公开(公告)号：US20210271842A1

公开(公告)日：2021-09-02

申请号：US17320639

申请日：2021-05-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hua Chen ,  Yu-Feng Chen ,  Chung-Shi Liu ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Yu-Chih Huang

IPC: G06K9/00

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

公开(公告)号：US10762319B2

公开(公告)日：2020-09-01

申请号：US15884287

申请日：2018-01-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hsuan Tai ,  Chih-Hua Chen ,  Hao-Yi Tsai ,  Yu-Chih Huang ,  Chia-Hung Liu ,  Ting-Ting Kuo ,  Ying-Cheng Tseng

IPC: G06K9/00 ,  H01L21/70

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

公开(公告)号：US10720416B2

公开(公告)日：2020-07-21

申请号：US16103938

申请日：2018-08-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Chen ,  Chih-Hua Chen ,  Hsin-Yu Pan ,  Hao-Yi Tsai ,  Lipu Kris Chuang ,  Tin-Hao Kuo

IPC: H01L21/56 ,  H01L23/528 ,  H01L23/00 ,  H01L23/522 ,  H01L23/34 ,  H01L23/31 ,  H01L25/18

Abstract: A semiconductor device includes a bottom package, a top package, and a heat dissipating structure. The bottom package includes a redistribution structure, and a die disposed on a first surface of the redistribution structure and electrically connected to the redistribution structure. The top package is disposed on a second surface of the redistribution structure opposite to the first surface. The heat dissipating structure is disposed over the bottom package, and includes a thermal relaxation block. The thermal relaxation block contacts the redistribution structure and is disposed beside the top package.

公开(公告)号：US10658334B2

公开(公告)日：2020-05-19

申请号：US15240422

申请日：2016-08-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Jen Cheng ,  Yu-Chih Huang ,  Chih-Hua Chen ,  Yu-Feng Chen ,  Hao-Yi Tsai

IPC: H01L21/56 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L21/683 ,  H01L25/10

Abstract: Package structures and methods for forming the same are provided. The method includes providing a first integrated circuit die and forming a redistribution structure over the first integrated circuit die. The method also includes forming a base layer over the redistribution structure. The base layer has first and second openings. The first openings are wider than the second openings. The method further includes forming first bumps over the redistribution structure. The first bumps have a lower portion filling the first openings. In addition, the method includes bonding a second integrated circuit die to the redistribution structure through second bumps having a lower portion filling the second openings. There is a space between the second integrated circuit die and the base layer. The method also includes forming a molding compound layer over the base layer. The molding compound layer fills the space and surrounds the first and second bumps.

公开(公告)号：US20200058632A1

公开(公告)日：2020-02-20

申请号：US16103938

申请日：2018-08-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Wei Chen ,  Chih-Hua Chen ,  Hsin-Yu Pan ,  Hao-Yi Tsai ,  Lipu Kris Chuang ,  Tin-Hao Kuo

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528 ,  H01L23/34 ,  H01L21/56

Abstract: A semiconductor device includes a bottom package, a top package, and a heat dissipating structure. The bottom package includes a redistribution structure, and a die disposed on a first surface of the redistribution structure and electrically connected to the redistribution structure. The top package is disposed on a second surface of the redistribution structure opposite to the first surface. The heat dissipating structure is disposed over the bottom package, and includes a thermal relaxation block. The thermal relaxation block contacts the redistribution structure and is disposed beside the top package.

公开(公告)号：US20190236326A1

公开(公告)日：2019-08-01

申请号：US15884287

申请日：2018-01-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hsuan Tai ,  Chih-Hua Chen ,  Hao-Yi Tsai ,  Yu-Chih Huang ,  Chia-Hung Liu ,  Ting-Ting Kuo ,  Ying-Cheng Tseng

IPC: G06K9/00 ,  H01L21/70

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

公开(公告)号：US20170271248A1

公开(公告)日：2017-09-21

申请号：US15147910

申请日：2016-05-06

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Feng Chen ,  Chih-Hua Chen ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Hung-Jui Kuo ,  Hui-Jung Tsai ,  Hao-Yi Tsai

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L21/4846 ,  H01L21/486 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/562 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/18 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/06572

Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.

公开(公告)号：US12260669B2

公开(公告)日：2025-03-25

申请号：US18348460

申请日：2023-07-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hua Chen ,  Yu-Feng Chen ,  Chung-Shi Liu ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Yu-Chih Huang

IPC: G06V40/13 ,  H01L21/56

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

公开(公告)号：US12058101B2

公开(公告)日：2024-08-06

申请号：US18446146

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Chih-Hua Chen ,  Hao-Yi Tsai ,  Yu-Feng Chen

IPC: H01L27/14 ,  G06F15/16 ,  G06F21/51 ,  G06F21/56 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/13 ,  H01L23/48 ,  H01L23/538 ,  H04L9/40 ,  H04L61/10 ,  H04L61/4511 ,  H10N10/01 ,  H01L21/56 ,  H01L23/498 ,  H04L101/604

CPC classification number: H04L61/4511 ,  G06F15/16 ,  G06F21/51 ,  G06F21/56 ,  H01L21/4846 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H04L61/10 ,  H04L63/04 ,  H10N10/01 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H04L2101/604

Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.

公开(公告)号：US11948862B2

公开(公告)日：2024-04-02

申请号：US17188707

申请日：2021-03-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Chih-Hua Chen ,  Hao-Yi Tsai ,  Yu-Feng Chen

IPC: H01L27/14 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/13 ,  H01L23/48 ,  H01L23/538 ,  H10N10/01 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/4846 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H10N10/01 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.