公开(公告)号：US20140004650A1

公开(公告)日：2014-01-02

申请号：US14004779

申请日：2012-02-13

申请人： Takashi Iwade ,  Toyoharu Terada ,  Kazunori Nakakita

发明人： Takashi Iwade ,  Toyoharu Terada ,  Kazunori Nakakita

IPC分类号： H01L31/18 ,  B65G47/26

CPC分类号： H01L31/18 ,  B65G47/261 ,  H01L31/0488 ,  H01L31/0504 ,  H01L31/188 ,  Y02E10/50

摘要： A solar cell module manufacturing apparatus includes a stage, a holding member, a moving mechanism, and a pushing member. The stage suctions a plurality of elongated solar cells that is arranged to form a solar cell module. The holding member releasably holds a portion of a solar cell to be placed on the stage. The moving mechanism moves the holding member forward and backward with respect to the stage. The moving mechanism moves the holding member backward in a state that an end portion in a front side of the cell held by the holding member that has been moved forward is suctioned on the stage, and then the portion of the cell is released by the holding member. The pushing member moves over the cell such that the pushing member pushes a lift portion of the cell down to the stage while the holding member moves backward.

摘要翻译： 太阳能电池模块制造装置包括台架，保持构件，移动机构和推动构件。 多个细长的太阳能电池被设置成形成太阳能电池模块。 保持构件可释放地保持放置在台架上的太阳能电池的一部分。 移动机构使保持构件相对于载物台前后移动。 移动机构使保持构件向后方移动，该状态是将由前方移动的保持构件保持的单元的前侧的端部在台架上抽吸的状态，然后通过保持体释放单元的一部分 会员。 推动构件移动到电池单元上，使得当保持构件向后移动时，推动构件将电池的提升部分向下推动到舞台。

公开(公告)号：US20120103252A1

公开(公告)日：2012-05-03

申请号：US13381322

申请日：2010-06-25

申请人： Atsushi Watanabe

发明人： Atsushi Watanabe

IPC分类号： B05C13/00 ,  B05C9/12

CPC分类号： H01M4/0404 ,  B05C5/0254 ,  B05C9/04 ,  B05D2252/02 ,  B05D2252/10 ,  B65H23/022 ,  B65H23/0324 ,  B65H23/038 ,  H01M4/8828 ,  Y02E60/50

摘要： A double-sided coated substrate transport device (1) is described. A die head for front face coating (3) and a die head for back face coating (4) coat a coating liquid onto a substrate 1. A drying oven (5) dries the coating liquid applied to the substrate (1), to form coating films on the front and back faces of the substrate (1). A first and second rotating body unit (20A, 20B) are respectively furnished independently at widthwise edge sections of the substrate (1). Each of the first and second rotating body units has a free roller (21) and a drive roller (22) constituting a pair of rotating bodies, and a rotating body swivel section (23). The free roller (21) and the drive roller (22) grip the widthwise edge sections of the substrate (1) from the front and back sides. The rotating body swivel section (23) allows the orientation of the free roller (21) and the drive roller (22), respectively, to be modified separately for the first rotating body unit (20A) and the second rotating body unit (20B), so that the rotation axis of the free roller (21) and the drive roller (22) is inclined towards the downstream side in the substrate transport direction as seen from the outside in the substrate widthwise direction, with respect to a line perpendicular to the substrate transport direction.

摘要翻译： 对双面涂布基板输送装置（1）进行说明。 用于前面涂层的模头（3）和用于背面涂层的模头（4）将涂布液涂覆到基材1上。干燥箱（5）将施加到基材（1）上的涂布液干燥，形成 在基板（1）的前表面和背面上涂覆膜。 第一和第二旋转体单元（20A，20B）分别独立地设置在基板（1）的宽度方向的边缘部分。 第一和第二旋转体单元中的每一个具有构成一对旋转体的自由辊（21）和驱动辊（22），以及旋转体旋转部（23）。 自由辊（21）和驱动辊（22）从前侧和后侧夹紧基板（1）的宽度方向的边缘部分。 旋转体旋转部（23）能够分别对第一旋转体单元（20A）和第二旋转体单元（20B）分别改变自由辊（21）和驱动辊（22）的取向， 使得自由辊（21）和驱动辊（22）的旋转轴线在从基板宽度方向的外侧观察到的基板输送方向上的下游侧相对于垂直于基板横向的线倾斜 基材输送方向。

公开(公告)号：US07852489B2

公开(公告)日：2010-12-14

申请号：US12162788

申请日：2007-01-26

申请人： Masashi Sugiyama ,  Hidemitsu Ogawa ,  Katsuichi Kitagawa ,  Kazuyoshi Suzuki

发明人： Masashi Sugiyama ,  Hidemitsu Ogawa ,  Katsuichi Kitagawa ,  Kazuyoshi Suzuki

IPC分类号： G01B11/02

CPC分类号： G01B11/2441

摘要： A reference plane is arranged in a posture obliquely tilted at an optional angle relative to a traveling direction of a light-beam, so that an interference fringe is generated from the reflected light-beams which are reflected from a target plane and the reference plane and, then, return on a single optical path. An image of the interference fringe is taken by a CCD camera to acquire intensity value data of each pixel. A phase of an interference fringe waveform is obtained for each pixel by a CPU by fitting the intensity value data to a model equation expressing the interference fringe waveform, where the intensity value data contain that of each pixel and those of the pixels in the vicinity of the relevant pixel, on assumption that DC components, AC amplitudes and phases of the interference fringe waveforms are respectively constant in the vicinity of the relevant pixel. The obtained phase is converted into a height to measure a surface profile.

