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公开(公告)号：US11741737B2
公开(公告)日：2023-08-29
申请号：US17320639
申请日：2021-05-14
发明人： Chih-Hua Chen , Yu-Feng Chen , Chung-Shi Liu , Chen-Hua Yu , Hao-Yi Tsai , Yu-Chih Huang
CPC分类号： G06V40/1306 , G06F18/00 , G06V40/1329 , H01L21/568 , H01L2224/04105 , H01L2224/16227 , H01L2224/19 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244
摘要： A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
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公开(公告)号：US20210183745A1
公开(公告)日：2021-06-17
申请号：US17188707
申请日：2021-03-01
发明人： Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
IPC分类号： H01L23/48 , H01L23/538 , H01L21/48 , H01L21/768 , H01L35/34 , H01L23/00 , H01L23/13
摘要： Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
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公开(公告)号：US10276402B2
公开(公告)日：2019-04-30
申请号：US15147910
申请日：2016-05-06
发明人： Yu-Feng Chen , Chih-Hua Chen , Chen-Hua Yu , Chung-Shi Liu , Hung-Jui Kuo , Hui-Jung Tsai , Hao-Yi Tsai
IPC分类号： H01L21/48 , H01L25/065 , H01L25/00 , H01L23/538 , H01L21/56 , H01L23/31 , H01L23/00
摘要： A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.
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公开(公告)号：US20170162541A1
公开(公告)日：2017-06-08
申请号：US15437193
申请日：2017-02-20
发明人： Yu-Feng Chen , Kai-Chiang Wu , Chun-Lin Lu , Hung-Jui Ko
IPC分类号： H01L23/00 , H01L21/78 , H01L23/544
CPC分类号： H01L21/3205 , H01L21/283 , H01L21/3213 , H01L21/34 , H01L21/4853 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/76898 , H01L21/78 , H01L23/10 , H01L23/147 , H01L23/16 , H01L23/28 , H01L23/31 , H01L23/3157 , H01L23/4334 , H01L23/481 , H01L23/49805 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/544 , H01L23/562 , H01L23/564 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2021/6024 , H01L2223/5446 , H01L2224/02235 , H01L2224/02255 , H01L2224/0226 , H01L2224/03462 , H01L2224/03464 , H01L2224/03622 , H01L2224/0401 , H01L2224/05111 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05572 , H01L2224/06181 , H01L2224/11318 , H01L2224/13026 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/1703 , H01L2224/17181 , H01L2224/17505 , H01L2224/17517 , H01L2224/32145 , H01L2224/73204 , H01L2224/81139 , H01L2224/92124 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/0652 , H01L2225/06541 , H01L2225/06568 , H01L2924/01029 , H01L2924/01322 , H01L2924/014 , H01L2924/06 , H01L2924/0665 , H01L2924/07025 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2924/2064 , H01L2924/3511 , H01L2224/81 , H01L2924/00
摘要： Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads may be arranged in a ball grid array (BGA), and the may include a plurality of corners. A metal dam is disposed around each of the plurality of corners, such as corners of the BGA.
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公开(公告)号：US20210351139A1
公开(公告)日：2021-11-11
申请号：US17385205
申请日：2021-07-26
发明人： Chih-Hsiang Tseng , Yu-Feng Chen , Cheng Jen Lin , Wen-Hsiung Lu , Ming-Da Cheng , Kuo-Ching Hsu , Hong-Seng Shue , Ming-Hong Cha , Chao-Yi Wang , Mirng-Ji Lii
IPC分类号： H01L23/58 , H01L23/31 , H01L23/532 , H01L21/02 , H01L21/48 , H01L23/522
摘要： A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
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公开(公告)号：US11171016B2
公开(公告)日：2021-11-09
申请号：US16892320
申请日：2020-06-04
发明人： Yu-Feng Chen , Chih-Hua Chen , Chen-Hua Yu , Chung-Shi Liu , Hung-Jui Kuo , Hui-Jung Tsai , Hao-Yi Tsai
IPC分类号： H01L25/065 , H01L21/48 , H01L25/00 , H01L23/538 , H01L21/56 , H01L23/31 , H01L23/00
摘要： A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.
