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    Conductive adhesive having a palladium matrix interface between two metal surfaces
    2.
    发明授权
    Conductive adhesive having a palladium matrix interface between two metal surfaces 失效
    在两个金属表面之间具有钯基体界面的导电粘合剂

    公开(公告)号：US06331119B1

    公开(公告)日：2001-12-18

    申请号：US09474912

    申请日：1999-12-28

    申请人： William E. Bernier ,  Edward G. Bundga

    发明人： William E. Bernier ,  Edward G. Bundga

    IPC分类号： H01R458

    CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H01R12/52 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/0307 ,  Y10T428/12569 ,  H01L2924/00

    摘要： A method of forming an isotropic electrical connection and a mechanical bond between two articles having metal surfaces thereon and the resulting bond is provided. Preferably, the metal surfaces are the surfaces of metal contact pads on a dielectric substrate and on an electronic device such as an I/C chip or chip carrier. The mechanical bond and electrical connection is provided by utilizing a conductive adhesive, in which adhesive the conduction is provided by metal particles which have exposed palladium thereon. The particles may be the metal palladium itself or it may be some other metal, such as silver, having palladium coated thereon, preferably by electrodeposition. The particles typically are flakes with the palladium having an incipient dendritic form on the surface, i.e.; the palladium has a multi-pointed surface configuration that can grow into fully formed needle-like dendritic structures. However, the shape of the particle is not significant. The polymer preferably is conventional polyimide/siloxane which is well known in the art for use in formulating conductive adhesives. The polyimide/siloxane is a thermoplastic, i.e. upon heating it softens and upon cooling it sets, and upon reheating it will soften and reflow.

    摘要翻译： 提供了形成各向同性电连接的方法和在其上具有金属表面的两个制品之间的机械结合以及所得到的结合。 优选地，金属表面是电介质基板上的金属接触焊盘和诸如I / C芯片或芯片载体的电子设备的表面。 通过使用导电粘合剂提供机械结合和电连接，其中粘合剂由在其上具有暴露的钯的金属颗粒提供传导。 颗粒可以是金属钯本身，或者它可以是一些其它金属，例如银，其上涂覆有钯，优选通过电沉积。 颗粒通常是表面上具有初始树枝状形式的钯的薄片，即， 钯具有可以生长成完全形成的针状树枝状结构的多点表面构型。 然而，颗粒的形状不显着。 聚合物优选是本领域公知的用于配制导电粘合剂的常规聚酰亚胺/硅氧烷。 聚酰亚胺/硅氧烷是热塑性的，即加热时它会软化并在冷却时固化，并且在再加热时它将软化和回流。

    Flux composition and soldering method for high density arrays
    8.
    发明授权
    Flux composition and soldering method for high density arrays 有权
    高密度阵列的焊剂组成和焊接方法

    公开(公告)号：US06550667B2

    公开(公告)日：2003-04-22

    申请号：US09726697

    申请日：2000-11-29

    申请人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

    发明人： William E. Bernier ,  Donald W. Henderson ,  James Spalik

    IPC分类号： B23K35362

    CPC分类号： B23K35/3618 ,  B23K35/3612 ,  B23K35/3617 ,  H05K3/3489

    摘要： A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.

    摘要翻译： 适用于高密度阵列的单相通量组合物，其包含足以与高密度阵列中的氧化表面积反应的二羧酸，第一有机溶剂和具有较高蒸发温度的第二有机溶剂 比所述第一有机溶剂的。 优选的二羧酸是己二酸，庚二酸，辛二酸，壬二酸和癸二酸。 优选地，组合物包含大于6％的二羧酸，更优选大于6％至约15％，甚至更优选约8％至约10％的二羧酸。 第一有机溶剂的优选量为约25重量％至约75重量％，优选的第二有机溶剂的量为约10重量％至约35重量％。 优选地，第一有机溶剂与第二有机溶剂的比例为约3:1。 使用本发明组合物来焊接高密度阵列的方法，对于共晶铅/锡焊料，其涉及相对于典型组合物在延长的停留时间和高温下加热。

    Pulpstone for Long Fiber Pulp Production
    9.
    发明申请
    Pulpstone for Long Fiber Pulp Production 失效
    长纤维纸浆生产纸浆

    公开(公告)号：US20080250725A1

    公开(公告)日：2008-10-16

    申请号：US12100084

    申请日：2008-04-09

    申请人： Glen A. Smith ,  William E. Bernier

    发明人： Glen A. Smith ,  William E. Bernier

    IPC分类号： C09K3/14

    CPC分类号： B24D5/06 ,  C09K3/1409 ,  D21B1/063

    摘要： Pulp production techniques are disclosed. In one embodiment, pulpstone segments are provided, that include proppant grits in the place of some or all of the conventional abrasive typically used in pulpstone applications. The proppant or proppant-abrasive mixture can be combined into a three-dimensional matrix supported by a vitrified bond. Alternative embodiments use proppant grits in an organic bond or a metal bond or a cement bond (each of which may also include abrasive grits in addition to proppant grits). The proportion of proppant grits to abrasive grits can be varied to produce pulp of varying fiber length distribution as required by the end-user (e.g., paper mill). The greater the proppant concentration, the less cutting of the fibers by the conventional abrasive will occur, producing a greater percentage content of longer fibers. Such pulp produces higher quality paper.

    摘要翻译： 公布了纸浆生产技术。 在一个实施例中，提供了纸浆段，其包括支撑剂砂粒代替通常用于纸浆应用中的一些或全部常规磨料。 支撑剂或支撑剂 - 研磨剂混合物可以组合成由玻璃化键支撑的三维基质。 替代实施例使用有机粘结剂或金属粘结剂或粘结剂粘合剂中的支撑剂砂砾（除了支撑剂砂砾之外，每种也可包括磨料砂粒）。 可以改变支撑剂砂粒对磨料砂粒的比例，以产生根据最终用户（例如造纸厂）所要求的不同纤维长度分布的纸浆。 支撑剂浓度越大，将会发生常规研磨剂对纤维的切割越少，从而产生更长的纤维含量。 这样的纸浆产生更高质量的纸张。