公开(公告)号：US20100013066A1

公开(公告)日：2010-01-21

申请号：US12568224

申请日：2009-09-28

申请人： Yong-hoon Kim ,  Hee-seok Lee ,  Yun-seok Choi

发明人： Yong-hoon Kim ,  Hee-seok Lee ,  Yun-seok Choi

IPC分类号： H01L23/60 ,  H01L23/52

CPC分类号： H01L23/552 ,  H01L23/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip.

摘要翻译： 半导体封装包括主衬底，具有第一侧和第二侧的半导体芯片，设置在主衬底上并与主衬底电连接的半导体芯片的第一侧和形成在主衬底的第二侧上的导电网络 半导体芯片。

公开(公告)号：US07402794B2

公开(公告)日：2008-07-22

申请号：US11176242

申请日：2005-07-08

申请人： Yong Hoon Kim ,  Gm Sil Kang ,  Sung Hyun Kim ,  Jun Ho Choi

发明人： Yong Hoon Kim ,  Gm Sil Kang ,  Sung Hyun Kim ,  Jun Ho Choi

IPC分类号： G01R23/02

CPC分类号： H01Q21/06

摘要： A radiometer imaging system includes an antenna array having a plurality of sub-arrays, each being formed of a plurality of antenna elements arranged in a sub-Y-type, a receiver array having the same number of receivers as the antenna elements, each receiver being associated with one of the antenna elements in a one-to-one correspondence to thereby define a channel to generate a first signal and a second signal from an output of each antenna element, and a correlation processor for calculating a correlation for each correlated channel pair, by using the first signal and the second signal for each antenna element, to thereby obtain an 3-D image for the object.

摘要翻译： 辐射计成像系统包括具有多个子阵列的天线阵列，每个子阵列由以子Y型布置的多个天线元件形成，具有与天线元件相同数量的接收器的接收器阵列，每个接收器 与一个天线元件一一对应关联，从而定义从每个天线元件的输出产生第一信号和第二信号的信道，以及用于计算每个相关信道的相关性的相关处理器 通过对于每个天线元件使用第一信号和第二信号，从而获得用于该对象的3-D图像。

公开(公告)号：US20070277027A1

公开(公告)日：2007-11-29

申请号：US11797985

申请日：2007-05-09

申请人： Yong-Hoon Kim ,  Yun-Tae Lee ,  Sung-Up Choi

发明人： Yong-Hoon Kim ,  Yun-Tae Lee ,  Sung-Up Choi

IPC分类号： G06F15/177

CPC分类号： G06F9/4401

摘要： An electronic information system comprises an external storage device and an application processor. The external storage device stores boot code and the application processor is adapted to receive the boot code from the external storage device and to perform a system booting operation during a power-up operation by executing the boot code.

摘要翻译： 电子信息系统包括外部存储装置和应用处理器。 外部存储装置存储引导代码，并且应用处理器适于从外部存储设备接收引导代码，并且在上电操作期间通过执行引导代码执行系统引导操作。

公开(公告)号：US20070164347A1

公开(公告)日：2007-07-19

申请号：US11623829

申请日：2007-01-17

申请人： Yong-hoon Kim

发明人： Yong-hoon Kim

IPC分类号： H01L29/788

CPC分类号： H01L27/115 ,  H01L27/11519

摘要： Non-volatile memory devices according to embodiments of the present invention include an EEPROM transistor in a first portion of a semiconductor substrate, an access transistor in a second portion of the semiconductor substrate and an erase transistor in a third portion of the semiconductor substrate. The second portion of the semiconductor substrate extends adjacent a first side of the first portion of the semiconductor substrate and the third portion of the semiconductor substrate extends adjacent a second side of the first portion of the semiconductor substrate. The first and second sides of the first portion of the semiconductor substrate may be opposite sides of the first portion of the semiconductor substrate. The access transistor has a first source/drain terminal electrically connected to a first source/drain terminal of the EEPROM transistor and the erase transistor has a first source/drain terminal electrically connected to a second source/drain terminal of the access transistor.

