公开(公告)号：US20230377931A1

公开(公告)日：2023-11-23

申请号：US18199242

申请日：2023-05-18

Applicant: SEMES CO., LTD.

Inventor： Junseok Park ,  Chulho Jung ,  Jongjoon Jeon

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/6838

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a support plate configured to support a substrate, a base plate under the support plate, a thermal insulation layer between the support plate and the base plate, and a bonder bonding the base plate and the thermal insulation layer to each other, wherein the thermal insulation layer is brought into tight contact with a lower end surface of the support plate by using a bolt.

公开(公告)号：US20230369021A1

公开(公告)日：2023-11-16

申请号：US18135740

申请日：2023-04-18

Applicant: SEMES CO., LTD.

Inventor： Yoon Seok Choi ,  Yun Sang Kim ,  Youn Gun Bong ,  Jae Won Shin ,  Jong Won Park

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J37/32568 ,  H01J37/32229 ,  H01J37/32238 ,  H01J37/32633 ,  H01J2237/334

Abstract: A substrate treating apparatus is provided to provide heating and plasma treatment of a substrate in a single device, and the substrate treating apparatus includes a treatment container in which a substrate is accommodated, a support member supporting the substrate in the treatment container, a plasma providing unit including an electrode generating plasma within the treatment container, and a microwave introducing unit connected to a microwave generating unit and introducing microwaves into the treatment container.

公开(公告)号：US20230369018A1

公开(公告)日：2023-11-16

申请号：US18310740

申请日：2023-05-02

Applicant: SEMES CO., LTD.

Inventor： Sangjeong LEE ,  Youngun Bong ,  Yoonseok Choi ,  Jaewon Shin ,  Hanlim Kang ,  Jongwon Park ,  Hyunwoo Jo ,  Kyunghun Jang

IPC: H01J37/32

CPC classification number: H01J37/32119 ,  H01J37/3244 ,  H01J37/32091

Abstract: There is provided a substrate processing apparatus including a chamber having a processing space therein, a dielectric window arranged at an upper portion of the chamber and configured to cover an upper surface of the chamber, and an RF source disposed on the dielectric window and configured to supply RF power to generate plasma from gas in the processing space, wherein the RF source includes an RF electrode disposed on the dielectric window and an RF plate disposed on the RF electrode, the dielectric window includes a groove extending vertically downward from an uppermost surface of the dielectric window, and the RF plate has a ring shape.

公开(公告)号：US20230367233A1

公开(公告)日：2023-11-16

申请号：US17990659

申请日：2022-11-19

Applicant: SEMES CO., LTD.

Inventor： Ick Kyun Kim ,  Sung Hun Eom

IPC: G03F7/00 ,  G03F7/16

CPC classification number: G03F7/70925 ,  G03F7/162 ,  H01L21/02087

Abstract: Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.

公开(公告)号：US20230360893A1

公开(公告)日：2023-11-09

申请号：US18309285

申请日：2023-04-28

Applicant: SEMES CO., LTD.

Inventor： Dukhyun SON

IPC: H01F27/28 ,  H01J37/32 ,  H01F27/24

CPC classification number: H01J37/32669 ,  H01F27/24 ,  H01F27/28 ,  H01J37/32935 ,  H01J37/3299 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/334

Abstract: Provided is a plasma processing apparatus. The plasma processing apparatus includes a chamber configured to isolate a plasma region where plasma is formed from an outside, a core located on the chamber and configured to form a magnetic field in the chamber, and a plurality of coils located adjacent to the core, wherein the core includes a first core having a donut shape, and the plurality of coils include first and second upper outer coils located on a top surface of the first core.

公开(公告)号：US20230352325A1

公开(公告)日：2023-11-02

申请号：US18302303

申请日：2023-04-18

Applicant: SEMES CO., LTD.

