公开(公告)号：US08708570B2

公开(公告)日：2014-04-29

申请号：US13517376

申请日：2010-11-29

申请人： Mitsuru Umekida ,  Shin Tomogami ,  Kiyotake Shibata ,  Yuichi Asano ,  Hisaaki Kura

发明人： Mitsuru Umekida ,  Shin Tomogami ,  Kiyotake Shibata ,  Yuichi Asano ,  Hisaaki Kura

IPC分类号： F16C33/64

CPC分类号： B60B27/0094 ,  B60B27/0005 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0084 ,  B60Y2200/11 ,  F16C19/186 ,  F16C33/586 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/072 ,  F16D1/0858 ,  F16D3/223 ,  F16D2001/103 ,  F16D2003/22326

摘要： A hub wheel (21) and an outer joint member (3) are coupled to each other through intermediation of a recess-projection fitting structure (M). The recess-projection fitting structure (M) can be separated by being applied with a pulling-out force in an axial direction under a state in which a bolt member (30) is removed, and can be re-formed by re-screwing the bolt member (30) into a bolt hole (5d). The hub wheel (21) comprises a receiving portion (23a) for receiving the bolt member (30). The shaft portion (5) has a small diameter portion (5a) serving as a fit-in portion to be fitted along an inner periphery of the receiving portion (23a) under a state in which the recess-projection fitting structure (M) is formed. The small diameter portion (5a) is used as a part for confirming the accuracy and the state of the recess-projection fitting structure (M).

摘要翻译： 轮毂轮（21）和外接头构件（3）通过凹凸装配结构（M）相互联接。 通过在螺栓构件（30）被移除的状态下通过施加沿轴向的拉出力，可以使凹凸装配结构（M）分离，并且可以通过重新拧紧 螺栓构件（30）插入螺栓孔（5d）中。 轮毂（21）包括用于容纳螺栓件（30）的接收部分（23a）。 所述轴部（5）具有作为所述嵌合部的小直径部（5a），所述小直径部在所述凹凸嵌合结构（M）为 形成。 小直径部分（5a）用作确认凹凸装配结构（M）的精度和状态的一部分。

公开(公告)号：US08614119B2

公开(公告)日：2013-12-24

申请号：US13596758

申请日：2012-08-28

申请人： Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

发明人： Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

公开(公告)号：US08323117B2

公开(公告)日：2012-12-04

申请号：US12599536

申请日：2008-05-14

申请人： Tohru Nakagawa ,  Yuichi Asano ,  Masahiro Ozawa

发明人： Tohru Nakagawa ,  Yuichi Asano ,  Masahiro Ozawa

IPC分类号： F16D3/224

CPC分类号： F16D1/0858 ,  B60B27/0005 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0084 ,  B60B27/0094 ,  B60B35/128 ,  B60B35/18 ,  B60B2310/208 ,  B60B2310/305 ,  B60B2310/316 ,  B60B2310/54 ,  B60B2360/102 ,  B60B2900/111 ,  B60B2900/112 ,  B60Y2200/11 ,  F16C19/186 ,  F16C2326/02 ,  F16D1/072 ,  F16D3/2237 ,  F16D3/224 ,  F16D2003/22326 ,  F16D2250/00 ,  F16D2300/10 ,  Y02T10/86 ,  Y10T29/49682

摘要： A wheel bearing device, a method of assembling a wheel bearing device, an assembly configured by the wheel bearing device and a drive shaft, and a method of assembling the assembly, in which the wheel bearing device eliminates a nut tightening operation, is capable of reducing costs, and has a projection and recess mating structure that can firmly connect an outer joint member and a hub. Axial direction load is applied to a stepped surface is provided on an outer diameter surface of an outer joint member. A projection that extends in the axial direction and is provided on one of a stem shaft of the outer joint member and an inner diameter surface of a hole section of a hub is press-fitted into a partner member along the axial direction, As a result, a recess that is in close contact with the projection over an overall mating contact area is formed in the partner member, thereby configuring a projection and recess mating structure.

摘要翻译： 车轮轴承装置，组装车轮轴承装置的方法，由车轮轴承装置和驱动轴构成的组件以及组装的方法，其中车轮轴承装置消除螺母拧紧操作，能够 降低成本，并且具有能够牢固地连接外侧接头构件和轮毂的突出凹部配合结构。 在外接头部件的外径面上设置向台阶面施加轴向载荷。 沿轴向延伸并且设置在外侧接头构件的杆轴和轮毂的孔部的内径面中的一个上的突起沿着轴向压入配合构件。结果， 在配合构件中形成了与整个配合接触区域上的突起紧密接触的凹部，从而构成突出和凹入配合结构。

