公开(公告)号：US20090303691A1

公开(公告)日：2009-12-10

申请号：US12421579

申请日：2009-04-09

Applicant: Byung-Sung Choi

Inventor： Byung-Sung Choi

IPC: H05K7/00 ,  H05K1/14

CPC classification number: H05K1/147 ,  H05K1/18 ,  H05K3/0064 ,  H05K3/365 ,  H05K3/4015 ,  H05K2201/0314

Abstract: Disclosed is a portable terminal, including a first circuit board coupled to a main body and having a first connection terminal mounted on a surface thereof; a second circuit board coupled to the main body so as to cover at least a portion of the first circuit board, having a first area where an intermediate connection terminal contacting the first connection terminal is mounted on a surface thereof, and a second area where a second connection terminal electrically connected to the intermediate connection terminal is mounted on a surface thereof; and an electronic component having at least a portion thereof contacted by the second connection terminal, and for being electrically connected to the first circuit board.

Abstract translation: 公开了一种便携式终端，包括耦合到主体并具有安装在其表面上的第一连接端子的第一电路板; 第二电路板，其耦合到主体以覆盖第一电路板的至少一部分，具有第一区域，其中与第一连接端子接触的中间连接端子安装在其表面上;第二区域，其中， 电连接到中间连接端子的第二连接端子安装在其表面上; 以及电子部件，其至少一部分与第二连接端子接触，并与第一电路板电连接。

公开(公告)号：US07618704B2

公开(公告)日：2009-11-17

申请号：US10953679

申请日：2004-09-28

Applicant: Steven Dale Ittel ,  Jeffrey Crawford

Inventor： Steven Dale Ittel ,  Jeffrey Crawford

IPC: B32B5/16 ,  C08K9/00

CPC classification number: B32B5/16 ,  C08F10/10 ,  C09D11/52 ,  D01D10/02 ,  D01F1/09 ,  D01F1/10 ,  D01F8/04 ,  G03F7/0047 ,  H01G9/2031 ,  H01L51/0022 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0314 ,  H05K2203/0126 ,  Y02E10/542 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/25 ,  Y10T428/256 ,  C08F2500/01

Abstract: The present invention is directed to a process for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements that may be for electronics and display applications. The present invention also relates to viscoelastic compositions used in this printing process. The present invention further includes devices made therefrom.

Abstract translation: 本发明涉及用于印刷可用于电子和显示应用的导体，绝缘体，电介质，荧光体，发射体和其它元件的方法。 本发明还涉及在该印刷方法中使用的粘弹性组合物。 本发明还包括由其制成的装置。

公开(公告)号：US20090129029A1

公开(公告)日：2009-05-21

申请号：US11942308

申请日：2007-11-19

Applicant: Jens Niemax

Inventor： Jens Niemax

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K3/325 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/0314 ,  H05K2201/2018 ,  H05K2203/0169 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method for manufacturing an integrated circuit is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board.

Abstract translation: 公开了一种用于制造集成电路的方法。 一个实施例提供将弹性各向异性导电材料放置在印刷电路板的顶部上。 将电子部件放置在弹性各向异性导电材料上，将电子部件固定在印刷电路板上。

公开(公告)号：US20090050353A1

公开(公告)日：2009-02-26

申请号：US12178055

申请日：2008-07-23

Applicant: Nobuaki HASHIMOTO

Inventor： Nobuaki HASHIMOTO

IPC: H05K1/02

CPC classification number: H05K3/325 ,  G02F2001/13456 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13008 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/305 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2224/05099

Abstract: A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.

Abstract translation: 电子部件的安装结构包括：包括在电子部件中的凸块电极，具有内部树脂作为芯的凸块电极和覆盖内部树脂的表面的导电膜，并且弹性变形，以便遵循 端子的至少一个角部，使得导电膜与端子的顶表面的至少一部分和沿着端子的厚度方向的表面的至少一部分直接导电接触; 具有安装在基板上的端子和电子部件的基板; 以及保持单元，其设置到所述基板和所述电子部件，以保持所述凸起电极变形的状态与所述端子导电接触。

公开(公告)号：US07488899B2

公开(公告)日：2009-02-10

申请号：US11151925

申请日：2005-06-14

Applicant: Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

Inventor： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC: H01R12/04 ,  H05K1/11

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract translation: 提供了柔性接触销组件和接触器卡系统。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20080153207A1

公开(公告)日：2008-06-26

申请号：US12044239

申请日：2008-03-07

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构， 各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

公开(公告)号：US20070274060A1

公开(公告)日：2007-11-29

申请号：US11568111

申请日：2005-04-15

Applicant: Yukihiro Kiuchi ,  Masahiro Ishibashi ,  Yoshitaka Kyogoku

Inventor： Yukihiro Kiuchi ,  Masahiro Ishibashi ,  Yoshitaka Kyogoku

IPC: H05K7/02

CPC classification number: H01L23/10 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0271 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0314 ,  H05K2201/10674 ,  H05K2203/1536 ,  Y10T29/49124

Abstract: In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.

Abstract translation: 在半导体装置（1）中，设置多层布线层的封装基板（2），在封装基板的最上层布线层（矩阵状）配置多个安装基板（5） 2），并且焊料凸块（7）连接到安装焊盘（5）。 通过焊锡凸块（7）将半导体芯片（9）安装在封装板（2）上。 封装基板（2）的最上层布线层由温度为10〜30℃的杨氏模量为1GPa以下的树脂材料形成，断裂伸长率为50％以上。

公开(公告)号：US07287326B2

公开(公告)日：2007-10-30

申请号：US11152496

申请日：2005-06-14

Applicant: Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

Inventor： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC: H01R43/16 ,  H10R43/00

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract translation: 提供了一种用于制造的柔性接触销组装方法。 柔性接触销组件包括由基板的一部分形成的接触销，其中触头销顺从地保持通过柔性联接结构悬挂在基板内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US07282932B2

公开(公告)日：2007-10-16

申请号：US10791195

申请日：2004-03-02

Applicant: Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

Inventor： Kyle K. Kirby ,  Warren M. Farnworth ,  James M. Wark ,  William M. Hiatt ,  David R. Hembree ,  Alan G. Wood

IPC: G01R31/02

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract translation: 提供了兼容的接触针组件，接触器卡，测试系统以及制造和测试方法。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20070228562A1

公开(公告)日：2007-10-04

申请号：US11761315

申请日：2007-06-11

Applicant: David Boggs ,  John Dungan ,  Frank Sanders ,  Daryl Sato ,  Dan Willis

Inventor： David Boggs ,  John Dungan ,  Frank Sanders ,  Daryl Sato ,  Dan Willis

IPC: H01L23/48

CPC classification number: H05K7/1053 ,  H01L21/4853 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/321 ,  H05K7/1061 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract translation: 描述了集成电路封装的多个导电连接器的形成。 导电连接器由导电弹性体材料制成，并使用包括连接在一起的多个导电连接器的插入件形成。