公开(公告)号：US20060262584A1

公开(公告)日：2006-11-23

申请号：US11461265

申请日：2006-07-31

Applicant: Robert Wallace ,  Robert Norman ,  Eliyahou Harari

Inventor： Robert Wallace ,  Robert Norman ,  Eliyahou Harari

IPC: G11C5/00

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US20050226023A1

公开(公告)日：2005-10-13

申请号：US11157610

申请日：2005-06-20

Applicant: Robert Wallace ,  Robert Norman ,  Eliyahou Harari

Inventor： Robert Wallace ,  Robert Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US20040017707A1

公开(公告)日：2004-01-29

申请号：US10628746

申请日：2003-07-28

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C007/00

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡都可以提供必要的控制器电路，因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US06169325A

公开(公告)日：2001-01-02

申请号：US09210883

申请日：1998-12-15

Applicant: Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

Inventor： Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

IPC: H01L2302

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起，实现了大型存储尺寸的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的灌封树脂和布置在两个相对的短边上的一对支撑引线构成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：US5663901A

公开(公告)日：1997-09-02

申请号：US527254

申请日：1995-09-12

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US5028111A

公开(公告)日：1991-07-02

申请号：US432746

申请日：1989-10-16

Applicant: Mitsuru Yumoto ,  Takashi Yokota

Inventor： Mitsuru Yumoto ,  Takashi Yokota

IPC: G02B6/32 ,  G02B6/42 ,  G02B7/00 ,  H01L25/16 ,  H01L33/58 ,  H05K1/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/167 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4238 ,  G02B6/4246 ,  G02B7/008 ,  H05K1/111 ,  H05K3/341 ,  H05K3/3421 ,  H01L2924/0002 ,  H01L33/58 ,  H05K1/0284 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2203/0195 ,  Y02P70/611 ,  Y02P70/613

Abstract: According to the present invention, a fixing method by soldering is provided which attains, upon fixing to a substrate a cylindrical optical part which includes a lens, a photo-semiconductor device having a light emitting portion or a light receiving portion located substantially at a focus position of the lens, and terminals connected to the photo-semiconductor device, mechanical fixation of the cylindrical optical part to the substrate and electric connection of the terminals to the substrate at a time. According to another aspect of the present invention, a method of collectively fixing an optical part and an electric part on a substrate by soldering is provided. A heating block is divided into a portion made of a substance having a high coefficient of thermal conductivity and another portion made of another substance having a low coefficient of thermal conductivity. The portion made of the substance having a high coefficient of thermal conductivity is contacted with a reverse face of a portion of a substrate at which an optical part is mounted while the portion made of the substance having a low coefficient of thermal conductivity is contacted with the reverse face of another portion of the substrate at which an electric part is mounted.

Abstract translation: PCT No.PCT / JP89 / 00146 Sec。 371日期：1989年10月16日 102（e）日期1989年10月16日PCT提交1989年2月14日PCT公布。 出版物WO89 / 07779 日本1989年8月24日。根据本发明，提供一种通过焊接的固定方法，其在固定到基板上时实现包括透镜的圆柱形光学部件，具有发光部分或光的光半导体器件 基本上位于透镜的焦点位置处的接收部分，以及连接到光电半导体器件的端子，将圆柱形光学部件机械固定到基板并且一次将端子电连接到基板。 根据本发明的另一方面，提供了一种通过焊接将基板上的光学部件和电气部件集体固定的方法。 加热块被分成由具有高导热系数的物质制成的部分和由具有低导热系数的另一物质制成的另一部分。 由具有高导热系数的物质制成的部分与安装有光学部件的基板的一部分的反面接触，而由具有低导热系数的物质制成的部分与 安装有电气部件的基板的另一部分的反面。

公开(公告)号：US5026134A

公开(公告)日：1991-06-25

申请号：US316666

申请日：1989-02-28

Applicant: Mitsuru Sugawara ,  Akitoshi Yoshinaga ,  Fumihiko Shimizu ,  Masayuki Takami

Inventor： Mitsuru Sugawara ,  Akitoshi Yoshinaga ,  Fumihiko Shimizu ,  Masayuki Takami

IPC: G02B6/42 ,  H01L31/167 ,  H01S5/026 ,  H05K1/02

CPC classification number: H01S5/026 ,  G02B6/42 ,  G02B6/4246 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/10287 ,  H05K2201/10462

Abstract: An optical communication apparatus which comprises a printed circuit board, plural circuit elements fixed to the printed circuit board, the circuit elements having terminals extended to the printed circuit board, a photosensitive glass base fixed to the printed circuit board, various optical components accurately fixed to the glass base, the optical elements respectively having plural leads, and corresponding conductive members for electrically connecting the terminals of the circuit elements and the corresponding leads of the optical components, the conductive members each having a rigidity smaller than the rigidity of the corresponding leads of the optical components.

公开(公告)号：US4897769A

公开(公告)日：1990-01-30

申请号：US197186

申请日：1988-05-18

Applicant: John M. Lang

Inventor： John M. Lang

IPC: H01L33/48 ,  H01R13/717 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01R12/58 ,  H01L33/483 ,  H01R12/7064 ,  H01R13/7175 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K3/3447 ,  Y10S362/80

Abstract: This invention relates to a right angle light emitting diode assembly with snap-in feature wherein an insulating body, generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light emitting diode in the insulating body at right angles to the surface of a printed wiring board, the insulating body being shaped such that robotic equipment can be used to insert the diode assembly cheaply and efficiently onto said board. The insulating body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light emitting diode (LED) to be fixedly mounted in said body and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in proturbances which pass through the hole on a printed wiring board which deform inwardly slightly while passing through the hole and expand outwardly after extending out from beyond the hole to fixedly mount the diode assembly in the correct position on the board.

公开(公告)号：US10037898B2

公开(公告)日：2018-07-31

申请号：US15089208

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: H05K1/18 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  B23K35/36 ,  B23K101/40 ,  H01L23/488 ,  B23K101/42

CPC classification number: H01L21/4864 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L2225/06513 ,  H01L2225/06517 ,  H05K1/11 ,  H05K1/181 ,  H05K2201/10462 ,  H05K2201/10674

Abstract: A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.

公开(公告)号：US09462996B2

公开(公告)日：2016-10-11

申请号：US14549364

申请日：2014-11-20

Applicant: SAMSUNG MEDISON CO., LTD.

Inventor： Gil Ju Jin ,  Jung Lim Park ,  Jae Yk Kim

IPC: H05K1/00 ,  A61B8/00 ,  B06B1/06 ,  H05K3/30 ,  H05K1/18

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract translation: 探头包括换能器，具有经由面对面接触而与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。