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    ELECTRICAL COMPONENT MOUNTING ASSEMBLIES
    32.
    发明申请
    ELECTRICAL COMPONENT MOUNTING ASSEMBLIES 有权
    电气组件安装组件

    公开(公告)号：US20110038133A1

    公开(公告)日：2011-02-17

    申请号：US12679684

    申请日：2008-09-24

    Applicant: Niall McNamara ,  Brendan Maguire ,  Denis O'Sullivan ,  SeanGearoid McMahon ,  Colm Reidy ,  Michael Crampton

    Inventor： Niall McNamara ,  Brendan Maguire ,  Denis O'Sullivan ,  SeanGearoid McMahon ,  Colm Reidy ,  Michael Crampton

    IPC: H05K7/02 ,  H05K1/18 ,  H05K7/14 ,  H05K3/30

    CPC classification number: H05K3/301 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10606

    Abstract: An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (C1) such as capacitor, diode, or resistor to a mounting member such as a printed circuit board in a horizontal or vertical orientation. The mounting assembly can have a housing (12) and a sleeve (14) placed around the electrical component which cooperates with the housing to retain the electrical component to the housing. A substantially inner cylindrical wall (32) of the housing can taper inward from an entrance (34) end to a rear wall (18) to form a tapering or narrowing chamber (30). The sleeve can have a slit that runs along the entire length of the sleeve and a tapered outer surface (28) that cooperates with the tapered chamber to clamp or compress against the electrical component as the sleeve is inserted into the housing. The lack of appreciable expansion of the housing creates a tight friction fit to secure the sleeve to the housing. The sleeve can also include a plank that is received in an opening in the housing which can be heat staked to reinforce the friction fit taper lock between the housing and sleeve. The housing can be dimensioned to mount more than one electrical component diameter size by varying the dimensions of the sleeve, and in particular the thickness of sleeve.

    Abstract translation: 公开了一种用于将诸如电容器，二极管或电阻器的圆柱形电气元件（C1）以水平或垂直取向附接到诸如印刷电路板的安装构件的电气部件安装组件。 安装组件可以具有壳体（12）和围绕电气部件设置的套筒（14），该套件与壳体配合以将电气部件保持在壳体上。 壳体的基本上内圆柱形的壁（32）可以从入口（34）端向后壁（18）向内锥形以形成锥形或变窄的腔室（30）。 套筒可以具有沿套筒的整个长度延伸的狭缝和锥形外表面（28），锥形外表面（28）与套筒插入壳体中时与锥形室配合以夹紧或压缩电气部件。 外壳缺乏明显的膨胀产生紧密的摩擦配合以将套筒固定到壳体上。 套筒还可以包括容纳在壳体中的开口中的板材，该板材可被热铆接以加强壳体和套筒之间的摩擦配合锥形锁定。 可以通过改变套筒的尺寸，特别是套筒的厚度来确定外壳的尺寸以安装多于一个电气部件的直径尺寸。

    Stand-off mounting apparatus for discrete electrical components
    33.
    发明授权
    Stand-off mounting apparatus for discrete electrical components 有权
    用于分立电气部件的支架安装装置

    公开(公告)号：US07791901B2

    公开(公告)日：2010-09-07

    申请号：US11805603

    申请日：2007-05-24

    Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

    Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

    IPC: H05K7/02 ,  H05K7/04

    CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

    Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

    Abstract translation: 一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。 载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。 脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。 用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

    Mounting substrate and microphone mounted thereon
    34.
    发明授权
    Mounting substrate and microphone mounted thereon 有权
    安装在其上的安装基板和麦克风

    公开(公告)号：US07687723B2

    公开(公告)日：2010-03-30

    申请号：US11483303

    申请日：2006-07-06

    Applicant: Toshiro Izuchi ,  Kazuo Ono ,  Kensuke Nakanishi ,  Hiroaki Onishi

    Inventor： Toshiro Izuchi ,  Kazuo Ono ,  Kensuke Nakanishi ,  Hiroaki Onishi

    IPC: H05K1/16

    CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

    Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.