公开(公告)号：US20110316131A1

公开(公告)日：2011-12-29

申请号：US13023962

申请日：2011-02-09

申请人： Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

发明人： Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

摘要翻译： BGA型半导体器件包括：具有布线和电极的衬底; 设置在所述基板上的具有矩形平面形状的半导体元件和沿着所述半导体元件的每一侧设置的多个电极; 将半导体元件上的电极与基板上的电极连接的多条导线; 散热构件，设置在所述基板上，覆盖所述半导体元件，并且具有形成在与所述半导体元件的每一侧形成的所述电极连接的所述多根导线的顶点部分的区域中形成的开口; 以及用于覆盖和密封半导体元件和散热构件的密封树脂构件。

公开(公告)号：US20110166255A1

公开(公告)日：2011-07-07

申请号：US13003423

申请日：2009-07-10

申请人： Toru Noguchi ,  Hiroyuki Ueki ,  Yuichi Asano

发明人： Toru Noguchi ,  Hiroyuki Ueki ,  Yuichi Asano

IPC分类号： C08K13/04 ,  C08J3/20 ,  C08L23/16 ,  B82B1/00

CPC分类号： C09K3/10 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/20 ,  C01B2202/32 ,  C01B2202/34 ,  C01B2202/36 ,  C01P2002/82 ,  C01P2006/80 ,  C08J5/005 ,  C08J2323/16 ,  C09K2200/0208 ,  C09K2200/0282 ,  C09K2200/0617 ,  C09K2200/062 ,  F16K1/2265

摘要： Disclosed is a method for producing a sealing member for piping materials having excellent chlorine resistance, which includes a first step and a second step. The first step is a step wherein first carbon nanofibers produced by vapor deposition are subjected to an oxidation treatment, thereby obtaining second carbon nanofibers each having an oxidized surface. The second step is a step wherein carbon black having an average particle diameter of from 50 nm to 10 μm and the second carbon nanofibers are mixed into an ethylene-propylene rubber and dispersed in the ethylene-propylene rubber by a shearing force.

摘要翻译： 公开了一种具有优异耐氯性的管道材料用密封材料的制造方法，其包括第一工序和第二工序。 第一步是通过气相沉积制造的第一碳纳米纤维进行氧化处理，从而获得各自具有氧化表面的第二碳纳米纤维。 第二步是将平均粒径为50nm〜10μm的碳黑和第二碳纳米纤维混合成乙丙橡胶，通过剪切力分散在乙丙橡胶中的工序。

公开(公告)号：US07781259B2

公开(公告)日：2010-08-24

申请号：US11516584

申请日：2006-09-07

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的基板的通气端边缘部分的厚度小于基板的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。

公开(公告)号：US20100209035A1

公开(公告)日：2010-08-19

申请号：US12675172

申请日：2008-08-25

申请人： Masahiro Ozawa ,  Mitsuru Umekida ,  Yuichi Asano

发明人： Masahiro Ozawa ,  Mitsuru Umekida ,  Yuichi Asano

IPC分类号： F16C19/28 ,  F16B7/00

CPC分类号： F16D1/108 ,  B60B27/0005 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0084 ,  B60B27/0094 ,  F16C19/186 ,  F16C35/0635 ,  F16C2226/60 ,  F16C2326/02 ,  F16D1/0858 ,  F16D3/2237 ,  F16D2001/103 ,  F16D2003/22326 ,  F16D2250/00 ,  Y10T403/7026

摘要： Provided is a bearing device for a wheel capable of suppressing a backlash in a circumferential direction, excellent in coupling operability of a hub wheel and an outer joint member of a constant velocity universal joint, and excellent in maintenance property by allowing separation of the hub wheel and the outer joint member of the constant velocity universal joint from each other. In the bearing device for a wheel, a hub wheel (1), a double-row roller bearing (2), and a constant velocity universal joint (3) are unitized together, and the hub wheel (1) and a shaft section (12) of an outer joint member of the constant velocity universal joint (3) are separably coupled with each other through intermediation of a recess-projection fitting structure (M), the shaft section (12) being inserted in a fitting manner into a hole portion (22) of the hub wheel (1). Projecting portions (35) provided on one of an outer surface of the shaft section (12) of the outer joint member and an inner surface (37) of the hole portion (22) of the hub wheel (1) and extending in an axial direction are press-fitted along the axial direction into the other, and recessed portions (36) are formed with the projecting portions (35) so as to be held in close contact with the projecting portions (35) in a fitting manner on the other. Thus, the recess-projection fitting structure (M) is realized, in which the projecting portions (35) and the recessed portions (36) are held in close contact with each other through intermediation of an entire region of fitting contact regions (38) therebetween. The recess-projection fitting structure (M) allows separation by being applied with a pulling-out force in the axial direction.

