公开(公告)号：US20170363673A1

公开(公告)日：2017-12-21

申请号：US15626512

申请日：2017-06-19

Applicant: Thin Film Electronics ASA

Inventor： Somnath MUKHERJEE

IPC: G01R31/02 ,  G01N27/02 ,  B65D79/02

CPC classification number: H04Q9/00 ,  A61M15/00 ,  A61M15/0026 ,  A61M2202/064 ,  A61M2205/14 ,  A61M2205/3317 ,  B65D79/02 ,  G01D5/204 ,  G01D5/2053 ,  G01D5/2066 ,  G01D5/2073 ,  G01N27/025 ,  G01R31/026 ,  G06K19/0716 ,  G06K19/0717 ,  G08B13/126 ,  G08B13/2431 ,  H04B5/0031 ,  H04Q2209/40

Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

公开(公告)号：US09552924B2

公开(公告)日：2017-01-24

申请号：US14613178

申请日：2015-02-03

Applicant: Thin Film Electronics ASA

Inventor： Arvind Kamath ,  Criswell Choi ,  Patrick Smith ,  Erik Scher ,  Jiang Li

IPC: H01G4/228 ,  H01G4/10 ,  H01G4/005 ,  H01G4/33 ,  H01G4/002 ,  H01L27/01 ,  H01L49/02 ,  H01G4/01 ,  H01G13/00 ,  H01G4/30 ,  H01Q1/22

CPC classification number: H01G4/40 ,  H01G4/002 ,  H01G4/005 ,  H01G4/008 ,  H01G4/01 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/30 ,  H01G4/306 ,  H01G4/33 ,  H01G13/00 ,  H01L23/66 ,  H01L27/016 ,  H01L28/60 ,  H01L2223/6677 ,  H01Q1/22 ,  H01Q1/2283 ,  H01Q1/38 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49016

Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

Abstract translation: 高精度电容器及其形成方法采用精确且高度保形的沉积工艺，用于在各种粗糙度和组成的基底上沉积绝缘层。 该方法通常包括以下步骤：通过原子层沉积（ALD）在金属衬底上沉积第一绝缘层; （b）在所述第一绝缘层上形成第一电容器电极; 和（c）在所述第一绝缘层上形成第二绝缘层，并且在所述第一电容器电极上或与所述第一电容器电极相邻。 实施例提供了一种改进的沉积工艺，其在宽范围的衬底上产生高度保形的绝缘层，从而产生改进的电容器。

公开(公告)号：US11119158B2

公开(公告)日：2021-09-14

申请号：US16309673

申请日：2017-06-19

Applicant: Thin Film Electronics ASA

Inventor： Somnath Mukherjee ,  James Godfrey

IPC: G01R31/50 ,  G01D5/20 ,  G08B13/12 ,  G08B13/24 ,  G06K19/07 ,  B65D79/02 ,  G01N27/02 ,  A61M15/00 ,  H04B5/00 ,  H04Q9/00

Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

公开(公告)号：US10453853B2

公开(公告)日：2019-10-22

申请号：US15222092

申请日：2016-07-28

Applicant: THIN FILM ELECTRONICS ASA

Inventor： Christer Karlsson ,  Olle Jonny Hagel ,  Jakob Nilsson ,  Per Bröms

IPC: H01L27/115 ,  H01L27/11507 ,  G11B9/02 ,  H01L27/11502 ,  H01L51/05 ,  H01L27/12 ,  H01L49/02 ,  G11C11/16 ,  H01L23/00 ,  H01L43/02 ,  H01L43/12 ,  H01L27/02 ,  G11C11/22

Abstract: A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

公开(公告)号：US10332686B2

公开(公告)日：2019-06-25

申请号：US15385727

申请日：2016-12-20

Applicant: Thin Film Electronics ASA

Inventor： Arvind Kamath ,  Criswell Choi ,  Patrick Smith ,  Erik Scher ,  Jiang Li

