公开(公告)号：US20070007648A1

公开(公告)日：2007-01-11

申请号：US11175420

申请日：2005-07-06

申请人： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

发明人： Wen-Kun Yang ,  Kuang-Chi Chao ,  Cheng-hsien Chiu ,  Chihwei Lin ,  Jui-Hsien Chang

IPC分类号： H01L23/04

CPC分类号： H01L23/3114 ,  H01L23/16 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/4334 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

公开(公告)号：US07863105B2

公开(公告)日：2011-01-04

申请号：US12117087

申请日：2008-05-08

申请人： Wen-Kun Yang ,  Jui-Hsien Chang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang

IPC分类号： H01L21/44

CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.

摘要翻译： 图像传感器封装包括衬底，安装在衬底上的芯片。 围绕芯片形成模制材料以暴露微米透镜区域，其中模制材料包括通过其的通孔结构。 在微透镜区域上形成保护层以防止微透镜。 在模制材料上形成重新分布的导电层以连接到芯片的焊盘。 金属焊盘形成在通孔结构上作为与PCB的连接点。 覆盖层形成在衬底上以隔离金属焊盘。

公开(公告)号：US07498556B2

公开(公告)日：2009-03-03

申请号：US11725041

申请日：2007-03-15

申请人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

发明人： Wen-Kun Yang ,  Diann-Fang Lin ,  Jui-Hsien Chang ,  Tung-Chuan Wang

IPC分类号： H01L27/00

CPC分类号： H01L27/14618 ,  H01L24/19 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/14 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028 ,  H01L2924/013

摘要： The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

摘要翻译： 本发明提供了一种具有内置封装空腔的图像传感器模块及其方法。 一种图像传感器模块结构，包括具有形成在所述基板的上表面内的封装容纳腔的衬底和所述衬底内的导电迹线，以及具有设置在所述封装容纳腔内的具有微透镜的裸片的封装。 在封装和基板上形成电介质层，在介电层上形成再分配导电层（RDL），其中RDL耦合到管芯，导电迹线和电介质层具有露出 微透镜。 透镜保持器附接在基板上，并且透镜保持器具有安装在透镜保持器的上部的透镜。 滤光片安装在透镜和微透镜之间。 该结构还包括在透镜保持器内的衬底的上表面上的无源器件。

公开(公告)号：US20090008729A1

公开(公告)日：2009-01-08

申请号：US11772861

申请日：2007-07-03

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chi-Chen Lee ,  Wen-Ping Yang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chi-Chen Lee ,  Wen-Ping Yang

IPC分类号： H01L31/0232 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention discloses a structure of image sensor package utilizing a removable protection film. The structure comprises a substrate with a die receiving cavity and inter-connecting through holes. Terminal pads are formed under the inter-connecting through holes and metal pads are formed on an upper surface of the substrate. A die is disposed within the die receiving cavity by an adhesion material. Bonding pads are formed on the upper edge of the die. Bonding wires are coupled to the metal pads and the bonding pads. A protection layer is formed on the micro lens area to protect the micro lens from particle contamination. A removable protection film is formed over the protection layer to protect the micro lens from water, oil, dust or temporary impact during the packaging and assembling process.

摘要翻译： 本发明公开了利用可移除保护膜的图像传感器封装的结构。 该结构包括具有模具接收腔和相互连接的通孔的基板。 端子焊盘形成在相互连接的通孔之下，金属焊盘形成在基板的上表面上。 模具通过粘合材料设置在模具容纳腔内。 接合垫形成在模具的上边缘上。 接合线耦合到金属焊盘和焊盘。 在微透镜区域上形成保护层以保护微透镜免受颗粒污染。 在保护层上形成可移除的保护膜，以在包装和组装过程中保护微透镜免受水，油，灰尘或临时冲击。

公开(公告)号：US20080211075A1

公开(公告)日：2008-09-04

申请号：US11950921

申请日：2007-12-05

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/04 ,  H01L21/71

CPC分类号： H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028

摘要： A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.

摘要翻译： 一种具有间隙的粘合性的半导体器件封装的结构，包括：具有接合焊盘的芯片和嵌入到具有模具窗口和互连通孔的衬底中的传感器区域，其中，RDL形成在衬底上，用于在接合 垫和相互连接的通孔; 形成在基板上的多个环（阻挡条），RDL和除了传感器区域之外的接合焊盘区域; 粘合剂胶水填充到除了传感器区域之外的多个环的空间中; 以及粘合在多个环的顶部上的透明材料和胶粘剂，其中粘合剂胶合透明材料和多个环之间的粘附。

公开(公告)号：US20080191335A1

公开(公告)日：2008-08-14

申请号：US11755293

申请日：2007-05-30

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.

