公开(公告)号：US20060110850A1

公开(公告)日：2006-05-25

申请号：US11322819

申请日：2005-12-30

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： B29C45/02 ,  B29C45/14655 ,  B29C45/1671 ,  G06K19/077 ,  G06K19/07743 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/2018 ,  H05K2203/1316 ,  H05K2203/1476 ,  Y10T29/49121 ,  Y10T29/49171 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery.

摘要翻译： 一种用于制造半导体卡的方法包括印刷电路基板，其上安装有包括一个或多个半导体部件如卡片或封装的卡电路。 外部触点通过可拆卸插入将卡电路连接到另一设备的电路。 衬底由周围框架中的外围开口限定，其可以是复帧条的一部分。 基板通过连接段连接到框架。 该卡片包括模塑到基底上的第一塑料浇注并封装半导体部件，同时留下未覆盖的基底的周边部分。 第二塑料铸件被模制到周边部分以邻接第一塑料铸件并形成卡周边。

公开(公告)号：US20060055020A1

公开(公告)日：2006-03-16

申请号：US11268095

申请日：2005-11-07

申请人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

发明人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

IPC分类号： H01L23/12

CPC分类号： H05K3/303 ,  H01L25/105 ,  H01L25/18 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

摘要： A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.

摘要翻译： 一种具有多个垂直堆叠的球栅阵列的存储器封装。 每个垂直堆叠的球栅阵列具有与其耦合的存储芯片。 此外，多个球栅阵列中的每一个包括非金属可对准的对准特征。 多个球栅阵列中的每一个耦合到多个球栅阵列中的另一个，以从垂直堆叠的存储器封装。

公开(公告)号：US20060023107A1

公开(公告)日：2006-02-02

申请号：US10910491

申请日：2004-08-02

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  G03B13/02 ,  G03B17/28 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

摘要： Microelectronic imagers comprising imaging units and optics units with optics supports having threadless interfaces and methods for packaging such microelectronic imagers are disclosed herein. In one embodiment, the imaging unit can include a microelectronic substrate and a microelectronic die on and/or in the substrate. A first referencing element having one or more inclined steps arranged about an axis is fixed to the imaging unit. The imager can further include an optics unit having an optic member. A second referencing element having one or more complementary inclined steps is fixed to the optics unit. The second referencing element is seated with the first referencing element and at least one of the referencing elements can be rotatably adjusted with respect to the other to position the optic member at a desired location relative to the image sensor.

摘要翻译： 包括具有光学支架的成像单元和光学单元的微电子成像器具有无螺纹接口和用于封装这种微电子成像器的方法。 在一个实施例中，成像单元可以包括微电子衬底和在衬底上和/或衬底中的微电子管芯。 具有围绕轴线布置的一个或多个倾斜台阶的第一参考元件被固定到成像单元。 成像器还可以包括具有光学构件的光学单元。 具有一个或多个互补倾斜台阶的第二参考元件固定到光学单元。 第二参考元件与第一参考元件配合，并且至少一个参考元件可以相对于另一参考元件可旋转地调节，以将光学构件相对于图像传感器定位在期望的位置。

公开(公告)号：US20050057883A1

公开(公告)日：2005-03-17

申请号：US10663959

申请日：2003-09-16

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.