IPC: H01G4/06 ,  H01G4/005 ,  H01G4/33 ,  H01G4/40 ,  H01G4/002 ,  H01L27/01 ,  H01L49/02 ,  H01G4/01 ,  H01G13/00 ,  H01G4/10 ,  H01G4/30 ,  H01Q1/22 ,  H01G4/008 ,  H01G4/12 ,  H01G4/224 ,  H01L23/66 ,  H01Q1/38

Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

公开(公告)号：US20190135501A1

公开(公告)日：2019-05-09

申请号：US16094169

申请日：2017-04-18

Applicant: Thin Film Electronics ASA

Inventor： Aditi CHANDRA ,  David ULAND ,  Alex CHANDLER

IPC: B65D41/62 ,  G06K19/077

Abstract: A bottle having a sealing device and a substrate attached thereto, and methods of attaching the substrate to the bottle are disclosed. Methods include placing the substrate on the bottle, the bottle having a break line, and the substrate having a wireless communication device having an antenna, an integrated circuit, and a sensing line thereon. Methods further include adhering a first part of the substrate including the antenna to a first portion of the bottle that does not include the break line, and a second part of the substrate including the sensing line to a second portion of the bottle and on/over a break line. The bottle includes an interface between the sealing device and defines a break line. The substrate including the wireless communication device is on/over the bottle, at least a part of the sealing device and the break line.

公开(公告)号：US20190059160A1

公开(公告)日：2019-02-21

申请号：US16078887

申请日：2017-02-27

Applicant: Thin Film Electronics ASA

Inventor： Olle HAGEL

IPC: H05K3/32 ,  C09J9/02 ,  C09J5/06 ,  H05K3/30 ,  H01L23/00 ,  H05K1/03 ,  H05K1/18

Abstract: A method of and system for manufacturing an electronic device, a curable conductive adhesive for use in the same, and an electronic device are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate, placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and after the component(s) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The system comprises a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting machine configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) have been placed onto the pads.

公开(公告)号：US09947988B2

公开(公告)日：2018-04-17

申请号：US15230348

申请日：2016-08-05

Applicant: Thin Film Electronics ASA

Inventor： Mao Takashima ,  Aditi Chandra ,  Somnath Mukherjee ,  Gloria Wong ,  Khanh Van Tu ,  Joey Li ,  Anton Popiolek ,  Arvind Kamath

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q7/06

CPC classification number: H01Q1/2291 ,  H01Q7/06

Abstract: A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

公开(公告)号：US09196641B2

公开(公告)日：2015-11-24

申请号：US13633816

申请日：2012-10-02

Applicant: Thin Film Electronics ASA

Inventor： Arvind Kamath ,  James Montague Cleeves ,  Joerg Rockenberger ,  Patrick Smith ,  Fabio Zurcher

IPC: H01L27/00 ,  H01L27/12 ,  H01L29/66

CPC classification number: H01L27/1292 ,  H01L29/66757

Abstract: A method for making an electronic device, such as a MOS transistor, including the steps of forming a plurality of semiconductor islands on an electrically functional substrate, printing a first dielectric layer on or over a first subset of the semiconductor islands and optionally a second dielectric layer on or over a second subset of the semiconductor islands, and annealing. The first dielectric layer contains a first dopant, and the (optional) second dielectric layer contains a second dopant different from the first dopant. The dielectric layer(s), semiconductor islands and substrate are annealed sufficiently to diffuse the first dopant into the first subset of semiconductor islands and, when present, the second dopant into the second subset of semiconductor islands.

Abstract translation: 一种用于制造诸如MOS晶体管的电子器件的方法，包括以下步骤：在电功能衬底上形成多个半导体岛，在第一半导体岛子集上或第二子体上印刷第一介电层， 在半导体岛的第二子集上或上方，以及退火。 第一介电层包含第一掺杂剂，并且（任选的）第二介电层包含不同于第一掺杂剂的第二掺杂剂。 电介质层，半导体岛和衬底被充分退火以将第一掺杂剂扩散到半导体岛的第一子集中，并且当存在时将第二掺杂剂扩散到半导体岛的第二子集中。