    Abstract translation: 为了提供一种安装基板，其需要减少量的焊料并减少焊料在电子部件内部的热效应，以及要安装在基板上的麦克风。 根据本发明的安装基板包括：形成在形成在安装基板上的电极的一部分上的焊料部分; 形成为防止焊料部分的焊料流出预定范围的抗蚀剂膜; 以及由不存在电极和抗蚀剂膜构成的气体排出槽，能够使焊接时产生的气体逸出。

    Electronic apparatus
    35.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US07672138B2

    公开(公告)日：2010-03-02

    申请号：US11826851

    申请日：2007-07-19

    Applicant: Akira Kawabata ,  Yuichiro Fukaya

    Inventor： Akira Kawabata ,  Yuichiro Fukaya

    IPC: H05K7/02

    CPC classification number: H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

    Abstract: An electronic apparatus include a housing, a circuit board held in the housing, and large electronic components held in the housing and electrically coupled to the circuit board. The housing has a mounting surface, and the electronic apparatus is mounted to an object at the mounting surface. The large electronic components are arranged in a three-dimensional manner with respect to the mounting surface in such a manner that at least one of the large electronic components overlaps at least one of the large electronic components in a direction toward the mounting surface.

    Abstract translation: 电子设备包括壳体，保持在壳体中的电路板以及保持在壳体中并电耦合到电路板的大型电子部件。 壳体具有安装面，电子设备安装在安装面上的物体上。 大型电子部件以相对于安装面的三维方式配置，使得大电子部件中的至少一个与朝向安装面的方向重叠至少一个大型电子部件。

    Electronic apparatus with a pin mount
    36.
    发明授权
    Electronic apparatus with a pin mount 有权
    电子设备带有针脚安装

    公开(公告)号：US07658623B2

    公开(公告)日：2010-02-09

    申请号：US12254329

    申请日：2008-10-20

    Applicant: Po-Sheng Lee

    Inventor： Po-Sheng Lee

    IPC: H01R12/00

    CPC classification number: H05K3/301 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606

    Abstract: An electronic apparatus has an electronic component and a pin mount. The electronic component has a working surface and two pins protruding from the working surface and each pin being bent to form an L-shape with a proximal part and a distal part. The pin mount has a flat bottom, a rear, two through holes and two communicating recesses. The through holes are defined through the pin mount in parallel, are formed from the front to the rear and receiving the proximal parts of the pins. The communicating recesses are formed in parallel in the front from the through holes toward the bottom of the pin mount, communicate respectively with the through holes and receiving the distal parts of the pins. The pin mount immobilizes the electronic component to prevent the pins from being detached from the electronic component or the PCB to retain the lifetime of the pins.

    Abstract translation: 电子设备具有电子部件和销安装件。 电子部件具有工作面和从工作面突出的两个销，每个销弯曲形成具有近端部分和远端部分的L形。 销安装座有一个平底，一个后部，两个通孔和两个连通的凹槽。 通孔平行地通过销安装件形成，从前到后形成并容纳销的近端部分。 连通凹部从前面的通孔朝向销安装座的底部平行地形成，分别与通孔连通并且接收销的远端部分。 引脚安装件固定电子部件，以防止引脚与电子部件或PCB分离，以保持引脚的寿命。

    Method for mounting leaded component to substrate
    37.
    发明申请
    Method for mounting leaded component to substrate 审中-公开
    将引线元件安装到基板上的方法

    公开(公告)号：US20080259580A1

    公开(公告)日：2008-10-23

    申请号：US11788702

    申请日：2007-04-20

    Applicant: Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

    Inventor： Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

    IPC: H05K3/30 ,  H05K7/00

    CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

    Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

    Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接纳在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电气元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热 - 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

    PRINTED CIRCUIT BOARD WITH QUARTZ CRYSTAL OSCILLATOR
    39.
    发明申请
    PRINTED CIRCUIT BOARD WITH QUARTZ CRYSTAL OSCILLATOR 失效
    印刷电路板与QUARTZ水晶振荡器

    公开(公告)号：US20070114638A1

    公开(公告)日：2007-05-24

    申请号：US11309215

    申请日：2006-07-13

    Applicant: Ling-Ling Shen

    Inventor： Ling-Ling Shen

    IPC: H01L23/495

    CPC classification number: H05K1/0243 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10075 ,  H05K2201/10287 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10969 ,  H01L2924/00

    Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

    Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域，两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层，并与铜箔连通，将石英晶体振荡器的噪声传递到PCB的接地层。

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