摘要翻译： 本发明提供一种用于车轮的轴承装置，其能够抑制圆周方向上的间隙，轮毂轮和等速万向接头的外侧接头构件的联接可操作性优异，并且通过允许轮毂轮 和等速万向接头的外接头构件。 在用于车轮的轴承装置中，将轮毂轮（1），双列滚子轴承（2）和等速万向接头（3）组合在一起，并且轮毂轮（1）和轴部（ 等速万向接头（3）的外接头构件通过凹凸嵌合结构（M）彼此分离地连接，轴部12以嵌合方式插入孔中 轮毂轮（1）的部分（22）。 设置在所述外侧接头部件的轴部（12）的外表面的一方的突出部（35）和所述轮毂圈（1）的所述孔部（22）的内表面（37） 方向沿轴向压入另一方，并且凹部（36）形成有突出部（35），以与另一方的嵌合方式与突出部（35）保持紧密接触 。 因此，实现了突起部（35）和凹部（36）通过配合接触区域（38）的整个区域彼此紧密接触而保持的凹凸嵌合结构（M） 之间。 凹凸装配结构（M）通过在轴向上施加拉拔力而允许分离。

公开(公告)号：US20090162134A1

公开(公告)日：2009-06-25

申请号：US12308103

申请日：2007-04-12

申请人： Yoshikazu Fukumura ,  Hisaaki Kura ,  Shin Tomogami ,  Tohru Nakagawa ,  Yuichi Asano

发明人： Yoshikazu Fukumura ,  Hisaaki Kura ,  Shin Tomogami ,  Tohru Nakagawa ,  Yuichi Asano

IPC分类号： F16D1/06

CPC分类号： F16D1/072 ,  F16D3/223 ,  F16D2001/103 ,  F16D2003/22313 ,  Y10S464/906 ,  Y10T403/10 ,  Y10T403/4966

摘要： The present invention firmly connects an inner joint component and a shaft of a constant velocity universal joint, making it difficult for backlash to occur. An axis hole inner diameter 26 of an inner member 20 of the constant velocity universal joint is unhardened, and a spline 54 serving as a recess and projection section running along a circumferential direction is formed on an axial end outer diameter 52 of the shaft 50. A hardened layer n is formed on the axial end outer diameter 52 of the shaft 50. The shaft 50 and the inner member 20 are joined by an axial end of the shaft 50 being pressed into the axis hole inner diameter of the inner member 20 to incuse a shape of said recess and projection section onto the axis hole inner diameter 26 of the inner member 20.

摘要翻译： 本发明将内接头部件和等速万向接头的轴牢固地连接起来，从而难以产生齿隙。 等速万向接头的内部构件20的轴孔内径26未硬化，并且在轴50的轴向端部外径52上形成有用作沿圆周方向延伸的凹部和突出部的花键54。 在轴50的轴向外径52上形成有硬化层n。轴50和内部构件20通过将轴50的轴向端压入内部构件20的轴孔内径而连接到 将所述凹部和突起部分的形状嵌入到内部构件20的轴孔内径26上。

公开(公告)号：US20070010046A1

公开(公告)日：2007-01-11

申请号：US11516584

申请日：2006-09-07

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的衬底的通气端边缘部分的厚度小于衬底的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。

公开(公告)号：US09511629B2

公开(公告)日：2016-12-06

申请号：US14269474

申请日：2014-05-05

申请人： Akira Torii ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano ,  Mitsuru Umekida ,  Hisaaki Kura ,  Shin Tomogami

发明人： Akira Torii ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano ,  Mitsuru Umekida ,  Hisaaki Kura ,  Shin Tomogami

IPC分类号： F16C33/58 ,  F16C19/18 ,  B60B27/00 ,  F16C33/54 ,  F16C33/64 ,  F16C35/063

CPC分类号： B60B27/0078 ,  B60B27/0005 ,  B60B27/0042 ,  B60B27/0084 ,  B60B27/0094 ,  B60B2310/316 ,  B60B2380/12 ,  F16C19/186 ,  F16C33/64 ,  F16C35/063 ,  F16C35/0635 ,  F16C2326/02 ,  F16D2001/103 ,  Y10T29/49536 ,  Y10T403/7021 ,  Y10T403/7026

摘要： A bearing device includes a recess-projection fitting structure in which a hub wheel and a shaft section, which is fitted in a hole of the hub wheel of the outer joint member of the constant velocity universal joint, are unitized together. In the recess-projection fitting structure, entire fitting regions among projections on the outer surface of the shaft section of the outer joint member and recesses, which fit on the projections, are brought into intimate contact with each other.

摘要翻译： 一种轴承装置包括凹凸装配结构，其中嵌入在等速万向接头的外接头构件的轮毂轮的孔中的轮毂轮和轴部分组合在一起。 在凹凸装配结构中，外接头构件的轴部的外表面的突起之间的整体嵌合区域和配合在突起上的凹部彼此紧密接触。