MOISTURE CURABLE COMPOSITIONS
    50.
    发明申请
    MOISTURE CURABLE COMPOSITIONS 审中-公开
    水分可固化组合物

    公开(公告)号:US20160369061A1

    公开(公告)日:2016-12-22

    申请号:US14902219

    申请日:2014-07-02

    Inventor: Sumi DINKAR

    Abstract: The present invention provides curable compositions comprising non-tin metal accelerators that accelerate the condensation curing of moisture-curable silicones/non-silicones. In particular, the present invention provides an accelerator comprising amide compounds that are particularly suitable as replacements for organotin in sealant and RTV formulations. Further, the compositions employing an amide compound is comparable or superior to organotin such as DBTDL, exhibits certain behavior in the presence of components that allow for tuning or adjusting the cure characteristics of the compositions, and provides good adhesion and storage stability.

    Abstract translation: 本发明提供包含非锡金属促进剂的可固化组合物,其加速湿固化性硅氧烷/非硅氧烷的缩合固化。 特别地,本发明提供了一种加速剂,其包含特别适合作为密封剂和RTV制剂中有机锡替代物的酰胺化合物。 此外,使用酰胺化合物的组合物相当于或优于有机锡如DBTDL,在存在能够调节或调节组合物的固化特性的组分的存在下表现出某些行为,并提供良好的粘附性和储存稳定性。

Patent Agency Ranking