公开(公告)号：US07420262B2

公开(公告)日：2008-09-02

申请号：US10789033

申请日：2004-02-27

申请人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Peter Strobel ,  Gerald Ofner ,  Edward Fürgut ,  Simon Jerebic ,  Thomas Bemmerl ,  Markus Fink ,  Hermann Vilsmeier

IPC分类号： H01L21/66

CPC分类号： H01L24/16 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.

摘要翻译： 本发明涉及电子元件和半导体晶片及其制造方法。 半导体晶片具有带状分离区域。 分离区域在半导体晶片的后侧的方向上设置有贯通触点。 与这种半导体晶片分离的半导体芯片构成具有边缘接触形式的外部触点的电子部件。 这种半导体芯片尺寸的电子部件可以以各种方式使用。

公开(公告)号：US07893532B2

公开(公告)日：2011-02-22

申请号：US11520035

申请日：2006-09-13

申请人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

发明人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  B23K35/262 ,  C21D9/50 ,  H01L23/49866 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/087 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

摘要翻译： 描述了用于半导体器件的外部触点的外部接触材料及其制造方法。 外部接触材料包括无铅焊料。 在焊料材料中提供的是形成多个气孔的填​​料和/或具有布置在焊料材料的体积中的塑料颗粒。

公开(公告)号：US20080050907A1

公开(公告)日：2008-02-28

申请号：US11925117

申请日：2007-10-26

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US07276785B2

公开(公告)日：2007-10-02

申请号：US10934549

申请日：2004-09-07

申请人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

发明人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

公开(公告)号：US20060076667A1

公开(公告)日：2006-04-13

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20050052830A1

公开(公告)日：2005-03-10

申请号：US10934549

申请日：2004-09-07

申请人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

发明人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

IPC分类号： H01L25/065 ,  H01L25/16 ,  H05K5/00

CPC分类号： H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

公开(公告)号：US08877328B2

公开(公告)日：2014-11-04

申请号：US10531389

申请日：2003-10-16

申请人： Michael Bauer ,  Werner Bochmann

发明人： Michael Bauer ,  Werner Bochmann

IPC分类号： B32B3/00 ,  B42D25/00

CPC分类号： B42D25/465 ,  B42D15/00 ,  B42D25/00 ,  B42D25/21 ,  B42D25/23 ,  B42D25/24 ,  B42D25/29 ,  B42D25/324 ,  B42D25/328 ,  Y10T428/24876

摘要： The invention relates to a data carrier having at least one printed area produced by intaglio printing and partly covered with a film, and to a method for producing said data carrier.

摘要翻译： 本发明涉及一种具有至少一个印刷区域的数据载体，该打印区域由凹版印刷产生并且部分地被膜覆盖，并且涉及一种用于生成所述数据载体的方法。

公开(公告)号：US20130187482A1

公开(公告)日：2013-07-25

申请号：US13512552

申请日：2010-11-26

申请人： Michael Bauer ,  Marc Brodbeck

发明人： Michael Bauer ,  Marc Brodbeck

IPC分类号： H03K17/00

CPC分类号： H03K17/005 ,  G08C17/02 ,  G08C2201/40 ,  H03K17/18 ,  Y10T307/773

摘要： The invention relates to an electronic relay with an input plug-in contact (30) and at least one output plug-in contact (87, 87a) for a current to be switched, an electronic component (104) for processing data and for actuating a semiconductor switch (116) for switching the current, a wireless communications interface (106, 108) for connection to a wireless communications network (150), wherein the wireless communications interface is embodied for receiving a first data signal (118, 126) and for receiving a first switching signal (120), a control plug-in contact (15) for receiving a second switching signal (122), wherein the electronic component is embodied such that the semiconductor switch is actuated for switching the current based upon the reception of the first or second switching signal, and such that the first data signal received via the wireless communications interface is processed and, based upon a result of the data processing of the first data signal, the semiconductor switch is actuated for switching the current.

