公开(公告)号：US4817075A

公开(公告)日：1989-03-28

申请号：US21877

申请日：1987-03-04

申请人： Takashi Kikuchi ,  Naomi Amemiya ,  Masami Tsuchida ,  Shiro Suzuki ,  Masashi Tanabe

发明人： Takashi Kikuchi ,  Naomi Amemiya ,  Masami Tsuchida ,  Shiro Suzuki ,  Masashi Tanabe

IPC分类号： G11B27/024 ,  G11B27/028 ,  G11B27/10 ,  G11B17/00 ,  G11B27/08

CPC分类号： G11B27/028 ,  G11B27/105 ,  G11B2220/2545 ,  G11B2220/90 ,  G11B27/024

摘要： A digital audio player in which the pieces of music are played according to a program. The program is selected so that the total playing time does not exceed a set period of time. The selection is performed by reading playing times from a disk on which are recorded both the pieces of music and their separate playing times.

摘要翻译： 一种数字音频播放器，其中根据节目播放音乐片段。 选择该节目，使得总播放时间不超过设定的时间段。 通过从记录了两段音乐和其独立播放时间的盘读取播放时间来执行选择。

公开(公告)号：US4777547A

公开(公告)日：1988-10-11

申请号：US807368

申请日：1985-12-10

申请人： Takashi Kikuchi ,  Shigeo Aoyagi

发明人： Takashi Kikuchi ,  Shigeo Aoyagi

IPC分类号： G11B15/68

CPC分类号： G11B15/6815

摘要： An automatic changer for cassette tapes suited for the use in an automobile or the like constituted of a tape container capable of containing a plurality of cassette tapes and a table for supporting the tape container. The tape container is provided with a first engagement portion extended in the direction orthogonal to the direction in which the cassette tape is inserted into the tape container and the table is provided with a second engagement portion which engages the first engagement portion. The first engagement portion is positioned out of the center of the side plate of the tape container which is disposed in parallel with the direction in which the cassette tape is inserted and adapted to be movable relative to the second engagement portion.

摘要翻译： 一种适用于汽车等的盒式磁带自动更换装置，由可容纳多个盒式磁带的磁带容器和用于支撑磁带容器的工作台构成。 带盒设置有第一接合部，该第一接合部沿与盒带插入带容器的方向正交的方向延伸，并且台设置有与第一接合部接合的第二接合部。 第一接合部分位于与带盒插入方向平行设置并适于相对于第二接合部分可移动的带容器的侧板的中心之外。

公开(公告)号：US10230112B2

公开(公告)日：2019-03-12

申请号：US14119308

申请日：2012-05-22

申请人： Yusuke Kato ,  Takashi Ito ,  Masami Yanagida ,  Satoshi Oku ,  Hiroyuki Ogino ,  Masato Kusakabe ,  Ryutaro Mukai ,  Masahiro Kojima ,  Takashi Kikuchi ,  Akiko Waki ,  Shiho Inoue ,  Shigeo Ibuka ,  Yasuyuki Tanaka ,  Yoshio Shimoida ,  Yuji Muroya ,  Norihisa Waki

发明人： Yusuke Kato ,  Takashi Ito ,  Masami Yanagida ,  Satoshi Oku ,  Hiroyuki Ogino ,  Masato Kusakabe ,  Ryutaro Mukai ,  Masahiro Kojima ,  Takashi Kikuchi ,  Akiko Waki ,  Shiho Inoue ,  Shigeo Ibuka ,  Yasuyuki Tanaka ,  Yoshio Shimoida ,  Yuji Muroya ,  Norihisa Waki

IPC分类号： H01M4/66 ,  H01M10/052 ,  H01M4/02

摘要： A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.

公开(公告)号：US08513373B2

公开(公告)日：2013-08-20

申请号：US11663674

申请日：2005-09-20

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi

IPC分类号： C08G73/00

CPC分类号： C08J5/18 ,  C08G73/101 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071 ,  C08J2379/08 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  Y10T428/2826 ,  Y10T428/31681

摘要： A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a non-thermoplastic polyimide.

摘要翻译： 一种生产非热塑性聚酰亚胺膜的方法，其前体溶液具有高储存稳定性，即使没有昂贵的表面处理也显示出高粘附性，更具体地说，一种用于生产由非热塑性聚酰亚胺制成的非热塑性聚酰亚胺膜的方法 含有由热塑性聚酰亚胺产生的嵌段，其包含（A）在有机极性溶剂（B）中形成末端具有氨基或酸酐基的预聚物的步骤，通过使用所得预聚物合成聚酰亚胺前体溶液的步骤 ，酸酐和二胺，以使其在整个步骤中变得基本上等摩尔，（C）将含有聚酰亚胺前体溶液的成膜原液浇铸并将所得的涂料进行化学和/或 热加酰亚胺化，其中在步骤（A）中使用的二胺和酸二酐被选择为使得两者之间的反应在eq 微摩尔量可以得到热塑性聚酰亚胺，步骤（B）中得到的聚酰亚胺前体是非热塑性聚酰亚胺的前体。

公开(公告)号：US08404497B2

公开(公告)日：2013-03-26

申请号：US12946131

申请日：2010-11-15

申请人： Kazuya Maruyama ,  Toshikazu Ishikawa ,  Jun Matsuhashi ,  Takashi Kikuchi

发明人： Kazuya Maruyama ,  Toshikazu Ishikawa ,  Jun Matsuhashi ,  Takashi Kikuchi

IPC分类号： H01L21/66

CPC分类号： H01L23/49838 ,  H01L22/32 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.