摘要翻译： 参考平面以相对于光束的行进方向以任意角度倾斜倾斜的姿势布置，从而从从目标平面和参考平面反射的反射光束产生干涉条纹，以及 ，然后在单个光路上返回。 通过CCD照相机拍摄干涉条纹的图像，以获取每个像素的强度值数据。 通过将强度值数据拟合到表示干涉条纹波形的模型等式，通过CPU对每个像素获得干涉条纹波形的相位，其中强度值数据包含每个像素的像素和附近的像素的强度值数据 相关像素，假设干涉条纹波形的DC分量，AC幅度和相位在相关像素附近分别恒定。 将获得的相转换成高度以测量表面轮廓。

公开(公告)号：US20100233243A1

公开(公告)日：2010-09-16

申请号：US12161503

申请日：2007-01-18

申请人： Shinya Izumida ,  Takashi Iwade

发明人： Shinya Izumida ,  Takashi Iwade

IPC分类号： A61K47/00 ,  B32B37/14

CPC分类号： A61K9/5089 ,  A61J3/077 ,  A61K9/50 ,  A61K9/7007 ,  B01J13/043

摘要： Disclosed is a laminated microcapsule sheet which is produced using a lamination apparatus B and a water repellency imparting apparatus A, wherein the lamination apparatus B is used for laminating multiple types of materials at multiple parts on an edible film to form a laminated microcapsule sheet and the water repellency imparting apparatus A is used for imparting water repellency to the surface of the edible sheet. The sheet is improved in the disadvantages attributable to the water soluble property of an edible film.

摘要翻译： 公开了使用层压装置B和拒水赋予装置A制造的层压微胶囊片，其中层压装置B用于在可食用膜上的多个部分层叠多种材料以形成层压微胶囊片，并且 防水性赋予装置A用于赋予可食用片材的表面防水性。 改善了可食用膜的水溶性的缺点。

公开(公告)号：US07753253B2

公开(公告)日：2010-07-13

申请号：US11594766

申请日：2006-11-09

申请人： Katsumi Terada ,  Takashi Takei

发明人： Katsumi Terada ,  Takashi Takei

IPC分类号： B29C31/00 ,  H01L23/29 ,  B23K1/012

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

摘要： A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

摘要翻译： 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。

公开(公告)号：US20090321895A1

公开(公告)日：2009-12-31

申请号：US12304957

申请日：2007-05-30

申请人： Masamichi Yamashita ,  Takashi Iwade ,  Kohshi Taguchi ,  Mitsuo Yamazaki

发明人： Masamichi Yamashita ,  Takashi Iwade ,  Kohshi Taguchi ,  Mitsuo Yamazaki

IPC分类号： H01L21/31 ,  H01L29/06

CPC分类号： C23C16/30 ,  C23C16/401 ,  H01L51/5256

摘要： Issue Providing a silicon film which can prevent damage of electronic devices formed on a substrate from occurrence, can prevent apparatus arrangement from becoming large-scale one, can improve coherency of a silicon thin film to a substrate, and is hardly happened crack and/or flaking, and providing a method for forming the silicon thin film.Solving Means A method for forming a silicon thin film according to the present invention is a method for forming a silicon thin film having isolation function or barrier function, on a substrate K using CVD method, and comprises a step for forming a first thin film on the substrate using plasma CVD method employing gas containing hydrogen element and a gas containing silicon element; a step for forming a second thin film using plasma CVD method employing a gas containing nitrogen element and a gas containing silicon element; and a step for forming a third thin film using plasma CVD method employing a gas containing oxygen element and a gas containing silicon element.

摘要翻译： 问题提供能够防止在基板上形成的电子器件的损坏的硅膜可以防止装置排列变大，可以提高硅薄膜与基板的一致性，并且几乎不发生裂纹和/或 剥离，提供形成硅薄膜的方法。 解决方法根据本发明的形成硅薄膜的方法是使用CVD法在基板K上形成具有隔离功能或阻挡功能的硅薄膜的方法，并且包括用于形成第一薄膜的步骤 使用等离子体CVD法的基板，其使用含有氢元素的气体和含有硅元素的气体; 使用含有氮元素的气体和含有硅元素的气体的等离子体CVD法形成第二薄膜的工序; 以及使用含有氧元素的气体和含有硅元素的气体的等离子体CVD法形成第三薄膜的工序。

公开(公告)号：US20090071703A1

公开(公告)日：2009-03-19

申请号：US11910981

申请日：2006-04-04

申请人： Makoto Imahori ,  Takashi Nakaya ,  Masanori Akita ,  Kousei Nogami ,  Teruo Tagai

发明人： Makoto Imahori ,  Takashi Nakaya ,  Masanori Akita ,  Kousei Nogami ,  Teruo Tagai

IPC分类号： H05K1/11 ,  H05K1/00 ,  B29C65/00 ,  B29C65/02

CPC分类号： H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/2929 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K1/095 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0145 ,  H05K2201/0245 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K2203/1453 ,  H01L2224/2919 ,  H01L2924/00014

摘要： The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 μm or more and 10 μm or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1′) is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C. smaller than that of the resin constituting the conductive paste may be provided.