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7.发明授权Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof 有权半导体器件，使用其的集成电路结构及其制造方法公开(公告)号：US09559069B2
公开(公告)日：2017-01-31
申请号：US14609023
申请日：2015-01-29
发明人： Yu-Feng Chen , Chen-Shien Chen , Sheng-Yu Wu , Tin-Hao Kuo , Yen-Liang Lin
CPC分类号： H01L24/05 , H01L23/562 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/48 , H01L2224/0346 , H01L2224/0361 , H01L2224/0401 , H01L2224/04042 , H01L2224/05011 , H01L2224/05015 , H01L2224/05017 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05558 , H01L2224/05565 , H01L2224/05571 , H01L2224/05647 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2924/00014 , H01L2924/35121 , H01L2924/01029 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01073 , H01L2924/01049 , H01L2924/0105 , H01L2924/0103 , H01L2924/01025 , H01L2924/01024 , H01L2924/01022 , H01L2924/01032 , H01L2924/01038 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/014 , H01L2924/01047 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor device includes a substrate, a semiconductor structure, a metal pad, and a stress releasing material. The semiconductor structure is disposed on the substrate. The metal pad is disposed on the semiconductor structure. The metal pad includes a through hole therein. The stress releasing material is disposed in the through hole.
摘要翻译： 半导体器件包括衬底，半导体结构，金属焊盘和应力释放材料。 半导体结构设置在基板上。 金属焊盘设置在半导体结构上。 金属垫在其中包括一个通孔。 应力释放材料设置在通孔中。
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公开(公告)号：US12058101B2
公开(公告)日：2024-08-06
申请号：US18446146
申请日：2023-08-08
发明人： Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
IPC分类号： H01L27/14 , G06F15/16 , G06F21/51 , G06F21/56 , H01L21/48 , H01L21/768 , H01L23/00 , H01L23/13 , H01L23/48 , H01L23/538 , H04L9/40 , H04L61/10 , H04L61/4511 , H10N10/01 , H01L21/56 , H01L23/498 , H04L101/604
CPC分类号： H04L61/4511 , G06F15/16 , G06F21/51 , G06F21/56 , H01L21/4846 , H01L21/76898 , H01L23/13 , H01L23/481 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H04L61/10 , H04L63/04 , H10N10/01 , H01L21/561 , H01L21/568 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/83005 , H01L2224/83191 , H01L2224/83192 , H01L2224/92244 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H04L2101/604
摘要： Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
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公开(公告)号：US11948862B2
公开(公告)日：2024-04-02
申请号：US17188707
申请日：2021-03-01
发明人： Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
IPC分类号： H01L27/14 , H01L21/48 , H01L21/768 , H01L23/00 , H01L23/13 , H01L23/48 , H01L23/538 , H10N10/01 , H01L21/56 , H01L23/498
CPC分类号： H01L23/481 , H01L21/4846 , H01L21/76898 , H01L23/13 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H10N10/01 , H01L21/561 , H01L21/568 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/83005 , H01L2224/83191 , H01L2224/83192 , H01L2224/92244 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2224/97 , H01L2224/83 , H01L2224/48091 , H01L2924/00014 , H01L2924/00014 , H01L2224/45099
摘要： Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
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公开(公告)号：US20230386975A1
公开(公告)日：2023-11-30
申请号：US18446146
申请日：2023-08-08
发明人： Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
IPC分类号： H01L23/48 , H01L23/538 , H01L21/48 , H01L21/768 , H01L23/00 , H01L23/13 , H10N10/01
CPC分类号： H01L23/481 , H01L23/5389 , H01L21/4846 , H01L21/76898 , H01L24/19 , H01L24/20 , H01L24/97 , H01L23/13 , H01L23/5385 , H10N10/01 , H01L2224/83005 , H01L21/561
摘要： Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
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