公开(公告)号：US09957426B2

公开(公告)日：2018-05-01

申请号：US14265106

申请日：2014-04-29

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo

IPC分类号： C09J163/00 ,  H01L51/52 ,  H01L51/44 ,  C09J133/06 ,  C08G59/40 ,  C08G59/68

CPC分类号： C09J163/00 ,  C08G59/4028 ,  C08G59/68 ,  C08L33/066 ,  C09J133/066 ,  H01L51/448 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5259 ,  Y02E10/549 ,  C08F220/14 ,  C08F2220/1875 ,  C08F2220/1825 ,  C08F220/20

摘要： Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator, an organic electronic device having an encapsulant including the composition using a film-state product, that is, a curable pressure-sensitive adhesive film, including the composition, and a method of manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, the method includes assembling a photocurable pressure-sensitive adhesive film including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator with an top substrate; and assembling the top substrate to the bottom substrate on which an organic light-emitting element is formed to cover an entire surface of the organic light-emitting element with the curable pressure-sensitive adhesive layer, and radiating light only to an edge of the assembled top and bottom substrates in which the organic light-emitting element is not disposed to photocure. Therefore, mechanical strength may be ensured due to entire encapsulation, the simplification of a process by photocuring may be achieved without direct radiation of light to the organic light-emitting element, and lifespan of the element may be increased.

公开(公告)号：US09923169B2

公开(公告)日：2018-03-20

申请号：US14899518

申请日：2014-06-19

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Kyung Yul Bae ,  Jung Sup Shim ,  Suk Ky Chang ,  Hyun Suk Kim ,  Jung Ok Moon ,  Ban Seok Choi ,  Se Woo Yang

IPC分类号： H01L51/00 ,  H01L51/54 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  H01L51/52 ,  C08J5/18 ,  G01N21/958

CPC分类号： H01L51/5259 ,  C08J5/18 ,  C08K3/10 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08L2203/206 ,  G01N21/958 ,  H01L51/0034 ,  H01L51/0043

摘要： There are provided a film and an organic electronic device. The present application may provide a film that may be provided for an evaluation method in which reliability of an encapsulant film is simply and easily evaluated only by measuring a haze immediately before the encapsulant film is used, thereby a failure of a product is determined and reliability may be predicted.

公开(公告)号：US09806293B2

公开(公告)日：2017-10-31

申请号：US14244693

申请日：2014-04-03

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC分类号： H01L23/29 ,  H01L51/52 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  C09D123/22 ,  C09D163/00 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC分类号： H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

摘要： The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

公开(公告)号：US09803112B2

公开(公告)日：2017-10-31

申请号：US14763410

申请日：2014-08-05

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Suk Ky Chang ,  Yoon Gyung Cho ,  Kyung Yul Bae

IPC分类号： H01L29/08 ,  C09J109/00 ,  H01L51/00 ,  H01L51/56 ,  H01L51/52 ,  C09J9/00 ,  C09J4/00 ,  C09J7/00 ,  C09J7/02 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00

CPC分类号： C09J109/00 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J9/00 ,  C09J123/22 ,  C09J133/08 ,  C09J145/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2409/00 ,  C09J2415/003 ,  C09J2423/00 ,  C09J2423/003 ,  C09J2433/003 ,  H01L51/0001 ,  H01L51/0026 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/0094 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  Y10T428/2883

摘要： Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

公开(公告)号：US09698379B2

公开(公告)日：2017-07-04

申请号：US14323867

申请日：2014-07-03

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim ,  Seung Min Lee

IPC分类号： H01L51/52 ,  C09D163/00 ,  C09D123/22 ,  H01L23/29 ,  H01L21/56 ,  B32B27/08 ,  B32B27/18 ,  H05B33/04 ,  B32B43/00 ,  H01L51/56 ,  B32B37/14 ,  B32B3/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/24

CPC分类号： H01L51/5259 ,  B32B3/04 ,  B32B27/08 ,  B32B27/18 ,  B32B37/10 ,  B32B37/142 ,  B32B43/00 ,  B32B2037/1223 ,  B32B2037/243 ,  B32B2307/54 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/206 ,  C09D123/22 ,  C09D163/00 ,  H01L21/56 ,  H01L23/293 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/56 ,  H01L2924/0002 ,  H05B33/04 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31931 ,  Y10T428/31938 ,  H01L2924/00

摘要： Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.

公开(公告)号：US20140110699A1

公开(公告)日：2014-04-24

申请号：US14142347

申请日：2013-12-27

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Hyun Jee Yoo ,  Seung Min Lee ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： H01L51/52 ,  C09J7/02

CPC分类号： H01L51/5246 ,  C08K3/013 ,  C08K3/22 ,  C08K3/24 ,  C08K3/32 ,  C08K2003/2227 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5259 ,  Y10T428/24942 ,  Y10T428/24959

摘要： An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.

摘要翻译： 提供了用于封装有机电子二极管（OED）的粘合膜。 当封装有机电子二极管时，粘合膜可有效地防止湿气渗透到有机电子二极管的封装结构中，并且在适度条件下有效地执行封装工艺，而不会在封装过程中对有机电子二极管造成损害 。

公开(公告)号：US20130251989A1

公开(公告)日：2013-09-26

申请号：US13899386

申请日：2013-05-21

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08K3/013 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2201/008 ,  C09J7/10 ,  C09J9/00 ,  C09J11/04 ,  C09J133/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H05B33/10 ,  Y10T428/2848

摘要： The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

摘要翻译： 本发明涉及用于封装有机电子元件的粘合剂组合物，粘合剂膜，制造粘合膜的方法和有机电子器件（OED）。 粘合剂组合物可以形成具有优异的粘合性，耐冲击性，耐热性和防湿性的密封剂层，使得包含用粘合剂组合物包封的元素的OED可以显示出优异的寿命性和耐久性。

公开(公告)号：US11223028B2

公开(公告)日：2022-01-11

申请号：US16368134

申请日：2019-03-28

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Seung Min Lee ,  Hyun Suk Kim ,  Suk Ky Chang ,  Jung Ok Moon

IPC分类号： H01L33/56 ,  H01L51/52 ,  H01L51/00 ,  H01L51/56

摘要： Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.

公开(公告)号：US20210202909A1

公开(公告)日：2021-07-01

申请号：US17204781

申请日：2021-03-17

申请人： LG CHEM, LTD.

发明人： Hyun Jee Yoo ,  Hyun Suk Kim ,  Jung Ok Moon ,  Se Woo Yang

IPC分类号： H01L51/52 ,  C08K5/101 ,  C08F255/10 ,  C09J151/04 ,  C09J7/38 ,  C09J133/04 ,  C09J7/10 ,  C09J7/28 ,  B32B7/12 ,  B32B15/085 ,  B32B15/20 ,  B32B37/12 ,  C09J4/06 ,  H01L51/00 ,  C09J123/22 ,  C09J133/08 ,  H01L51/56 ,  B32B15/08 ,  B32B27/36 ,  H01L23/31 ,  H01L51/10 ,  H01L51/44

摘要： An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa·s to 107 Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

公开(公告)号：US10570321B2

公开(公告)日：2020-02-25

申请号：US16414163

申请日：2019-05-16

申请人： LG CHEM, LTD.

发明人： Yoon Gyung Cho ,  Kyung Yul Bae ,  Hyun Jee Yoo

IPC分类号： C09J9/00 ,  C09J109/00 ,  H01L51/56 ,  C09J145/00 ,  H01L51/00 ,  C09J123/22 ,  C09J133/08 ,  H01L51/52 ,  C09J4/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/00

摘要： Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.