中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

60 records (took 0.021 seconds)

    ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS
    33.
    发明申请
    ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS 审中-公开
    高级抛光垫材料和配方

    公开(公告)号：US20160136787A1

    公开(公告)日：2016-05-19

    申请号：US15002384

    申请日：2016-01-20

    Applicant: Applied Materials, Inc.

    Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Ashwin Chockalingam

    IPC: B24D11/00 ,  B24B37/24 ,  B24D3/28

    CPC classification number: B24D11/001 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/04 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。

    Integrating 3D printing into multi-process fabrication schemes
    38.
    发明授权
    Integrating 3D printing into multi-process fabrication schemes 有权

    公开(公告)号：US11241839B2

    公开(公告)日：2022-02-08

    申请号：US16289213

    申请日：2019-02-28

    Applicant: Applied Materials, Inc.

    Inventor： William H. McClintock ,  Rajeev Bajaj ,  Jason G. Fung ,  Daniel Redfield

    IPC: B29C64/00 ,  B29C64/393 ,  G01B9/02 ,  G06F9/30 ,  B33Y50/02

    Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

    Fabrication of polishing pad by additive manufacturing onto mold
    39.
    发明授权
    Fabrication of polishing pad by additive manufacturing onto mold 有权

    公开(公告)号：US10967482B2

    公开(公告)日：2021-04-06

    申请号：US15922813

    申请日：2018-03-15

    Applicant: Applied Materials, Inc.

    Inventor： Daniel Redfield

    IPC: B29C64/245 ,  B33Y10/00 ,  B29C64/112 ,  B24B53/017 ,  B33Y80/00 ,  B29C64/209 ,  B29C64/393 ,  B29C64/129 ,  B24B57/02

    Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes dispensing a first plurality of first layers from a first plurality of successive layers by, for each respective first layer of the first plurality of first layers, ejecting droplets of polishing layer precursor into gaps between projections from a support to form the respective first layer, and curing the respective first layer before depositing a subsequent first layer, and dispensing a second plurality of layers from the first plurality of successive layers over the first plurality of layers by, for each respective second layer of the second plurality of layers, ejecting droplets of the polishing layer precursor to form the respective second layer, each respective second layer spanning the projections and the gaps, and curing the respective second layer before depositing a subsequent second layer, and removing the polishing layer from the support.

Patent Agency Ranking