摘要翻译： 根据本发明的实施例的非易失性存储器件包括在半导体衬底的第一部分中的EEPROM晶体管，半导体衬底的第二部分中的存取晶体管和半导体衬底的第三部分中的擦除晶体管。 半导体衬底的第二部分在半导体衬底的第一部分的第一侧附近延伸，并且半导体衬底的第三部分相邻于半导体衬底的第一部分的第二侧延伸。 半导体衬底的第一部分的第一和第二侧可以是半导体衬底的第一部分的相对侧。 存取晶体管具有电连接到EEPROM晶体管的第一源极/漏极端子的第一源极/漏极端子，并且擦除晶体管具有电连接到存取晶体管的第二源极/漏极端子的第一源极/漏极端子。

公开(公告)号：US06088150A

公开(公告)日：2000-07-11

申请号：US60362

申请日：1998-04-15

申请人： Yong Hoon Kim ,  Seung Nam Cha ,  Hang Woo Lee

发明人： Yong Hoon Kim ,  Seung Nam Cha ,  Hang Woo Lee

IPC分类号： G02F1/03 ,  G02F1/11 ,  H04N9/31 ,  G02F1/33

CPC分类号： H04N9/3129 ,  G02F1/11 ,  G02F1/0311 ,  G02F1/0316

摘要： A 3-channel modulation system for a high power laser and a modulation method for a high power laser are disclosed herein. In a preferred implementation, the modulation system includes a laser light source, a light modulator modulating the light generated from the laser light source and including a pair of electrodes having a predetermined area disposed on one side of the light modulator, an image signal generating sub-system, a drive circuit sub-system for operating the electrodes so that the image signal being generated from the image signal generating sub-system is provided through the electrodes to the light modulator, a first cylindrical lens positioned between the laser light source and the light modulator so that the area and form of the light generated from the laser light source are modified and the modified light enters the light modulator, and a second cylindrical lens positioned at an output side of the light modulator to modify the area and form of the light modulated by the light modulator. The method includes the steps of generating laser light from a laser light source, modulating the light generated from the laser light source, providing an electrode means image signal to electrodes of the light modulation means, the electrodes having a predetermined area, operating the electrodes, modifying the area and form of the light which is between the laser light source and the light modulation means and generated from the laser light source, and causing the modified light to enter the light modulation means, and modifying the area and form of the light which is output by the light modulator means.

摘要翻译： 这里公开了一种用于大功率激光器的3通道调制系统和用于大功率激光器的调制方法。 在优选的实施方案中，调制系统包括激光光源，调制从激光光源产生的光的光调制器，并且包括一对具有设置在光调制器的一侧上的预定区域的电极，图像信号产生子 系统，用于操作电极的驱动电路子系统，使得从图像信号产生子系统产生的图像信号通过电极提供给光调制器;第一柱面透镜，位于激光光源和 光调制器，使得从激光光源产生的光的面积和形式被修改，并且修改的光进入光调制器，并且位于光调制器的输出侧的第二柱面透镜，以修改光调制器的面积和形式 由光调制器调制的光。 该方法包括以下步骤：从激光源产生激光，调制从激光光源产生的光，向光调制装置的电极提供电极装置图像信号，电极具有预定区域，操作电极， 改变激光光源和光调制装置之间并由激光光源产生的光的面积和形状，并使修改的光进入光调制装置，并修改光的面积和形式， 由光调制装置输出。

公开(公告)号：US5099513A

公开(公告)日：1992-03-24

申请号：US484423

申请日：1990-02-23

申请人： Yong-Hoon Kim ,  Kye-Eon Chang

发明人： Yong-Hoon Kim ,  Kye-Eon Chang

IPC分类号： A23C11/10 ,  A23J1/14 ,  A23L11/00 ,  G10H1/00 ,  G11C27/00 ,  H04M1/00 ,  H04M19/04

CPC分类号： H04M19/04

摘要： An integrated circuit for generating a melody and ring comprises a starting voltage detector a frequency discriminator a controller a ring/melody data ROM an oscillator/frequency doubler a frequency divider a tempo/rhythm generator a chord generator an original-melody generator and an envelope output part. A ring circuit and melody circuit are formed together in one chip, thereby can reduce the prime cost of the telephone by generating selectively a ring signal in a ring mode or a melody signal in a melody mode.

摘要翻译： 用于产生旋律和振铃的集成电路包括起动电压检测器，频率鉴别器a控制器环/旋律数据ROM振荡器/倍频器分频器速度/节奏发生器和弦发生器原始旋律发生器和包络输出 部分。 环形电路和旋律电路一起形成在一个芯片中，从而可以通过以旋律模式选择性地产生振铃信号或旋律信号来降低电话的主要成本。

公开(公告)号：US09165893B2

公开(公告)日：2015-10-20

申请号：US13229193

申请日：2011-09-09

申请人： Yong-Hoon Kim ,  Jong-Joo Lee ,  Sang-Youb Lee ,  Young-Don Choi ,  Hee-Seok Lee

发明人： Yong-Hoon Kim ,  Jong-Joo Lee ,  Sang-Youb Lee ,  Young-Don Choi ,  Hee-Seok Lee

IPC分类号： H04B5/00 ,  H01L23/64 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L23/645 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H04B5/0012 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0075 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.