摘要翻译： 公开了一种表面贴装型半导体器件。 半导体器件具有安装在其上的半导体芯片的布线基板的下表面上的测试焊盘。 具有与其分别耦合的焊料球的下表面侧焊盘和在其没有耦合的焊球的测试焊盘形成在布线基板的下表面上。 为了抑制测试台和设置在探针插座中的接地触针之间的接触不良的发生，每个测试台的直径被设定为大于每个下表面侧的直径。 即使布线基板的尺寸减小，也可以高精度地进行使用测试台面的电特性测试。

公开(公告)号：US08338560B2

公开(公告)日：2012-12-25

申请号：US11918558

申请日：2006-04-25

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi

IPC分类号： C08G73/00 ,  B32B7/12 ,  B32B15/08

CPC分类号： H05K1/0346 ,  B32B15/08 ,  C08G73/1071 ,  C08L79/08 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J2201/61 ,  C09J2479/08 ,  C09J2479/086 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  Y10T428/2826 ,  Y10T428/31681

摘要： The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan δ, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus α1 at the inflexion point (GPa) and a storage modulus α2 at 380° C. (GPa) satisfy: 85≧{(α1−α2)/α1}×100≧65. With these characteristics, the polyimide film gives an effect of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method.

摘要翻译： 本发明提供一种聚酰亚胺薄膜及其用途。 根据本发明的聚酰亚胺膜不会由于热应力而引起尺寸变化。 本发明特别涉及一种聚酰亚胺薄膜及其用途，该聚酰亚胺薄膜具有通过层叠方法抑制层叠聚酰亚胺薄膜和金属层的材料的热变形的特性。 本发明的聚酰亚胺薄膜具有以下特征：（1）储能模量的拐点为270℃〜340℃。 （2）作为通过将损失弹性模量除以储能模量而获得的值的tanδ在320℃〜410℃的范围内具有峰顶。 （3）380℃下的储能模量为0.4GPa至2.0GPa; （4）在拐点处的储能模量α1（GPa）和380℃下的储能模量α2（GPa）满足：85≥{（α1-α2）/α1}×100≥65。 通过这些特性，聚酰亚胺膜具有通过层叠法抑制层叠聚酰亚胺膜和金属层的材料的热变形的效果。

公开(公告)号：US08298366B2

公开(公告)日：2012-10-30

申请号：US13221358

申请日：2011-08-30

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H05K1/0346 ,  C09J7/25 ,  C09J2479/086 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/2852 ,  Y10T428/31678

摘要： Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E′2/E′1 between the storage elasticity modulus E′1 at 25° C. and the storage elasticity modulus E′2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 seconds under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.

摘要翻译： 公开了一种具有高尺寸稳定性的粘合膜，其可以适用于两层FPC。 具体地，公开了由绝缘层和布置在绝缘层的一侧或两侧上的粘合层构成的粘合片。 该粘合片的特征在于绝缘层在25℃下的储能弹性模量E'1与380℃下的储能弹性模量E'2之间的比率E'2 / E'1不大于 0.2，在100〜200℃下MD方向的热膨胀系数为5〜15ppm。其特征还在于，热处理后的粘合片的热膨胀系数在100〜250℃的变化 在拉伸方向下，在380℃，30秒的张力下处理30分钟，在拉伸方向垂直的方向为不大于10ppm。

公开(公告)号：US08293575B2

公开(公告)日：2012-10-23

申请号：US12834937

申请日：2010-07-13

申请人： Tatsuya Hirai ,  Tomoaki Hashimoto ,  Takashi Kikuchi ,  Masatoshi Yasunaga ,  Michiaki Sugiyama

发明人： Tatsuya Hirai ,  Tomoaki Hashimoto ,  Takashi Kikuchi ,  Masatoshi Yasunaga ,  Michiaki Sugiyama

IPC分类号： H01L23/28

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.

摘要翻译： 提高了半导体器件的可靠性。 在单独且明显地与其一体化设置的子基板（第一基底构件）和基底基板（第二基底构件）之间形成密封树脂（密封体），然后，将辅助基板电耦合到 第二个基础成员。 作为将基板与基板电连接的装置，在基板上形成的焊盘（第一焊盘）和基板上形成的焊盘（第二焊盘）配置成使其各自的位置对齐。 在从底基板的台阶朝向基板的焊盘形成通孔之后，在每个通孔中形成焊料部件（导电部件）。

公开(公告)号：US08293331B2

公开(公告)日：2012-10-23

申请号：US13369957

申请日：2012-02-09

申请人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Shogo Fujimoto

发明人： Hisayasu Kaneshiro ,  Takashi Kikuchi ,  Shogo Fujimoto

IPC分类号： B05D3/00 ,  B05D1/36 ,  C23C14/14

CPC分类号： H05K1/0346 ,  B32B15/08 ,  B32B27/28 ,  C08G73/101 ,  C08L79/08 ,  H05K1/0393 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2203/065 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

公开(公告)号：US08113716B2

公开(公告)日：2012-02-14

申请号：US12066934

申请日：2007-06-29

申请人： Takashi Kikuchi ,  Yutaka Matsuyama

发明人： Takashi Kikuchi ,  Yutaka Matsuyama

IPC分类号： F16C33/10 ,  F16C33/66 ,  F16C33/02

CPC分类号： F01M11/03 ,  F02F7/0053 ,  F16C9/02 ,  F16C17/022 ,  F16C33/105

摘要： A bearing (crank bearing 6) is constituted of an upper bearing (61) that is attached to a cylinder block, a lower bearing (67) that is attached to a crank cap, and a bearing filter (71) for filtering engine oil. The bearing filter (71) is fitted in an oil hole (62A) of the upper bearing (61).

摘要翻译： 轴承（曲轴轴承6）由附接到气缸体的上轴承（61），附接到曲柄盖的下轴承（67）和用于过滤机油的轴承过滤器（71）构成。 轴承过滤器（71）装配在上轴承（61）的油孔（62A）中。