中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

224 records (took 0.015 seconds)

    Soldering methods and compositions
    37.
    发明授权
    Soldering methods and compositions 失效
    焊接方法和组成

    公开(公告)号：US06340113B1

    公开(公告)日：2002-01-22

    申请号：US09226942

    申请日：1999-01-08

    Applicant: Donald H. Avery ,  John P. Ranieri

    Inventor： Donald H. Avery ,  John P. Ranieri

    IPC: B23K3100

    CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/043

    Abstract: Soldering methods and compositions are disclosed to provide electrical connections between surfaces with reduced likelihood of short circuits or solder-starved joints. Two component solder compositions are employed to preferably form “metallic foam” joints upon heating. In one embodiment, bimetallic particles are disclosed which fuse together rapidly reducing the likelihood of reflow-related solder joint faults. The methods and compositions of the present invention can also reduce the potential for thermal fatigue and other solder joint failures in electronic devices following fabrication because the porous solder joints relieve plastic constraints and lower the average tensile joint stress. In one preferred embodiment, solder compositions are employed which are composed of particles of a first metal coated with a second metal. Alternatively, the compositions can include particles of a first metal surrounded by a salt solution or suspension of a second metal. The metals are chosen such that their individual melting points are higher than the melting points of the alloy or alloys formed when they are combined. Upon heating of such coated particles, melting occurs at the interfaces between the core materials and their coatings. The liquid so formed causes various particles to fuse together in a porous metal foam that provides an electronic connection capable of withstanding thermal cycling with significantly lower failure rates. This soldering technique is particularly advantageous when applied to soldering of ball arrays and similar structures that facilitate mounting of chips to printed circuit boards, other chips or substrates, generally. The present invention can also be useful in reducing the total amount of lead and/or other toxic components present in solder compositions.

    Abstract translation: 公开了焊接方法和组合物以提供表面之间的电连接，减少了短路或焊接缺陷接头的可能性。 采用双组分焊料组合物在加热时优选形成“金属泡沫”接头。 在一个实施例中，公开了双重金属颗粒，其将熔合在一起迅速降低了回流焊接断裂的可能性。 本发明的方法和组合物还可以减少在制造后的电子器件中的热疲劳和其它焊接接头故障的可能性，因为多孔焊点缓解了塑性约束并降低了平均拉伸接头应力。 在一个优选实施例中，使用由涂覆有第二金属的第一金属的颗粒组成的焊料组合物。 或者，组合物可以包括由第二金属的盐溶液或悬浮液包围的第一金属的颗粒。 选择金属使得其各自的熔点高于当它们组合时形成的合金或合金的熔点。 在加热这种涂覆的颗粒时，在芯材和它们的涂层之间的界面处发生熔融。 如此形成的液体导致各种颗粒在多孔金属泡沫中熔合在一起，其提供能够承受热循环并且具有显着更低故障率的电子连接。 这种焊接技术在应用于有助于将芯片安装到印刷电路板，其它芯片或基板上的类似结构的焊球时是特别有利的。 本发明还可用于减少焊料组合物中存在的铅和/或其它有毒成分的总量。

    Conductive adhesive having a palladium matrix interface between two metal surfaces
    38.
    发明授权
    Conductive adhesive having a palladium matrix interface between two metal surfaces 失效
    在两个金属表面之间具有钯基体界面的导电粘合剂

    公开(公告)号：US06331119B1

    公开(公告)日：2001-12-18

    申请号：US09474912

    申请日：1999-12-28

    Applicant: William E. Bernier ,  Edward G. Bundga

    Inventor： William E. Bernier ,  Edward G. Bundga

    IPC: H01R458

    CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H01R12/52 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/0307 ,  Y10T428/12569 ,  H01L2924/00

    Abstract: A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond is provided. Preferably, the metal surfaces are the surfaces of metal contact pads on a dielectric substrate and on an electronic device such as an I/C chip or chip carrier. The mechanical bond and electrical connection is provided by utilizing a conductive adhesive, in which adhesive the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon, preferably by electrodeposition. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. However, the shape of the particle is not significant. The polymer preferably is conventional polyimide/siloxane which is well known in the art for use in formulating conductive adhesives. The polyimide/siloxane is a thermoplastic, i.e. upon heating it softens and upon cooling it sets, and upon reheating it will soften and reflow.

    Abstract translation: 提供了形成各向同性电连接的方法和在其上具有金属表面的两个制品之间的机械结合以及所得到的结合。 优选地，金属表面是电介质基板上的金属接触焊盘和诸如I / C芯片或芯片载体的电子设备的表面。 通过使用导电粘合剂提供机械结合和电连接，其中粘合剂由在其上具有暴露的钯的金属颗粒提供传导。 颗粒可以是金属钯本身，或者它可以是一些其它金属，例如银，其上涂覆有钯，优选通过电沉积。 颗粒通常是表面上具有初始树枝状形式的钯的薄片，即， 钯具有可以生长成完全形成的针状树枝状结构的多点表面构型。 然而，颗粒的形状不显着。 聚合物优选是本领域公知的用于配制导电粘合剂的常规聚酰亚胺/硅氧烷。 聚酰亚胺/硅氧烷是热塑性的，即加热时它会软化并在冷却时固化，并且在再加热时它将软化和回流。

Patent Agency Ranking