公开(公告)号：US08252363B2

公开(公告)日：2012-08-28

申请号：US12619954

申请日：2009-11-17

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B05D5/12

CPC classification number: H01L24/97 ,  H01L23/147 ,  H01L23/49816 ,  H01L27/1469 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2224/0401

Abstract: The invention relates to a method of thinning a block transferred to a substrate. According to the invention, the method includes depositing a stop layer at least onto the substrate and in a way adjacent to and contiguous with the transferred block. The stop layer is made out of material of greater resistance or hardness than the material of the transferred block and of smaller thickness than that of the transferred block. The method further includes actuating the thinning of the transferred block. The thinning time is pre-programmed as a function of a predetermined speed of thinning the transferred block, the thinning time being selected so that the thinning also attacks the stop layer.

Abstract translation: 本发明涉及一种减少转移到基底上的块的方法。 根据本发明，该方法包括至少将沉积层沉积在衬底上并且以与传送块相邻并邻接的方式沉积。 止挡层由比转移块的材料更大的阻力或硬度的材料制成，并且厚度小于转移块的厚度。 该方法还包括致动转移块的变薄。 减薄时间被预编程为预定的传送块的细化速度的函数，选择间隔时间使得稀疏化也攻击停止层。

公开(公告)号：US08097827B2

公开(公告)日：2012-01-17

申请号：US12055716

申请日：2008-03-26

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B23K11/00

CPC classification number: H01L24/81 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/81007 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for soldering or hybridizing two components including preparing, on opposing surfaces of the components to be welded or hybridized, a wettability surface, depositing on one of the wettability surfaces an appropriate quantity of solder material, constituting a soldering or hybridizing dot, contacting the wettability surfaces of the components with the solder material deposited, then raising the temperature of the chamber in which the components are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect. At least one of the components is in contact with a conducting track having another quantity of solder material that constitutes a sacrificial dot, having a contact area with the at least one component that is higher than that of the solder quantity that constitutes the soldering or hybridizing dot.

Abstract translation: 一种用于焊接或杂化两种组分的方法，包括在待焊接或杂化的组分的相对表面上制备润湿性表面，在润湿性表面之一上沉积合适量的焊料，构成焊接或杂化点， 沉积焊料材料的部件的润湿性表面，然后将组件所在的腔室的温度升高至至少焊料材料的熔点，以确保两个部件的有效焊接或杂化在一起，由此 重熔效果。 至少一个部件与具有构成牺牲点的另一数量的焊料材料的导电轨道接触，该焊料材料与至少一个部件的接触面积高于构成焊接或杂化的焊料量的至少一个部件 点。

公开(公告)号：US07772041B2

公开(公告)日：2010-08-10

申请号：US12013624

申请日：2008-01-14

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H01L21/00

CPC classification number: B81C1/00269 ,  B81C3/002 ,  B81C2203/019 ,  B81C2203/032 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81054 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/49002 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of sealing or welding two elements to one another in a chamber under vacuum or controlled atmosphere. The method comprises steps consisting of: producing a wettability area on opposing faces of the elements to be welded, with one of the areas comprising a layer of gold and having a surface area greater than the surface area of the other wettability area; depositing a quantity of suitable sealing material comprising indium on one of the areas; bringing the wettability area of the other element into contact with the material thus deposited; and raising the temperature of the chamber containing the elements to be welded or sealed to at least 250° C. in a non-oxidizing atmosphere, in order to seal the two elements effectively to one another by means of remelting.

Abstract translation: 一种在真空或受控气氛下在腔室中彼此密封或焊接彼此的元件的方法。 该方法包括以下步骤：在要焊接的元件的相对面上产生润湿性区域，其中一个区域包括一层金，其表面积大于另一个润湿性区域的表面积; 在其中一个区域上沉积一定量的包含铟的合适的密封材料; 使另一元件的润湿性区域与这样沉积的材料接触; 以及在非氧化气氛中将含有要焊接或密封的元件的室的温度升高至少250℃，以便通过重熔将两个元件有效地彼此密封。

公开(公告)号：US20100124604A1

公开(公告)日：2010-05-20

申请号：US12619954

申请日：2009-11-17

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B05D5/12 ,  C25D5/48 ,  C23C28/00

CPC classification number: H01L24/97 ,  H01L23/147 ,  H01L23/49816 ,  H01L27/1469 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2224/0401

Abstract: The invention relates to a method of thinning a block transferred to a substrate. According to the invention, the method includes depositing a stop layer at least onto the substrate and in a way adjacent to and contiguous with the transferred block. The stop layer is made out of material of greater resistance or hardness than the material of the transferred block and of smaller thickness than that of the transferred block. The method further includes actuating the thinning of the transferred block. The thinning time is pre-programmed as a function of a predetermined speed of thinning the transferred block, the thinning time being selected so that the thinning also attacks the stop layer.