摘要翻译： 公开了一种包括通孔的半导体器件。 半导体器件可以包括第一半导体芯片，其包括形成在第一表面上的收发器电路，形成在与第一表面相对的第二表面上的第一耦合导体图案，以及连接收发器电路和第一耦合导电 模式。 可以存在位于第二半导体芯片上的收发器，并且包括面向与第一耦合导电图案无线通信的第一耦合导电图案的第二耦合导电图案。

公开(公告)号：US08633579B2

公开(公告)日：2014-01-21

申请号：US13208455

申请日：2011-08-12

申请人： Un-Byoung Kang ,  Jong-Joo Lee ,  Yong-Hoon Kim ,  Tae-Hong Min

发明人： Un-Byoung Kang ,  Jong-Joo Lee ,  Yong-Hoon Kim ,  Tae-Hong Min

IPC分类号： H01L23/02

CPC分类号： H01L23/49827 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311

摘要： A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line.

摘要翻译： 多芯片封装可以包括封装衬底，插入器芯片，第一半导体芯片，散热结构和第二半导体芯片。 插入器芯片可以安装在封装衬底上。 第一半导体芯片可以安装在插入器芯片上。 第一半导体芯片的尺寸可以小于插入器芯片的尺寸。 散热结构可以布置在插入器芯片上以围绕第一半导体芯片。 散热结构可以将第一半导体芯片中的热量传递到插入器芯片。 第二半导体芯片可以安装在第一半导体芯片上。 因此，可以通过散热线将第一半导体芯片中的热量有效地传递到插入器芯片。

公开(公告)号：US08502580B2

公开(公告)日：2013-08-06

申请号：US12648795

申请日：2009-12-29

申请人： Yong-Hoon Kim ,  Hyun-Woo Lee

发明人： Yong-Hoon Kim ,  Hyun-Woo Lee

IPC分类号： H03L7/06

CPC分类号： H03L7/0814 ,  H03L7/0816

摘要： A semiconductor device includes: an internal clock signal generation unit configured to receive an external clock signal and to generate an internal clock signal in response to a control signal; and a monitoring unit configured to monitor environmental elements reflected in a circuit response to the control signal.

摘要翻译： 半导体器件包括：内部时钟信号生成单元，被配置为接收外部时钟信号并响应于控制信号产生内部时钟信号; 以及监视单元，被配置为监视反映在对所述控制信号的电路响应中的环境因素。

公开(公告)号：US08314160B2

公开(公告)日：2012-11-20

申请号：US11571662

申请日：2005-12-13

申请人： Kohji Masuda ,  Masayasu Ito ,  Kojiro Inamori ,  Naoki Yoshida ,  Michiaki Kawakami ,  Hiroyuki Yamazaki ,  Hidehumi Miyagi ,  Yong Hoon Kim

发明人： Kohji Masuda ,  Masayasu Ito ,  Kojiro Inamori ,  Naoki Yoshida ,  Michiaki Kawakami ,  Hiroyuki Yamazaki ,  Hidehumi Miyagi ,  Yong Hoon Kim

IPC分类号： C08L67/00 ,  C08L77/00 ,  C08G63/00

CPC分类号： B32B27/065 ,  B32B5/20 ,  B32B2266/0207 ,  B32B2266/0228 ,  B32B2266/0264 ,  B32B2266/0292 ,  B32B2270/00 ,  B32B2307/416 ,  B32B2307/71 ,  B32B2307/72 ,  B32B2590/00

摘要： A thermoplastic resin foam which has both high reflectance and superior shape-retention properties, suitable for use in backlights and illumination boxes for illumination signboards, lighting fixtures, displays and the like. The thermoplastic resin foam is manufactured by a manufacturing method including a procedure for holding a resin sheet composed of thermoplastic resin (A) and thermoplastic resin (B), which has a functional group having an affinity with thermoplastic resin (A), within a pressurized inert gas atmosphere to enable the resin sheet to contain inert gas, and a procedure for foaming by heating the resin sheet containing inert gas at a temperature higher than the softening temperature of thermoplastic resin, under normal pressure.

摘要翻译： 具有高反射率和优异的形状保持性的热塑性树脂泡沫体，适合用于照明招牌，照明灯具，显示器等的背光灯和照明箱。 热塑性树脂发泡体通过包括将由热塑性树脂（A）构成的树脂片和具有与热塑性树脂（A）具有亲和性的官能团）热塑性树脂（B）的树脂片保持在加压 惰性气体气氛使树脂片材含有惰性气体，以及在常压下在高于热塑性树脂的软化温度的温度下加热含有惰性气体的树脂片材的发泡方法。