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公开(公告)号：US20180061639A1
公开(公告)日：2018-03-01
申请号：US15687915
申请日：2017-08-28
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei YAMAZAKI , Masataka SATO , Seiji YASUMOTO , Kayo KUMAKURA , Satoru IDOJIRI
CPC classification number: H01L21/02694 , G02F2201/44 , H01L21/02488 , H01L21/67132 , H01L21/7806 , H01L27/1225 , H01L27/1266 , H01L29/66969
Abstract: The yield of a manufacturing process of a semiconductor device is increased. The mass productivity of a semiconductor device is increased. A semiconductor device is manufactured by forming a first material layer over a substrate; forming a second material layer over the first material layer; and separating the first material layer and the second material layer from each other; and heating the first material layer and the second material layer that are stacked before the separation. The first material layer includes a gas containing hydrogen, oxygen, or hydrogen and oxygen (e.g., water) in a metal oxide, for example. The second material layer includes a resin. The first material layer and the second material layer are separated from each other by a break of a hydrogen bond. Specifically water is separated out at the interface or near the interface, and then adhesion is reduced due to the water present.
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公开(公告)号：US20180033978A1
公开(公告)日：2018-02-01
申请号：US15657259
申请日：2017-07-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Kayo KUMAKURA , Hiroyuki WATANABE , Seiji YASUMOTO , Satoru IDOJIRI , Hiroki ADACHI
CPC classification number: H01L51/0097 , H01L27/1218 , H01L27/1225 , H01L27/1266 , H01L27/3262 , H01L29/7869 , H01L51/003 , H01L51/5246 , H01L51/5253 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , Y02E10/549
Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.
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公开(公告)号：US20170338250A1
公开(公告)日：2017-11-23
申请号：US15596412
申请日：2017-05-16
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Junpei YANAKA , Kayo KUMAKURA , Masataka SATO , Satoru IDOJIRI , Kensuke YOSHIZUMI , Mari TATEISHI , Natsuko TAKASE
CPC classification number: H01L27/1225 , H01L23/293 , H01L27/124 , H01L27/1266 , H01L27/3262 , H01L51/003 , H01L2227/323
Abstract: To provide a peeling method that achieves low cost and high mass productivity. The peeling method includes the steps of: forming a first layer with a photosensitive material over a formation substrate; forming a first region and a second region having a smaller thickness than the first region in the first layer by photolithography to form a resin layer having the first region and the second region; forming a transistor including an oxide semiconductor in a channel formation region over the first region in the resin layer; forming a conductive layer over the second region in the resin layer; and irradiating the resin layer with laser light to separate the transistor and the formation substrate.
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公开(公告)号：US20150068683A1
公开(公告)日：2015-03-12
申请号：US14468818
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Yoshiharu HIRAKATA , Shingo EGUCHI , Yasuhiro JINBO , Hisao IKEDA , Kohei YOKOYAMA , Hiroki ADACHI , Satoru IDOJIRI
CPC classification number: B32B37/0046 , B32B17/10431 , B32B27/08 , B32B27/20 , B32B27/36 , B32B37/0015 , B32B37/003 , B32B37/1284 , B32B38/0008 , B32B38/18 , B32B38/1841 , B32B38/1858 , B32B2264/102 , B32B2264/105 , B32B2309/68 , B32B2457/14 , B32B2457/20 , H01L2224/01 , Y10T156/15 , Y10T156/1798
Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
Abstract translation: 提高了将两个部件结合在一起的步骤中的产量。 接合装置包括能够支撑具有片状形状的第一构件的台，能够固定具有片状形状的第二构件的一端部使得第二构件与第一构件重叠的固定机构，以及 加压机构能够从所述第二部件的一个端部的一侧移动到所述另一个端部的一侧，并且在所述第一部件和所述第二部件之间在压力下铺展粘合层。 第一构件和第二构件彼此结合。
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公开(公告)号：US20150060933A1
公开(公告)日：2015-03-05
申请号：US14468808
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Kohei YOKOYAMA , Satoru IDOJIRI , Hisao IKEDA , Yasuhiro JINBO , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI
CPC classification number: B65G49/068 , B32B17/06 , B32B37/025 , B32B38/10 , B32B43/006 , B32B2457/00 , B32B2457/14 , B32B2457/20 , B65G49/069 , B65G2249/04 , B65H3/0816 , B65H3/48 , B65H16/00 , B65H35/0006 , H01L21/673 , H01L21/67333 , H01L21/67715 , H01L21/68 , H01L27/3244 , H01L51/5237 , H01L51/56 , H01L2221/68318 , H01L2227/323 , Y10T29/53091 , Y10T29/5317 , Y10T156/1121 , Y10T156/1137 , Y10T156/1158 , Y10T156/1184 , Y10T156/1917 , Y10T156/1922 , Y10T156/1939 , Y10T156/1967
Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
Abstract translation: 提供了一种用于提供具有干净表面的支撑件的装置。 或者，提供一种用于制造包括支撑体的堆叠的装置和其一个表面层被分离的被处理构件的剩余部分。 包括定位部分，狭缝形成部分和剥离部分。 定位部设置有包括支撑体和隔板的层叠膜的第一传送机构和用于固定层叠膜的台。 狭缝形成部设置有能够形成不通过隔板的狭缝的切割器。 剥离部设置有第二传送机构和剥离机构，其使隔板延伸，然后剥离隔膜。 此外，包括激活支撑表面的预处理部分。