摘要翻译： 本发明涉及一种具有输入插入式触点（30）和用于切换电流的至少一个输出插入式触头（87,87a）的电子继电器，用于处理数据并致动的电子部件（104） 用于切换电流的半导体开关（116），用于连接到无线通信网络（150）的无线通信接口（106,108），其中所述无线通信接口被实现为用于接收第一数据信号（118,126）和 用于接收第一切换信号（120），用于接收第二切换信号（122）的控制插入式触点（15），其中所述电子部件被实施为使得所述半导体开关被致动以基于所述接收来切换所述电流 并且使得经由无线通信接口接收的第一数据信号被处理，并且基于第一数据信号的数据处理的结果，半导体swi 手柄用于切换电流。

公开(公告)号：US20130068295A1

公开(公告)日：2013-03-21

申请号：US13695167

申请日：2011-04-20

申请人： Frank Becker ,  John Bohland ,  Hubert Joachim Frenck ,  Michael Bauer ,  Robert Fischer ,  Kenneth R. Kormanyos ,  Norman W. Johnston

发明人： Frank Becker ,  John Bohland ,  Hubert Joachim Frenck ,  Michael Bauer ,  Robert Fischer ,  Kenneth R. Kormanyos ,  Norman W. Johnston

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022425 ,  C03C17/002 ,  C03C17/22 ,  C03C17/347 ,  C03C17/3476 ,  C03C17/36 ,  C03C17/3678 ,  C03C2217/288 ,  C03C2217/289 ,  C03C2218/15 ,  C23C14/0629 ,  C23C14/5846 ,  H01L31/022466 ,  H01L31/03925 ,  H01L31/1828 ,  H01L31/206 ,  Y02E10/50 ,  Y02P70/521

摘要： The invention relates to a process for producing a glass sheet 10, 21 coated with a semiconductor material, which comprises the steps (a) production of a glass strip in a float bath 3 containing liquid tin; (b) discharge of the glass strip from the float bath 3 and optionally coating of the glass strip with a transparent, electrically conductive intermediate layer; (c) transfer of the uncoated or coated glass strip into a deposition chamber 5 for the physical deposition of the semiconductor material from the gas phase; and (d) coating of the coated or uncoated glass strip from step (c) with the semiconductor material by physical deposition of the semiconductor material from the gas phase at a gas pressure of at least 0.1 bar. The invention additionally relates to an apparatus for producing a glass strip coated with a semiconductor material, a process for producing a solar cell or a solar module and also a solar cell or a solar module which can be obtained by this process.

摘要翻译： 本发明涉及一种涂覆有半导体材料的玻璃板10,21的制造方法，该方法包括以下步骤：（a）在含有液体锡的浮法槽3中制备玻璃带; （b）从浮液槽3排出玻璃带，并且可选地用透明的导电中间层涂覆玻璃带; （c）将未涂覆或涂覆的玻璃带转移到沉积室5中，用于从气相物理沉积半导体材料; 和（d）通过在至少0.1巴的气体压力下从气相物理沉积半导体材料，用半导体材料将步骤（c）中的涂覆或未涂覆的玻璃带涂覆。 本发明还涉及一种用于制造涂覆有半导体材料的玻璃带的装置，一种太阳能电池或太阳能组件的制造方法，以及可以通过该方法获得的太阳能电池或太阳能组件。

公开(公告)号：US20120280349A1

公开(公告)日：2012-11-08

申请号：US13512134

申请日：2010-11-10

申请人： Frank Becker ,  Michael Bauer ,  Jochen Frenck ,  Robert Fischer

发明人： Frank Becker ,  Michael Bauer ,  Jochen Frenck ,  Robert Fischer

IPC分类号： H01L27/14 ,  H01L31/18

CPC分类号： H01L31/1828 ,  H01L27/142 ,  H01L27/1421 ,  H01L31/022466 ,  H01L31/0392 ,  H01L31/03923 ,  H01L31/0463 ,  H01L31/0465 ,  H01L31/073 ,  Y02E10/541 ,  Y02E10/543 ,  Y02P70/521

摘要： The present invention relates to a photovoltaic module structure 1 and to a method for establishing an electrically conductive connection between two spaced contact layers 4″, 6′, in particular in the photovoltaic module structure 1 according to the invention. The production method is particularly simple and economical and the photovoltaic module structure 1 according to the invention enables a significant gain in efficiency.

摘要翻译： 本发明涉及一种光伏模块结构1和一种用于在两个间隔开的接触层4“，6'之间，特别是在根据本发明的光伏组件结构1中建立导电连接的方法。 制造方法特别简单且经济，根据本发明的光伏模块结构1能够显着提高效率。