Abstract translation: 本发明涉及一种减少转移到基底上的块的方法。 根据本发明，该方法包括至少将沉积层沉积在衬底上并且以与传送块相邻并邻接的方式沉积。 止挡层由比转移块的材料更大的阻力或硬度的材料制成，并且厚度小于转移块的厚度。 该方法还包括致动转移块的变薄。 减薄时间被预编程为预定的传送块的细化速度的函数，选择间隔时间使得稀疏化也攻击停止层。

公开(公告)号：US20080146071A1

公开(公告)日：2008-06-19

申请号：US11662964

申请日：2005-09-29

Applicant: Cecile Davoine ,  Francois Marion

Inventor： Cecile Davoine ,  Francois Marion

IPC: H01R4/26

CPC classification number: H05K13/0469 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/81345 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0278 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: This invention relates to a process for making an electrical connection between a first component (10) comprising a set of first pads (8) and a set of hard conducting tips (13) on one face, and a second component (11) comprising a set of second pads (9) and a set of ductile conducting bumps (14) on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips (13) can penetrate into these bumps (14), in which the space between two tips (13) is less than the width of a bump (14) and less than the width of a first pad (8).The invention also relates to such a component on which such a set of conducting tips is installed.

Abstract translation: 本发明涉及一种用于在包括一组第一焊盘（8）和一组在一个表面上的一组硬导电尖端（13）的第一部件（10）之间进行电连接的方法，以及第二部件（11） 一组第二垫（9）和另一面上的一组延性导电凸块（14），其中两个面相互面对，并且它们彼此相向，使得尖端（13）可以渗入 这些凸起（14），其中两个尖端（13）之间的空间小于凸块（14）的宽度并小于第一焊盘（8）的宽度。 本发明还涉及安装这样一组导电尖端的这种部件。

公开(公告)号：US20070111567A1

公开(公告)日：2007-05-17

申请号：US10577142

申请日：2004-10-28

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H01R13/648

CPC classification number: H01L24/92 ,  H01L23/3185 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L25/18 ,  H01L27/148 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.

Abstract translation: 本发明涉及一种电子设备，包括：电路，包括第一和第二面，所述第一面设置有电连接装置，传输元件，包括第一面和第二面，并被组装到所述第二面 的有源元件的第一面，并且在其第二面上包括电连接装置，有源元件的电连接装置与传输元件的电连接装置之间的连接。

公开(公告)号：US5968389A

公开(公告)日：1999-10-19

申请号：US811046

申请日：1997-03-04

Applicant: Francois Marion ,  Jean-Marc DeBono ,  Jean-Louis Pornin ,  Bernard Tucek

Inventor： Francois Marion ,  Jean-Marc DeBono ,  Jean-Louis Pornin ,  Bernard Tucek

IPC: H01L23/12 ,  B23K1/00 ,  H01L21/60 ,  H01L23/34 ,  H05K3/34 ,  H01L21/58

CPC classification number: H01L24/81 ,  B23K1/0016 ,  H01L23/345 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3431 ,  H05K3/3494

Abstract: A method and device for hybridization of components by solder beads on a substrate using an oven, comprising: raising the temperature of a heating element of the oven, with no contact either with substrate or with component, bringing substrate into thermal contact with heating element for time .DELTA.t, and uncoupling substrate and heating element at the end of time .DELTA.t.

Abstract translation: 一种用于使用烘箱在焊盘上通过焊料珠杂质组分的方法和装置，包括：提高烘箱加热元件的温度，不与衬底或组件接触，使衬底与加热元件热接触， 时间DELTA t，并在时间结束DELTA t解耦衬底和加热元件。

公开(公告)号：US5496769A

公开(公告)日：1996-03-05

申请号：US227503

申请日：1994-04-14

Applicant: Francois Marion ,  Michelle Boitel

Inventor： Francois Marion ,  Michelle Boitel

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/44

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/28 ,  B29C2043/5825 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49146

Abstract: The invention relates to a process for coating electronic components mounted on a substrate using a bump or ball hybridization method. It also relates to the coated electronic component obtained by performing this process. The process comprises placing bumps on the substrate, around an electronic component in order to form a bump belt or carpet contiguous with said electronic component and depositing at least one drop of a coating substance on said bump belt, the bumps of the belt impregnated with the substance being able to make said substance migrate by capillarity towards the bumps located between said electronic component and said substrate. The invention has applications in microelectrics, data processing and optoelectronics.

Abstract translation: 本发明涉及使用凸块或球杂交法涂覆安装在基板上的电子部件的方法。 它还涉及通过执行该方法获得的涂覆的电子部件。 该方法包括在基板周围放置凸块，围绕电子部件，以形成与所述电子部件邻接的凸起带或地毯，并将至少一滴涂层物质沉积在所述凸块带上， 物质能够使所述物质通过毛细作用迁移到位于所述电子部件和所述基板之间的凸块。 本发明适用于微电子，数据处理和光电子学。