Inventor： Kwang Jun CHOI ,  Jun Woo LEE ,  Boyeon HWANG ,  Gyeong Seok HWANG ,  Nayoon JEOUNG ,  Sungkeun BYUN

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/6715 ,  H01L21/67051 ,  H01L21/02052 ,  H01L21/67259

Abstract: An apparatus and method for dispensing treatment liquid, which enable treatment liquid to be accurately dispensed to an intended position on a substrate having a non-planar surface on the basis of measurement information obtained by three-dimensionally measuring the substrate. The apparatus may include: a substrate support unit on which a substrate is seated; a three-dimensional (3D) measurement device configured to three-dimensionally measure the substrate seated on the substrate support unit; a head unit configured to dispense treatment liquid onto the substrate seated on the substrate support unit; and a controller configured to receive actually measured 3D substrate information of the substrate from the 3D measurement device, generate printing pattern image information based on the actually measured 3D substrate information, and apply printing command information to the head unit according to the generated printing pattern image information.

公开(公告)号：US20230352319A1

公开(公告)日：2023-11-02

申请号：US18302287

申请日：2023-04-18

Applicant: SEMES CO., LTD.

Inventor： Jun Seok LEE ,  Beomjeong OH ,  Subeom JEON ,  Jeong Ho JO

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/02052

Abstract: Provided is a treatment liquid ejection method and apparatus capable of significantly increasing productivity and quality by greatly reducing a maintenance time of a head unit, the treatment liquid ejection method including (a) obtaining test image information by test-photographing a treatment liquid test-printed by a head unit, (b) generating nozzle-specific characteristic information by using the test image information, (c) generating print file information to be printed, in consideration of the nozzle-specific characteristic information, (d) reflecting recipe information of a substrate or the head unit to prepare the print file information in an outputtable state, and (e) printing, on the substrate by the head unit, the print file information to which the recipe information is reflected.

公开(公告)号：US20230350438A1

公开(公告)日：2023-11-02

申请号：US17732553

申请日：2022-04-29

Applicant: SEMES Co., Ltd.

Inventor： Yong Jun Seo ,  Sang Hyun Son ,  Sang Min Ha ,  Hyeong Jun Cho ,  Dong Ok Ahn

IPC: H01L21/67 ,  G05D23/19 ,  G01K3/14

CPC classification number: G05D23/1927 ,  G01K3/14 ,  H01L21/67248 ,  H01L21/67103

Abstract: A process measurement apparatus and method capable of increasing production by decreasing an operating time are provided. The process measurement method is performed by a computing device, and includes receiving a plurality of sensed values from a plurality of sensors disposed in a wafer-type temperature sensor, generating a first temperature value of a first heating zone based on the plurality of sensed values, and determining a first compensation value based on a first difference value corresponding to a difference between the first temperature value and a target value, wherein a first compensation ratio between the first difference value and the first compensation value when the first difference value is a first value is different from a second compensation ratio between the first difference value and the first compensation value when the first difference value is a second value.

公开(公告)号：US20230338993A1

公开(公告)日：2023-10-26

申请号：US17727659

申请日：2022-04-22

Applicant: SEMES CO., LTD.

Inventor： Yoon Ki SA ,  Do Yeon KIM ,  Pil Kyun HEO

IPC: B08B3/10 ,  B08B3/02

CPC classification number: B08B3/10 ,  B08B3/02 ,  B08B2203/007

Abstract: There are provided an apparatus for heating a chemical liquid that heats a chemical liquid using a heating element with a light source as a medium, and a system for treating a substrate with the apparatus. The apparatus for heating a chemical liquid includes: a flow path provided as a path through which a chemical liquid used to treat a substrate passes; a heating element disposed to surround at least a portion of the flow path; and a light source irradiating the heating element with light, wherein the heating element is heated using photon excitation, and heats the chemical liquid.

公开(公告)号：US11798822B2

公开(公告)日：2023-10-24

申请号：US17061629

申请日：2020-10-02

Applicant: SEMES CO., LTD.

Inventor： Ye Jin Choi ,  Daehun Kim ,  Kangseop Yun

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/6715 ,  H01L21/67109

Abstract: Disclosed is a support unit for supporting a substrate. The support unit includes a support plate having an inner space defined therein, a heating member disposed in the inner space and emitting light for heating the substrate supported on the support unit, and a reflective member disposed along an edge region of the support plate and reflecting thermal energy of the light to an edge region of the substrate supported on the support unit.