摘要翻译： 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 除了微透镜，接合焊盘和接触焊盘之外，在裸片和基板上形成厚的电介质层。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 并且核芯浆料填充到芯片边缘和基板的管芯通孔的侧壁之间的间隙中。 通过粘合将透明盖设置在模具和厚介电层上，以在透明盖之间产生间隙。

公开(公告)号：US20080136012A1

公开(公告)日：2008-06-12

申请号：US11608266

申请日：2006-12-08

申请人： Wen-Kun Yang ,  Jui-Hsien Chang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang

IPC分类号： H01L23/04

CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor package comprises a substrate, a chip mounted over the substrate, A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.

摘要翻译： 图像传感器封装包括衬底，安装在衬底上的芯片。形成围绕芯片的模制材料以暴露微米透镜区域，其中模制材料包括通过其的通孔结构。 在微透镜区域上形成保护层以防止微透镜。 在模制材料上形成重新分布的导电层以连接到芯片的焊盘。 金属焊盘形成在通孔结构上作为与PCB的连接点。 覆盖层形成在衬底上以隔离金属焊盘。

公开(公告)号：US20080116169A1

公开(公告)日：2008-05-22

申请号：US11837738

申请日：2007-08-13

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chi-Chen Lee

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Chi-Chen Lee

IPC分类号： C03C25/68

CPC分类号： H01L27/14618 ,  H01L24/03 ,  H01L27/14683 ,  H01L2224/04042 ,  H01L2224/85013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01094 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T428/24355

摘要： The present invention provides a structure for etching process. The structure has a mask for protecting an area of a wafer from being etched and a seal ring attached under a lower surface of the mask. The mask has at least one air opening to expose an area to be etched. Furthermore, the mask is attached on the wafer through the seal ring. In addition, the present invention provides also a method to form a mask for dry etching process. First, the present invention includes a step of providing a base material and coating the masking material on both sides of the base material. The next step is to pattern the masking material to form openings. Subsequently, the base material is etched through the openings to create at least one mask opening and a mask cavity. Finally, removing the mask material is performed.

公开(公告)号：US07335870B1

公开(公告)日：2008-02-26

申请号：US11539215

申请日：2006-10-06

申请人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

发明人： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu

IPC分类号： H01L21/00 ,  H01L27/00

CPC分类号： H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/48463 ,  H01L2924/16235

摘要： The method of forming image sensor protection comprises attaching a glass on a tape and scribing the glass with lines to define cover zones on the glass, the glass is then break by a rubber puncher followed by forming glue on the edge of the cover zones. The glass is bonded on a wafer with an image sensor to align the cover zones to a micron lens area of the image sensor, and then the tape is removed from the wafer, thereby forming glass with cover zones on the image sensor.

摘要翻译： 形成图像传感器保护的方法包括将玻璃附着在带上并用线划线玻璃以限定玻璃上的覆盖区域，然后玻璃被橡胶冲孔机打破，然后在覆盖区域的边缘上形成胶水。 将玻璃用图像传感器粘合在晶片上，以将覆盖区域对准图像传感器的微米透镜区域，然后将胶带从晶片上移除，从而在图像传感器上形成具有覆盖区域的玻璃。

公开(公告)号：US20070128835A1

公开(公告)日：2007-06-07

申请号：US11293104

申请日：2005-12-05

申请人： Wen-Kun Yang ,  Jui-Hsien Chang

发明人： Wen-Kun Yang ,  Jui-Hsien Chang

IPC分类号： H01L21/00 ,  H01L21/4763

CPC分类号： H01L23/13 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01094 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/19 ,  H01L2924/00 ,  H01L2224/83

摘要： The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer layer is filled with the corresponding recesses to form infillings on adjacent the semiconductor device package. Dicing the wafer into individual package along substantial center of said infillings, the step may avoid the roughness on the edge of each die and also decrease the cost of the separating process.

摘要翻译： 本发明提供晶片级封装的半导体器件封装的分离工艺。 该方法包括蚀刻基板以形成凹陷的步骤。 然后在衬底的第一表面上形成缓冲层，其中缓冲层填充相应的凹槽，以在相邻的半导体器件封装上形成填充。 将晶片切割成沿着所述填充物的大部分中心的单个封装，该步骤可以避免每个管芯的边缘上的粗糙度并且还降低了分离过程的成本。