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    ELECTRICAL INTERCONNECT BRIDGE
    32.
    发明申请
    ELECTRICAL INTERCONNECT BRIDGE 审中-公开

    公开(公告)号：US20200350251A1

    公开(公告)日：2020-11-05

    申请号：US16931690

    申请日：2020-07-17

    申请人： Intel Corporation

    发明人： Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI

    IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

    摘要： Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.

    SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOGENEOUS DIELECTRIC LAYER
    34.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOGENEOUS DIELECTRIC LAYER 审中-公开

    公开(公告)号：US20190279935A1

    公开(公告)日：2019-09-12

    申请号：US16349932

    申请日：2016-12-29

    申请人： Intel Corporation

    发明人： David Allen UNRUH, JR. ,  Srinivas V. PIETAMBARAM ,  Rahul N. MANEPALLI

    IPC分类号： H01L23/532 ,  H01L23/522 ,  H01L25/065 ,  H05K1/09 ,  H05K1/18 ,  H01L23/00

    摘要： Semiconductor packages including package substrates having non-homogeneous dielectric layers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package substrate includes a dielectric layer having a resin-rich region, e.g., a resin-rich sublayer, and a filler-rich region, e.g., a filler-rich sublayer. The sublayers may contain respective mixtures of an organic resin material and an inorganic filler material. The filler-rich sublayer may have a higher density of the inorganic filler material than the resin-rich sublayer. A density of the inorganic filler material may be lesser near a top surface of 0 the dielectric layer in which an electrical interconnect is embedded. The electrical interconnect may have a greater adhesion affinity to the organic resin material than the inorganic filler material, and thus, the electrical interconnect may readily attach to the functionally-graded dielectric layer.