US20100032643A1

    公开(公告)日:2010-02-11

    申请号:US12536463

    申请日:2009-08-05

    Applicant: Huiwen Xu

    Inventor: Huiwen Xu

    Abstract: Memory cells, and methods of forming such memory cells, are provided that include a carbon-based reversible resistivity switching material. In particular embodiments, methods in accordance with this invention form a memory cell by (a) depositing a layer of the carbon material above a substrate; (b) doping the deposited carbon layer with a dopant; (c) depositing a layer of the carbon material over the doped carbon layer; and (d) iteratively repeating steps (b) and (c) to form a stack of doped carbon layers having a desired thickness. Other aspects are also provided.

    Abstract translation: 提供了存储单元和形成这种存储单元的方法,其包括碳基可逆电阻率切换材料。 在特定实施例中,根据本发明的方法通过以下步骤形成存储器单元:(a)在基底上沉积碳材料层; (b)用掺杂剂掺杂沉积的碳层; (c)在所述掺杂碳层上沉积所述碳材料层; 和(d)重复地重复步骤(b)和(c)以形成具有期望厚度的掺杂碳层的堆叠。 还提供其他方面。

    METHODS TO OBTAIN LOW K DIELECTRIC BARRIER WITH SUPERIOR ETCH RESISTIVITY
    39.
    发明申请
    METHODS TO OBTAIN LOW K DIELECTRIC BARRIER WITH SUPERIOR ETCH RESISTIVITY 有权
    获得具有超级蚀刻电阻率的低K介电阻挡层的方法

    公开(公告)号:US20090093132A1

    公开(公告)日:2009-04-09

    申请号:US11869416

    申请日:2007-10-09

    Abstract: The present invention generally provides a method for forming a dielectric barrier with lowered dielectric constant, improved etching resistivity and good barrier property. One embodiment provides a method for processing a semiconductor substrate comprising flowing a precursor to a processing chamber, wherein the precursor comprises silicon-carbon bonds and carbon-carbon bonds, and generating a low density plasma of the precursor in the processing chamber to form a dielectric barrier film having carbon-carbon bonds on the semiconductor substrate, wherein the at least a portion of carbon-carbon bonds in the precursor is preserved in the low density plasma and incorporated in the dielectric barrier film.

    Abstract translation: 本发明通常提供一种形成具有降低的介电常数,改进的蚀刻电阻率和良好的阻挡性能的介电阻挡层的方法。 一个实施例提供了一种用于处理半导体衬底的方法,包括将前体流入处理室,其中前体包含硅 - 碳键和碳 - 碳键,并在处理室中产生前体的低密度等离子体以形成电介质 在半导体衬底上具有碳 - 碳键的阻挡膜,其中前体中的至少一部分碳 - 碳键保存在低密度等离子体中并且并入介电阻挡膜中。

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