公开(公告)号：US20050019983A1

公开(公告)日：2005-01-27

申请号：US10919090

申请日：2004-08-16

申请人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

发明人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

IPC分类号： H01L25/10 ,  H01L25/18 ,  H05K3/30 ,  H01L23/02

CPC分类号： H05K3/303 ,  H01L25/105 ,  H01L25/18 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

摘要： A method of manufacturing a stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a preformed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orient each package with respect to an adjacent package, substrate or printed circuit board. The alignment features also support the weight of the adjacent package during solder ball reflow to maintain stack height and parallelism between packages. Each memory device is serially connected to the adjacent memory device through the vias and solder balls on each package.

摘要翻译： 使用球栅阵列技术制造可堆叠封装以创建3维存储器阵列的方法。 具体地，存储器芯片耦合到具有对准特征以允许球栅阵列的堆叠的预成型封装。 对准特征用于相对于相邻的封装，衬底​​或印刷电路板对准和定向每个封装。 对准特征还支持焊球回流期间相邻封装的重量，以保持堆叠高度和封装之间的平行度。 每个存储器件通过每个封装上的通孔和焊球串联连接到相邻的存储器件。

公开(公告)号：US20060055020A1

公开(公告)日：2006-03-16

申请号：US11268095

申请日：2005-11-07

申请人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

发明人： Todd Bolken ,  Cary Baerlocher ,  Chad Cobbley ,  David Corisis

IPC分类号： H01L23/12

CPC分类号： H05K3/303 ,  H01L25/105 ,  H01L25/18 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

摘要： A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.

摘要翻译： 一种具有多个垂直堆叠的球栅阵列的存储器封装。 每个垂直堆叠的球栅阵列具有与其耦合的存储芯片。 此外，多个球栅阵列中的每一个包括非金属可对准的对准特征。 多个球栅阵列中的每一个耦合到多个球栅阵列中的另一个，以从垂直堆叠的存储器封装。

公开(公告)号：US20060169490A1

公开(公告)日：2006-08-03

申请号：US11366793

申请日：2006-03-02

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01L23/28

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20050263312A1

公开(公告)日：2005-12-01

申请号：US11180493

申请日：2005-07-13

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20050057883A1

公开(公告)日：2005-03-17

申请号：US10663959

申请日：2003-09-16

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

公开(公告)号：US20060068527A1

公开(公告)日：2006-03-30

申请号：US11280648

申请日：2005-11-16

申请人： Chad Cobbley ,  Cary Baerlocher

发明人： Chad Cobbley ,  Cary Baerlocher

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/16 ,  H01L21/565 ,  H01L23/24 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

公开(公告)号：US20060290011A1

公开(公告)日：2006-12-28

申请号：US11513791

申请日：2006-08-31

申请人： Chad Cobbley ,  Cary Baerlocher

发明人： Chad Cobbley ,  Cary Baerlocher

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49558 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

公开(公告)号：US20050029549A1

公开(公告)日：2005-02-10

申请号：US10932940

申请日：2004-09-02

申请人： Chad Cobbley ,  Cary Baerlocher

发明人： Chad Cobbley ,  Cary Baerlocher

IPC分类号： H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/495 ,  H01L27/10

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49558 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。

公开(公告)号：US20050023653A1

公开(公告)日：2005-02-03

申请号：US10931369

申请日：2004-08-31

申请人： William Tandy ,  Matt Schwab ,  Cary Baerlocher

发明人： William Tandy ,  Matt Schwab ,  Cary Baerlocher

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

摘要： An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

摘要翻译： 集成电路器件包括与引线框架耦合的半导体部件和包含半导体部件的至少一部分的集成电路封装。 包装具有第一表面和第二表面以及侧表面，其中第一表面与第二表面相对。 集成电路封装的分型线朝向封装的第二表面偏移，其中第一表面任选地包括封装的底表面。 包装的第一表面具有一个或多个凹陷区域。

公开(公告)号：US20060237845A1

公开(公告)日：2006-10-26

申请号：US11428625

申请日：2006-07-05

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.