公开(公告)号：US07586190B2

公开(公告)日：2009-09-08

申请号：US10529626

申请日：2003-09-29

申请人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

发明人： Georg Bogner ,  Patrick Kromotis ,  Ralf Mayer ,  Heinrich Noll ,  Matthias Winter

IPC分类号： H01L23/34

CPC分类号： H01L33/64 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

摘要翻译： 一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热器（12）的载体（22）上。 外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。 这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

公开(公告)号：US5981945A

公开(公告)日：1999-11-09

申请号：US614836

申请日：1996-03-08

申请人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

发明人： Werner Spaeth ,  Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich

IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H01J5/02

CPC分类号： H01L33/58 ,  G02B6/4204 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/32225

摘要： An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.

摘要翻译： 光电转换器包括基板，设置在基板上的辐射发射或透射半导体部件，瞄准半导体部件的光学透镜系统和连接到透镜系统的基板的间隔件。 基板，间隔件和透镜系统由具有至少相似的热膨胀系数的材料形成。 一种光电子换能器的制造方法包括：在基板中形成用于接收半导体部件的凹陷部，同时留下残留在每个压痕的至少一侧上的焊盘。 基板的尺寸的第一板被放置在平台上，并通过材料锁定而接合到平台上。 第一板在连接到基板的间隔件之间移除。 根据预定的格栅图案将多个半导体部件插入到凹陷中，并且与基板接合以形成基板。 在将第二板的透镜系统放置在相同的格栅图案中的同时，用包括多个半导体部件的多个透镜系统的第二板覆盖基板。 相对于基板调整第二板，以将每个透镜系统瞄准相应的一个半导体部件。 第二板固定在基板上。

公开(公告)号：US5907151A

公开(公告)日：1999-05-25

申请号：US863357

申请日：1997-05-27

申请人： Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich ,  Martin Weigert

发明人： Wolfgang Gramann ,  Georg Bogner ,  Ralf Dietrich ,  Martin Weigert

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58 ,  H01J40/14

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L33/0095

摘要： An optoelectronic transducer has a radiation-emitting and/or radiation-receiving body on a carrier unit. The carrier unit has a mounting surface provided with a number of terminal parts. The terminal parts are provided with electrical terminal areas defining a contacting plane. The distance of the contacting plane from the mounting surface is greater than a maximum height of the body from the mounting surface, including all optional electrical conductors and covers.

摘要翻译： 光电转换器在载体单元上具有辐射发射和/或辐射接收体。 承载单元具有设置有多个端子部的安装面。 端子部分设置有限定接触平面的电端子区域。 接触平面与安装表面的距离大于主体与安装表面的最大高度，包括所有可选的电导体和盖。

公开(公告)号：US08890306B2

公开(公告)日：2014-11-18

申请号：US13808300

申请日：2011-05-24

申请人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

发明人： Joachim Reill ,  Georg Bogner ,  Stefan Grötsch

IPC分类号： H01L23/15 ,  H01L23/08 ,  H01L33/64 ,  H01L25/075 ,  H05K1/02 ,  H01L23/10 ,  H05K1/05 ,  H01L33/62

CPC分类号： H01L25/13 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0203 ,  H05K1/05 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

摘要： A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.

摘要翻译： 发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括 所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面 二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

公开(公告)号：US08772065B2

公开(公告)日：2014-07-08

申请号：US13611890

申请日：2012-09-12

申请人： Georg Bogner ,  Karlheinz Arndt

发明人： Georg Bogner ,  Karlheinz Arndt

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L23/49805 ,  H01L24/48 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

摘要翻译： 具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面， 并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向 与安装表面（19）的关系。 此外，提供了一种用于生产包装体（1）的方法。

公开(公告)号：US08283684B2

公开(公告)日：2012-10-09

申请号：US12443155

申请日：2007-09-19

申请人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

发明人： Reiner Windisch ,  Ralph Wirth ,  Stefan Groetsch ,  Georg Bogner ,  Guenter Kirchberger ,  Klaus Streubel

IPC分类号： H01L33/00

CPC分类号： H01L27/15 ,  H01L24/24 ,  H01L25/0756 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/32145 ,  H01L2924/0002 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

摘要： An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.

摘要翻译： LED半导体体包括多个至少两个辐射生成有源层。 每个有源层具有正向电压，其中有源层的数量适应于工作电压，使得跨过与有源层串联连接的串联电阻器上的电压与电压下降最多相同的大小 跨越LED半导体体。 本发明还描述了LED半导体本体的各种用途。

公开(公告)号：US08110437B2

公开(公告)日：2012-02-07

申请号：US10514461

申请日：2003-05-14

申请人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

发明人： Gunter Waitl ,  Georg Bogner ,  Michael Hiegler ,  Matthias Winter

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L21/52 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.

摘要翻译： 辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。 通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

公开(公告)号：US07838357B2

公开(公告)日：2010-11-23

申请号：US10494160

申请日：2002-10-28

申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

IPC分类号： H01L218/8238

CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

公开(公告)号：US20100270578A1

公开(公告)日：2010-10-28

申请号：US12742064

申请日：2008-12-09

申请人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

发明人： Joerg Erich Sorg ,  Stefan Gruber ,  Georg Bogner

IPC分类号： H01L33/62 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.

摘要翻译： 发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。 作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

公开(公告)号：US20070253667A1

公开(公告)日：2007-11-01

申请号：US10593794

申请日：2005-03-09

申请人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

发明人： Herbert Brunner ,  Matthias Winter ,  Markus Zeiler ,  Georg Bogner ,  Thomas Hofer

IPC分类号： H01L31/0203

CPC分类号： H01L33/60 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/486 ,  H01L33/54 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02292 ,  H01L2924/00

摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.

摘要翻译： 提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13） 导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型 彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。