摘要翻译： 本发明提供一种适于形成和保护电路，电极等的导电膏，并且能够在短时间内连接多个电路板的电极，电路板，耐湿性优异的电路构件 耐热性等，以及电路用品的制造方法。 本发明的导电性糊剂包括鳞片状的平均粒径为1μm以上且10μm以下的导电性材料，并且为选自Ag，Ag合金，Ag涂层 材料和Ag合金涂覆材料，以及在25℃下的储能模量为100MPa以上的树脂。 本电路板（1'）设有基板（11）和使用上述导电浆料形成在基板（11）的至少一侧上的电极（12）。 在电极（12）的表面上，可以设置由比构成导电性浆料的树脂小25℃的储能模量的组合物构成的粘合绝缘区域。

公开(公告)号：US07279358B2

公开(公告)日：2007-10-09

申请号：US10511986

申请日：2003-04-22

申请人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

发明人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L21/67092 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.

摘要翻译： 安装方法包括以下步骤：在定位被相对于彼此粘合的物体之后，移动位于其周围的可动壁直到与一个物体保持装置接触以形成具有局部封闭空间的局部室， 室，减小了室中的压力，使物体保持装置沿着减小室的体积的方向移动，并且随着物体保持装置的移动而移动可移动壁，并且通过按压将两个物体彼此粘合。 由于接合部分和接合部分附近可以局部地且有效地从周围环绕，所以局部室也可以在接合时保持封闭状态的同时通过接合操作改变封闭空间的形状。

公开(公告)号：US20060219166A1

公开(公告)日：2006-10-05

申请号：US11387865

申请日：2006-03-24

申请人： Junichi Uehara ,  Takashi Iwade

发明人： Junichi Uehara ,  Takashi Iwade

IPC分类号： B05B13/02

CPC分类号： B05C11/10 ,  B05C5/0254 ,  G03F7/16

摘要： An applicator device comprises a reservoir tank trapping embrocation, a stage holding a substrate, a ferrule having a slit-shaped opening section above the stage, a fluid transfer pump guiding the embrocation within the reservoir tank to the ferrule, a first opening and closing valve between a suction opening of the fluid transfer pump and the reservoir tank, opening when a suction operation is carried out and closing when a discharge operation is carried out, a second opening and closing valve between a discharge opening of the fluid transfer pump and the ferrule, opening when a discharge operation is carried out and closing when a suction operation is carried out, and driving means relatively moving the ferrule and/or substrate when the slit-shaped opening section and the substrate are adjacent to one another, wherein the fluid transfer pump comprises a membranous sealing member sealing a gap between a cylinder and a plunger.

公开(公告)号：US06993832B2

公开(公告)日：2006-02-07

申请号：US10469299

申请日：2002-02-28

申请人： Akira Yamauchi

发明人： Akira Yamauchi

IPC分类号： B23P19/00

CPC分类号： H01L21/67259 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/681 ,  H01L24/81 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/5136 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/0401

摘要： A chip mounting device of the present invention includes: an adhesive application unit 11; a temporary crimp unit 12; and a main crimp unit 13. In the unit 11, a camera 21 is used for detecting base material marks for each section region on a film base material 1 and substrate marks for each substrate pattern in the section region. The detected results are transferred to the unit 12. In the unit 12, a camera 45 is used for detecting base material marks, and the position of each substrate pattern is recognized on the basis of on the detection results and the positional data of each substrate pattern transmitted from the unit 11, thereby crimping chips temporarily. This enables the chips to be mounted with high precision even when the film base material 1 is expanded and contracted. In the unit 12, there is no detection of substrate marks, which minimizes a decrease in processing efficiency.

摘要翻译： 本发明的芯片安装装置包括：粘合剂施加单元11; 临时压接单元12; 和主压接单元13。 在单元11中，相机21用于检测薄膜基材1上的每个区域的基材标记以及在区域中的每个基板图案的基板标记。 检测到的结果被传送到单元12。 在单元12中，使用照相机45来检测基材标记，并且基于从单元11发送的每个基板图案的检测结果和位置数据来识别每个基板图案的位置，由此压接芯片 暂时。 这使得即使当胶片基材1膨胀和收缩时，也能高精度地安装芯片。 在单元12中，没有检测到衬底标记，这使得处理效率的降低最小化。