公开(公告)号：US08659142B2

公开(公告)日：2014-02-25

申请号：US13440290

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/04 ,  H05K7/00 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L25/0657 ,  G06F1/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

摘要： A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically interconnect terminals of the first package with corresponding terminals of the second package. Each package can include a substrate having first and second surfaces, a microelectronic element, conductive structure extending above a front face of the microelectronic element, and parallel columns of terminals at the second surface. The terminals of each package can include first terminals in a central region of the respective second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the respective microelectronic element. Each central region can have a width within three and one-half times a minimum pitch between adjacent terminals.

摘要翻译： 微电子组件可以包括具有在每个表面处的第一和第二表面和面板触点的电路板，以及分别在第一表面和第二表面处安装到面板触点的端子的第一和第二微电子封装。 电路板可以将第一封装的端子与第二封装的相应端子电互连。 每个封装可以包括具有第一表面和第二表面的基底，微电子元件，在微电子元件的前表面上方延伸的导电结构，以及在第二表面处的平行的端子列。 每个封装的端子可以包括在相应的第二表面的中心区域中的第一端子，并且被配置为承载可由封装内的电路使用的地址信息，以确定相应微电子元件内的可寻址存储器位置。 每个中心区域可以具有在相邻端子之间的最小间距的三倍和五倍的宽度。

公开(公告)号：US08659140B2

公开(公告)日：2014-02-25

申请号：US13439317

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/04 ,  H05K7/00 ,  H05K1/18 ,  H01L21/82

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with at least one external component. The substrate can have substrate contacts on the first surface facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子封装可以包括其上具有面和多个元件接触的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与至少一个外部元件连接的第二表面上的端子。 衬底可以在面向微电子元件的元件触点的第一表面上具有衬底接触并与其接合。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US08653646B2

公开(公告)日：2014-02-18

申请号：US13440199

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H05K7/00 ,  H05K1/18

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85

摘要： A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 具有存储器阵列的微电子元件具有背向微电子封装的衬底的前表面，并且通过在前表面上方延伸的导电结构与衬底电连接。 第一端子设置在封装的第一和第二平行格栅内的位置。 每个网格的第一终端被配置为承载可用于从存储器存储阵列的所有可用可寻址存储器位置中确定可寻址存储器位置的地址信息。 第一网格中的第一终端具有作为第二网格中的第一终端的信号分配的镜像的信号分配。

公开(公告)号：US08513817B2

公开(公告)日：2013-08-20

申请号：US13346201

申请日：2012-01-09

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

IPC分类号： H01L23/52

CPC分类号： H01L25/0655 ,  G11C5/04 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01076 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，第一，第二，第三和第四微电子元件以及在第二表面处暴露的多个端子。 每个微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 微电子元件的前表面可以布置在平行于第一表面的单个平面中。 每个微电子元件可以具有在前表面处暴露并且沿着相应的第一，第二，第三和第四轴线布置的触点列。 第一和第三轴线可以彼此平行。 第二和第四轴线可以横向于第一和第三轴线。 微电子封装还可以包括从每个微电子元件的至少一些触点延伸到至少一些端子的电连接。

公开(公告)号：US08441111B2

公开(公告)日：2013-05-14

申请号：US13440515

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L21/02

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底以及在第一和第二表面之间延伸的第一和第二孔，第一和第二微电子元件各自具有面向衬底的第一表面的表面， 并且在每个微电子元件的触点和端子之间电连接引线。 孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 第二表面的中心区域可以设置在第一和第二轴线之间。 终端可以被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。

公开(公告)号：US20130082398A1

公开(公告)日：2013-04-04

申请号：US13440313

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G06F1/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

摘要： A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between any two adjacent columns of the terminals. The axial plane can intersect the central region.

摘要翻译： 微电子封装可以包括衬底和微电子元件，微电子元件具有面向衬底的第一表面的后表面，正面和沿第一方向延伸的元件触点列。 微电子元件的边缘可以限定在垂直于后表面的第一方向和第三方向上延伸的轴向平面。 封装可以包括在基板的第二表面处沿第一方向延伸的端子列。 终端可以包括暴露在第二表面的中心区域中的第一终端，并且被配置为承载可用于封装内的电路的地址信息，以确定微电子元件内的可寻址存储器位置。 中心区域可以具有不超过端子的任何两个相邻列之间的最小间距的三倍和五倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US20130082396A1

公开(公告)日：2013-04-04

申请号：US13440199

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85

摘要： A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

公开(公告)号：US20130082394A1

公开(公告)日：2013-04-04

申请号：US13337565

申请日：2011-12-27

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/538

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The second surface can have a central region disposed between the first and second axes. Each microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function. The terminals can be configured to carry all of the address signals transferred to the microelectronic package.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底以及在第一和第二表面之间延伸的第一和第二孔，第一和第二微电子元件各自具有面向衬底的第一表面的表面， 并且在每个微电子元件的触点和端子之间电连接引线。 孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 第二表面可以具有设置在第一和第二轴之间的中心区域。 每个微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。 这些端子可以被配置为承载传送到微电子封装的所有地址信号。

公开(公告)号：US20130082390A1

公开(公告)日：2013-04-04

申请号：US13440280

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85

摘要： A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子组件可以包括与电路板连接的微电子封装。 封装具有微电子元件，其具有背向封装的衬底的前表面，并且通过在前表面上方延伸的导电结构与衬底电连接。 提供在第一和第二并联栅格中或第一和第二单独列中的第一端子可被配置为承载可用于从存储器存储阵列的所有可寻址的存储器位置中确定可寻址存储器位置的地址信息。 第一网格中的第一终端可以具有作为第二网格中的第一终端的信号分配的镜像的信号分配。

公开(公告)号：US20130015586A1

公开(公告)日：2013-01-17

申请号：US13306068

申请日：2011-11-29

申请人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L23/48 ,  G11C5/06 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.

摘要翻译： 微电子封装可以具有设置在其面上的多个端子，其被配置为连接到至少一个外部部件。 例如电路板。 第一和第二微电子元件可以用其中的包装结构固定。 第一电连接可以从封装的相应端子延伸到第一微电子元件上的相应触点，并且第二电连接可以从相应端子延伸到第二微电子元件上的相应触点，第一和第二连接是 被配置为使得由每个组中的第一和第二连接承载的相应信号在相应的终端和与其耦合的每个对应的触点之间经历相同持续时间的传播延迟。