Abstract:
Electrical lead frames are stamped from a strip of metal, each of the lead frames including spaced metal strips extending between carrier members. Projections extend outwardly from the metal strips. A dielectric housing is molded onto each of the lead frames and includes recesses in one surface exposing respective projections and holes extending through the housing in communication with the respective projections so that the electrical leads of electronic components and electrical wires can be inserted into the holes in electrical engagement with the projections and secured therein by the projections.
Abstract:
A planar terminated capacitor and a method for fabricating planar terminated capacitors is disclosed wherein a capacitor element is inserted in a nonconductive tubular sleeve. The sleeve extends outwardly beyond the ends of the capacitor element forming cavities at each end of the sleeve. These cavities are filled with a conductive substance and metal end caps are positioned at the ends of the sleeve substantially enclosing the cavities. The conductive substance electrically couples the end caps to the ends of the capacitor element.
Abstract:
An improved electronics containing cartridge and cartridge holder are disclosed. The cartridge is utilized to encase electronic circuitry, such as a bubble memory, which can be selectively added to main equipment via the cartridge holder. The cartridge itself is made by an improved system which eliminates the environmental concerns of printed circuit board manufacture. The circuit board of the cartridge is formed by molding a substantially planar member with a plurality of circuit trace forming grooves therein. The circuitry is stamped from a metal web and inserted into the respective grooves. The contacts of the holder and cartridge are arranged for low wear operation. Both of the cartridge and the holder are provided with means which are readily exchangeable and provide a plurality of keyed configurations to assure that only the proper cartridge will be inserted into the respective holder.
Abstract:
A technique and assembly is disclosed which allows more effective heat dissipation in a printed circuit assembly. A heatsink plate is etched using the artwork or masks used to form the conductive strips and terminals on a conventional printed circuit board. The heatsink plate is secured over at least a portion of the surface of the printed circuit board by an adhesive and the resulting heatsink assembly is mounted adjacent to a thermally conductive bracket. The heatsink assembly is then secured to the bracket by a wedge clamp which includes mating wedges configured to provide a high thermally conductive path between the heatsink plate and bracket for dissipating heat generated in or about the printed circuit heatsink assembly. The clamp configuration is such as to allow slidable movement between similarly shaped wedges which produces proper formation of the thermally conductive path during clamping.The Government has rights to this invention pursuant to contract No. F04701-79-C-0083, awarded by the Department of the Air Force.
Abstract:
A printed circuit board has temperature-stable electric components, such as resistance networks, disposed on the soldering side of the circuit board. The components mounted on the soldering side of the board are mounted as a unit containing the network, which unit has a recess which partially surrounds the solder connection location of the circuit board, at which point the unitary component is electrically and mechanically connected to the board. The recesses are beveled to facilitate solder flow, and cover approximately half of the connection location of the circuit board.
Abstract:
An electrical resistor comprising an elongated resistor body having a resistance wire winding extending between its ends and terminals at each end contact the resistance winding and each comprise a strip of given width having a first end portion extending about and secured with an end of the body, and a second end portion which extends in a direction transverse to the axis of the body and has a tip for being received through an opening in a printed circuit board. Each strip has an intermediate neck portion of reduced width which is positioned proximate to the resistor body and is twisted so that the second portion extends in a plane which is perpendicular to the axis of the body and in the same direction with and spaced from that of the other terminal allowing adjustment of the distance between their tips. The second end portions each have a shoulder proximate to its tip which is seated on the surface of a circuit board, fixing the position of the resistor and stabilizing its mounting thereon.The method of making an electrical resistor comprises the steps of segmenting a continuous wire wound core to provide resistor bodies, and cutting out portions of a continuous substantially plane strip of metal material at spaced locations therealong to provide narrow neck regions, and first and second end portions above and below each neck region.
Abstract:
A matrix assembly comprised of a plurality of electrical components (diodes) having one lead or electrical connector thereof permanently or semi-permanently attached to a printed circuit board and in electrical contact with the printed circuit conductors on it. The electrical components are disposed and retained within openings extending through a spacer, in a fashion such that the other lead or electrical connector thereof functions as a plug to receive a contact pin receptacle. The openings in the spacer function to support the electrical components and to guide the contact pin receptacles into engagement with the electrical connectors of the electrical components. In this fashion, an electrical path may be readily made, or interrupted, to program or encode the matrix circuit, by simply affixing an electrical component into the appropriate ones of the openings in the spacer and electrically connecting the one lead thereof. Upon being plugged into the contact pin receptacles, the electrical interconnections are established. The contact pin receptacles can be affixed to another support member such as, for example, another printed circuit board.
Abstract:
Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.
Abstract:
A mounting element for aligning an electrical component so that it is parallel with the plane of the circuit board (or chassis) on which it is contained. The mounting element includes a shank, an intermediate flat shoulder, and a post extending upright from the shoulder. The shank is inserted through a hole in the board and is fastened to the board so that the underside of the shoulder lies flat against the board. The component to be mounted includes a bore in its underside which mates with the upright post of the mounting element. The component can be mounted on the post with a press-fit or cemented thereto, so that it lies on the shoulder in a plane parallel with that of the board.