公开(公告)号：US08110931B2

公开(公告)日：2012-02-07

申请号：US12501246

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05672 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48623 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48649 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48672 ,  H01L2224/48809 ,  H01L2224/48818 ,  H01L2224/48823 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48849 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48872 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2224/8581 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48869 ,  H01L2924/00012

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract translation: 晶片限定以阵列方式布置的多个芯片。 每个芯片包括至少一个铝焊盘和中间材料。 中间材料覆盖铝垫，并安装在铝垫上。

公开(公告)号：US07709913B2

公开(公告)日：2010-05-04

申请号：US12038914

申请日：2008-02-28

Applicant: Jian Cheng Chen

Inventor： Jian Cheng Chen

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L27/14618 ,  G02B7/02 ,  H01L27/14625 ,  H01L2224/45144 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor package includes a substrate, a sensor chip, a frame, a lens element and at least a pair of guide pins. The sensor chip is mounted on the substrate, and has two opposite sides and a sensing region, which has a sensing region central axis. The frame is mounted on the substrate, and has an aperture and an inner space with the sensor chip disposed therein. The lens element is disposed inside the aperture and has a lens central axis. The guide pins locate oppositely inside the inner space of the frame with an interval between the tips of the guide pins substantially identical to the distance between the opposite sides of the sensor chip, wherein the central line of the interval between the tips of the guide pins defines a positioning line, which substantially coincides with the lens central axis; wherein the tip of each guide pin is aligned with one of the opposite sides of the sensor chip such that the positioning line is substantially coincided with the sensing region central axis.

Abstract translation: 图像传感器封装包括基板，传感器芯片，框架，透镜元件和至少一对引导销。 传感器芯片安装在基板上，并且具有两个相对的侧面和一个具有感测区域中心轴的感测区域。 框架安装在基板上，并且具有孔和内部空间，传感器芯片设置在其中。 透镜元件设置在孔内并具有透镜中心轴线。 引导销相对地位于框架的内部空间内，引导销的顶端之间的间隔基本上与传感器芯片的相对侧之间的距离相同，其中导向销的尖端之间的间隔的中心线 限定了基本上与透镜中心轴线重合的定位线; 其中每个引导销的尖端与传感器芯片的相对侧中的一个对准，使得定位线基本上与感测区域中心轴线重合。

公开(公告)号：US20100007011A1

公开(公告)日：2010-01-14

申请号：US12501693

申请日：2009-07-13

Applicant: Chang Ying HUNG ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

Inventor： Chang Ying HUNG ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

IPC: H01L23/488 ,  H01L21/56 ,  H01L21/60

CPC classification number: H01L24/85 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.

Abstract translation: 引线键合结构包括芯片和接合线。 芯片包括基材，至少一个第一金属垫，再分布层和至少一个第二金属垫。 第一金属垫设置在基材上。 再分布层具有第一端和第二端，并且第一端电连接到第一金属垫。 第二金属垫电连接到再分配层的第二端。 接合线接合到第二金属垫。

公开(公告)号：US20090065953A1

公开(公告)日：2009-03-12

申请号：US12230829

申请日：2008-09-05

Applicant: Jian-Cheng Chen

Inventor： Jian-Cheng Chen

IPC: H01L23/16 ,  H01L21/58

CPC classification number: H01L23/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.

Abstract translation: 提供了芯片模块及其制造方法。 首先，提供基板。 接下来，将芯片组装在基板上并与基板电连接。 之后，以围绕芯片的方式将多个无源单元组装在基板上。 然后，在被动单元之间填充第一胶结构，使得由第一胶结构和被动单元限定环绕的区域。 然后，在包围的区域填充第二胶结构，使得芯片被第二胶结构覆盖。

公开(公告)号：US20070030647A1

公开(公告)日：2007-02-08

申请号：US11197372

申请日：2005-08-05

Applicant: Jian-Cheng Chen ,  Chun-Chang Shih

Inventor： Jian-Cheng Chen ,  Chun-Chang Shih

IPC: G06F1/20 ,  F16H59/00

CPC classification number: G06F1/18 ,  B60R11/0235 ,  B60R2011/0082 ,  B60R2011/0085 ,  B60R2011/0092 ,  F16H1/16 ,  F16H35/10 ,  G11B17/051 ,  G11B33/027 ,  G11B33/10 ,  Y10T74/19251

Abstract: An automatic monitor sliding system comprises a machine case, a slidable structure, a monitor mounting plate, and a monitor structure. The slidable structure is mounted inside a reception chamber of the machine case. The monitor mounting plate is mounted in front of the machine case. The monitor structure is mounted in front of the monitor mounting plate. As a result, the slidable structure slides the monitor structure forward to slant the monitor structure downward for facilitating the user to insert and retrieve the audio-visual disk. Consequently, the automatic monitor sliding system provides the functions of protecting machine, preventing dust, water permeation, and mistouch input, and providing high sliding radian.

Abstract translation: 一种自动监视器滑动系统，包括机壳，可滑动结构，监视器安装板和监视器结构。 可滑动结构安装在机壳的接收室内。 显示器安装板安装在机箱的前面。 显示器结构安装在显示器安装板的前面。 结果，可滑动结构向前滑动监视器结构以向下倾斜监视器结构，以便于用户插入和取回视听盘。 因此，自动监视器滑动系统提供保护机器的功能，防止灰尘，水渗透和误触输入，并提供高滑动弧度。