公开(公告)号：US09877383B2

公开(公告)日：2018-01-23

申请号：US15423833

申请日：2017-02-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K1/11

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US09875986B2

公开(公告)日：2018-01-23

申请号：US15053723

申请日：2016-02-25

Applicant: International Business Machines Corporation

Inventor： Katsuyuki Sakuma ,  Thomas Weiss

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/75 ,  H01L2224/03464 ,  H01L2224/03823 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/75901 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/81048 ,  H01L2224/81075 ,  H01L2224/81121 ,  H01L2224/812 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81898 ,  H01L2224/81935 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/00012

Abstract: A fluxless bonding process is provided. An array of micro solder bumps of a first semiconductor structure is aligned to an array of bonding pads of a second semiconductor structure under an applied bonding force. An environment is provided to prevent oxides from forming on the solder bump structures and bonding pads during the bonding process. A scrubbing process is performed at a given scrubbing frequency and amplitude to scrub the micro solder bumps against the bonding pads in a direction perpendicular to the bonding. Heat is applied to at least the first semiconductor structure to melt and bond the micro solder bumps to the bonding pads. The first semiconductor structure is cooled down to solidify the molten solder. Coplanarity is maintained between the bonding surfaces of the semiconductor structures within a given tolerance during the scrubbing and cooling steps until solidification of the micro solder bumps.

公开(公告)号：US09661747B1

公开(公告)日：2017-05-23

申请号：US15193525

申请日：2016-06-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K1/02 ,  H05K3/22 ,  G08B13/12

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US09554477B1

公开(公告)日：2017-01-24

申请号：US14974036

申请日：2015-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K5/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract translation: 提供了防篡改组件和制造方法，其中包含电路板保护的外壳。 防篡改组件包括电路板和安装到电路板的电子外壳，并且便于将至少一个电子部件封闭在安全的容积内。 篡改答复电子电路结构有助于定义安全量，篡改受理电子电路结构包括篡改答复电路。 提供粘合剂以部分地将电子外壳固定到电路板。 粘合剂至少部分地接触篡改响应电路，使得电子外壳与电路板的尝试分离导致粘合剂破坏篡改响应电路，便于检测篡改的监视电路的分离 通讯电子电路结构。

公开(公告)号：US20160300780A1

公开(公告)日：2016-10-13

申请号：US15186588

申请日：2016-06-20

Applicant: International Business Machines Corporation

Inventor： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

IPC: H01L23/473 ,  F28D15/00

CPC classification number: H01L23/4735 ,  F28D15/00 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

公开(公告)号：US20160064306A1

公开(公告)日：2016-03-03

申请号：US14936902

申请日：2015-11-10

Applicant: International Business Machines Corporation

Inventor： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

IPC: H01L23/473

CPC classification number: H01L23/4735 ,  F28D15/00 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract translation: 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。

公开(公告)号：US09089052B2

公开(公告)日：2015-07-21

申请号：US14552791

申请日：2014-11-25

Applicant: International Business Machines Corporation

Inventor： Shidong Li ,  Gregg B. Monjeau ,  Kamal K. Sikka ,  Hilton T. Toy ,  Thomas Weiss

IPC: H05K1/02 ,  H01L23/02 ,  H01L23/16 ,  H01L25/065 ,  H01L23/373 ,  H01L23/433 ,  H05K5/03 ,  H01L23/36 ,  H01L23/498

CPC classification number: H05K1/0204 ,  H01L23/02 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/433 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K5/03 ,  H01L2924/00

Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.

公开(公告)号：US20140224860A1

公开(公告)日：2014-08-14

申请号：US13764254

申请日：2013-02-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Glen N. Biggs ,  Russell A. Budd ,  Benjamin V. Fasano ,  John J. Garant ,  Peter A. Gruber ,  John P. Karidis ,  Bouwe W. Leenstra ,  Phillip W. Palmatier ,  Kevin M. Prettyman ,  Christopher L. Tessler ,  Thomas Weiss

IPC: B23K3/06

CPC classification number: B23K3/0607 ,  B23K3/0638

Abstract: A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet.

Abstract translation: 填充头装置包括用于保持流体的至少一个室。 该腔室具有排出流体的出口。 真空装置具有用于与流体出口相邻的抽吸装置的入口。 多个柔性和弹性密封装置接触工件的顶表面。 密封装置定位在室出口的相对侧和真空装置入口的相对侧上，使得密封装置在由工件限定的空腔周围产生至少一个局部密封，并且空腔位于室出口和 真空出口。

公开(公告)号：US11239183B2

公开(公告)日：2022-02-01

申请号：US16779529

申请日：2020-01-31

Applicant: International Business Machines Corporation

Inventor： Tuhin Sinha ,  Krishna R. Tunga ,  Brian W. Quinlan ,  Charles Leon Arvin ,  Steven Paul Ostrander ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/14 ,  H01L21/48 ,  H01L23/66 ,  H01L23/538

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

公开(公告)号：US11235404B2

公开(公告)日：2022-02-01

申请号：US16826226

申请日：2020-03-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Luca Del Carro ,  Thomas Brunschwiler ,  Thomas Weiss ,  Chris Muzzy

IPC: B23K1/00 ,  B23K1/018 ,  B22F3/11 ,  B23K3/08 ,  B23K101/40

Abstract: Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.