公开(公告)号：US07009008B1

公开(公告)日：2006-03-07

申请号：US10048667

申请日：2000-08-04

申请人： Klaus Höhn ,  Günter Waitl ,  Karlheinz Arndt

发明人： Klaus Höhn ,  Günter Waitl ,  Karlheinz Arndt

IPC分类号： B05D5/06 ,  C08L63/02 ,  C08L63/04

CPC分类号： C08G59/38 ,  C08G59/42 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.

摘要翻译： 作为用于电子和光电子部件，模块和部件的组装和封装材料的浇铸树脂化合物，例如用于在酸酐可固化的环氧化合物，特别是双酚A-二缩水甘油醚的基础上流出光电组件，包含多功能 环氧酚醛清漆树脂，特别是环氧甲酚酚醛清漆。 该铸塑树脂组合物显示出明显提高的玻璃化转变温度，适合批量生产，不会出现健康恶化，并提供可用于汽车行业的具有SMT能力的产品。

公开(公告)号：US06975011B2

公开(公告)日：2005-12-13

申请号：US10819638

申请日：2004-04-06

申请人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Günter Waitl

发明人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Günter Waitl

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L23/29 ,  H01L33/00 ,  H01L27/14 ,  H01L23/795 ,  G03F7/075

CPC分类号： H01L33/486 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

公开(公告)号：US20050127377A1

公开(公告)日：2005-06-16

申请号：US10497388

申请日：2002-12-02

申请人： Karlheinz Arndt ,  Nadir Farchtchian

发明人： Karlheinz Arndt ,  Nadir Farchtchian

IPC分类号： H01L25/075 ,  H01L33/56 ,  H01L27/15 ,  H01L33/00

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Optoelectronic component, having a basic body or housing (2), at least one optoelectronic semiconductor chip (3) arranged in a recess of the basic body, and a potting composition (5) made of a transparent material, which potting composition embeds the at least one semiconductor chip in the recess, the transparent potting composition (5) being formed in diffusely scattering fashion and in particular containing diffuser particles (6) at which light impinging thereon is diffusely scattered.

摘要翻译： 具有基体或壳体（2）的光电子部件，布置在基体的凹部中的至少一个光电半导体芯片（3）和由透明材料制成的灌封组合物（5），该灌封组合物嵌入 在凹部中的至少一个半导体芯片，透明灌封组合物（5）以漫射方式形成，特别是包含漫射颗粒（6），在该散射体颗粒（6）处照射在其上的光被漫射地散射。

公开(公告)号：US20050116238A1

公开(公告)日：2005-06-02

申请号：US11002959

申请日：2004-12-02

申请人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Gunter Waitl

发明人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Gunter Waitl

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L27/15

CPC分类号： H01L33/486 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。

公开(公告)号：US06376902B1

公开(公告)日：2002-04-23

申请号：US09494771

申请日：2000-01-31

申请人： Karlheinz Arndt

发明人： Karlheinz Arndt

IPC分类号： H01L2302

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

摘要： An optoelectronic structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.

摘要翻译： 光电子结构元件，其中光电子芯片附接到引线框架的芯片载体部分。 引线框架具有设置在与芯片载体部分相距一定距离处的连接部分，并且其与光电芯片的电接触导电连接。 芯片载体部分提供了许多外部连接，用于改善远离芯片的热传导。 外部连接从外壳距离彼此远离。

公开(公告)号：US08772065B2

公开(公告)日：2014-07-08

申请号：US13611890

申请日：2012-09-12

申请人： Georg Bogner ,  Karlheinz Arndt

发明人： Georg Bogner ,  Karlheinz Arndt

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L23/49805 ,  H01L24/48 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

摘要翻译： 具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面， 并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向 与安装表面（19）的关系。 此外，提供了一种用于生产包装体（1）的方法。

公开(公告)号：US07514723B2

公开(公告)日：2009-04-07

申请号：US10497388

申请日：2002-12-02

申请人： Karlheinz Arndt ,  Nadir Farchtchian

发明人： Karlheinz Arndt ,  Nadir Farchtchian

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Optoelectronic component, having a basic body or housing (2), at least one optoelectronic semiconductor chip (3) arranged in a recess of the basic body, and a potting composition (5) made of a transparent material, which potting composition embeds the at least one semiconductor chip in the recess, the transparent potting composition (5) being formed in diffusely scattering fashion and in particular containing diffuser particles (6) at which light impinging thereon is diffusely scattered.

摘要翻译： 具有基体或壳体（2）的光电子部件，布置在基体的凹部中的至少一个光电半导体芯片（3）和由透明材料制成的灌封组合物（5），该灌封组合物嵌入 在凹部中的至少一个半导体芯片，透明灌封组合物（5）以漫射方式形成，并且特别地包含扩散粒子（6），在该漫射体颗粒（6）处入射光的光线漫射散射。

公开(公告)号：US07271425B2

公开(公告)日：2007-09-18

申请号：US10535794

申请日：2003-11-27

申请人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

发明人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

IPC分类号： H01L29/22

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.

摘要翻译： 本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44） 向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分 在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。 本发明还涉及包括所述部件的装置。 组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

公开(公告)号：US20060100397A1

公开(公告)日：2006-05-11

申请号：US11305402

申请日：2005-12-16

申请人： Klaus Hohn ,  Gunter Waitl ,  Karlheinz Arndt

发明人： Klaus Hohn ,  Gunter Waitl ,  Karlheinz Arndt

IPC分类号： C08G59/14 ,  C08L63/00

CPC分类号： C08G59/38 ,  C08G59/42 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.

摘要翻译： 作为用于电子和光电子部件，模块和部件的组装和封装材料的浇铸树脂化合物，例如用于在酸酐可固化的环氧化合物，特别是双酚A-二缩水甘油醚的基础上流出光电组件，包含多功能 环氧酚醛清漆树脂，特别是环氧甲酚酚醛清漆。 该铸塑树脂组合物显示出明显提高的玻璃化转变温度，适合批量生产，不会出现健康恶化，并提供可用于汽车行业的具有SMT能力的产品。

公开(公告)号：US20060022215A1

公开(公告)日：2006-02-02

申请号：US11179028

申请日：2005-07-18

申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。