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Patent Agency Ranking
36.发明申请DEVICE FOR FORMING SEPARATION STARTING POINT, STACK MANUFACTURING APPARATUS, AND METHOD FOR FORMING SEPARATION STARTING POINT 有权用于形成分离开始点的装置，堆叠制造装置和形成分离开始点的方法公开(公告)号：US20150059986A1
公开(公告)日：2015-03-05
申请号：US14468801
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Ryu KOMATSU , Kohei YOKOYAMA , Masakatsu OHNO , Satoru IDOJIRI , Hisao IKEDA , Yasuhiro JINBO , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI , Daiki NAKAMURA
CPC classification number: B26D3/282 , B26D3/08 , B26F1/3826 , C03B33/027 , C03B33/037 , C03B33/07 , G02F1/1303 , Y02P40/57 , Y10T83/0281 , Y10T156/1051 , Y10T156/1082 , Y10T156/1126 , Y10T156/1137 , Y10T156/1168 , Y10T156/1195 , Y10T156/12 , Y10T156/1348 , Y10T156/1788 , Y10T156/1793 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939 , Y10T156/1961 , Y10T156/1967 , Y10T156/1994
Abstract: A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.
Abstract translation: 提供一种用于形成分离起始点的装置，其允许分离加工部件的表面层以形成剩余部分。 提供了一种包括支撑体的堆叠的制造装置和其表面层被分离的处理的构件的剩余部分。 用于形成分离起点的装置包括支撑加工构件的台，面向台的切割器，支撑切割器的头部，支撑头部的臂部，以及使切割器相对移动的移动机构 到舞台。
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公开(公告)号：US20250008793A1
公开(公告)日：2025-01-02
申请号：US18560082
申请日：2022-04-27
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei YAMAZAKI , Kenichi OKAZAKI , Satoru IDOJIRI , Hiroki ADACHI
IPC: H10K59/131 , H10K59/00 , H10K59/35 , H10K102/00
Abstract: One embodiment of the present invention provides a novel display apparatus that is highly convenient or reliable. A plurality of pixel regions (also referred to as display regions) are combined to obtain a display apparatus for components inside a motor vehicle. Specifically, a display with a curved display surface is installed as a vehicle interior of a motor vehicle or the like. A wiring layer is provided in a support body having a curved surface, and the wiring layer and part of a signal line in a pixel region are electrically connected to each other. Moreover, by using a structure in which a plurality of adjacent pixel regions overlap with each other so as to have a small gap therebetween, a joint between the pixel regions is made less noticeable, and preferably invisible.
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公开(公告)号：US20240257671A1
公开(公告)日：2024-08-01
申请号：US18559819
申请日：2022-04-26
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Shunpei YAMAZAKI , Kenichi OKAZAKI , Satoru IDOJIRI , Hiroki ADACHI
Abstract: One embodiment of the present invention provides a novel display apparatus that is highly convenient or reliable. The display apparatus includes a plurality of flexible substrates over each of which a plurality of light-emitting diode chips are mounted, a substrate provided with a nitride film, and a resin between the flexible substrates and the substrate provided with a nitride film. Light emitted from the light-emitting diode chips passes through the substrate provided with a nitride film.
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公开(公告)号：US20240138183A1
公开(公告)日：2024-04-25
申请号：US18373324
申请日：2023-09-27
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasutaka NAKAZAWA , Takayuki OHIDE , Naoto GOTO , Hiroki ADACHI , Satoru IDOJIRI , Hayato YAMAWAKI , Kenichi OKAZAKI , Sachiko KAWAKAMI
IPC: H10K59/12 , H10K59/122
CPC classification number: H10K59/1201 , H10K59/122 , H10K85/636
Abstract: A method for manufacturing a novel display apparatus is provided. The method includes a first step of forming a first electrode, a second electrode, and a first gap over an insulating film, a second step of forming a first film over the second electrode; a third step of forming a first layer overlapping with the first electrode, a fourth step of removing the first film by an etching method to form a first unit overlapping with the first electrode, a fifth step of removing a surface of the second electrode, a sixth step of forming a second film over the first layer and the second electrode, a seventh step of forming a second layer overlapping with the second electrode, and an eighth step of removing the second film by an etching method using the second layer to form a second unit overlapping with the second electrode and a second gap.
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公开(公告)号：US20210175447A1
公开(公告)日：2021-06-10
申请号：US17177457
申请日：2021-02-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Kayo KUMAKURA , Hiroyuki WATANABE , Seiji YASUMOTO , Satoru IDOJIRI , Hiroki ADACHI
IPC: H01L51/00 , H01L51/52 , H01L27/32 , H01L27/12 , H01L29/786
Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.
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