公开(公告)号：US20160190109A1

公开(公告)日：2016-06-30

申请号：US14983510

申请日：2015-12-29

Applicant: Dae-Ho Lee ,  Hyo-Soon Kang ,  Seok-Hong Kwon ,  Tae-Young Yoon ,  Hee-Jin Lee

Inventor： Dae-Ho Lee ,  Hyo-Soon Kang ,  Seok-Hong Kwon ,  Tae-Young Yoon ,  Hee-Jin Lee

IPC: H01L25/16 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/162 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract translation: 堆叠半导体封装包括具有第一封装衬底和安装在第一封装衬底上的第一半导体芯片的第一半导体封装。 第一半导体芯片包括沿其侧部布置的第一芯片焊盘。 堆叠半导体封装包括设置在第一半导体封装上的第二半导体封装，并且包括第二封装衬底。 第一子芯片和第二子芯片安装在第二半导体封装上并且沿着第二封装衬底的第一侧部分的方向并排布置。 第一和第二子芯片中的每一个包括沿着其侧部布置的第二芯片焊盘。 可以减少和简化接口部分和连接焊盘之间的连接布线路径，从而防止连接线缠结。 此外，逻辑芯片和存储芯片之间的连接布线路径可以最小化，从而提供高速性能。

公开(公告)号：US09190339B2

公开(公告)日：2015-11-17

申请号：US14170653

申请日：2014-02-03

Applicant: Soon Kang Chan ,  Voon Kwai Leong ,  Wai Keong Wong

Inventor： Soon Kang Chan ,  Voon Kwai Leong ,  Wai Keong Wong

IPC: H01L21/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/04 ,  B81C1/00 ,  B81B7/00 ,  G01L9/00

CPC classification number: H01L23/3107 ,  B81B7/0038 ,  B81B2201/0264 ,  B81C1/00285 ,  B81C1/00333 ,  G01L9/0098 ,  G01L19/0092 ,  G01L19/147 ,  H01L21/54 ,  H01L21/56 ,  H01L23/04 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array.

Abstract translation: 一种在组装预分解封装半导体器件的阵列期间施加压敏凝胶材料的方法。 在该方法中，将压敏凝胶材料分配到阵列的第一半导体器件上，其中第一半导体器件设置在第一腔内。 执行第一固化过程以部分固化第一腔中的压敏凝胶材料。 然后将压敏凝胶材料分配到阵列的另一半导体器件上，其中另一个半导体器件设置在另一个空腔内。 首先固化过程是在完成另一个空腔内的压敏凝胶材料的分配完成之前开始的，并且最初固化压敏凝胶材料用于少于阵列的所有预分解封装的半导体器件。

公开(公告)号：US09093652B2

公开(公告)日：2015-07-28

申请号：US13525766

申请日：2012-06-18

Applicant: Sung-Hyun Jung ,  Myeong-Soon Kang ,  Ho-Kuk Jung ,  Nam-Soo Kim ,  Nam-Heon Lee ,  Eui-Su Kang ,  Dong-Min Kang ,  Mi-Young Chae

Inventor： Sung-Hyun Jung ,  Myeong-Soon Kang ,  Ho-Kuk Jung ,  Nam-Soo Kim ,  Nam-Heon Lee ,  Eui-Su Kang ,  Dong-Min Kang ,  Mi-Young Chae

IPC: C07D401/10 ,  H01L51/46 ,  H01L51/54 ,  C07D403/10 ,  H01L51/00 ,  C09K11/06 ,  H05B33/10 ,  C09B57/00

CPC classification number: H01L51/0067 ,  C09B57/00 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/1044 ,  C09K2211/1059 ,  H05B33/10 ,  Y02E10/549

Abstract: A compound for an organic photoelectric device, the compound being represented by Chemical Formula 1 or 2:

Abstract translation: 化合物由化学式1或2表示的有机光电器件用化合物：

公开(公告)号：US09092881B2

公开(公告)日：2015-07-28

申请号：US12476516

申请日：2009-06-02

Applicant: Boo Dong Kwak ,  Bong Soon Kang ,  Hyun Soo Kim ,  Won Woo Jang ,  Kyung Rin Kim ,  Won Tae Choi ,  Joo Young Ha

Inventor： Boo Dong Kwak ,  Bong Soon Kang ,  Hyun Soo Kim ,  Won Woo Jang ,  Kyung Rin Kim ,  Won Tae Choi ,  Joo Young Ha

IPC: G06T3/40 ,  G06T7/00 ,  H04N9/04

CPC classification number: G06T3/4015 ,  G06T3/403 ,  G06T2207/10024 ,  G06T2207/20012 ,  G06T2207/20192 ,  H04N9/045 ,  H04N2209/046

Abstract: A color interpolation apparatus includes a threshold value determining unit that calculates a luminance value of each area set based on each pixel of a Bayer pattern image and determines edge determining threshold values, an edge information calculating unit that calculates pixel value variations in multiple directions of the set areas by using pixel values of pixels included in each area and edge information regarding each area by using the multiple directional pixel value variations, an area determining unit that determines an edge type by using the edge determining threshold values and the edge information, and a color interpolation unit that applies a color interpolation filter previously set according to the edge type to a corresponding area according to the edge type. The area determining unit uses green information or interpolated green information of a central pixel depending on whether or not a color of the central pixel is green.

Abstract translation: 颜色插值装置包括阈值确定单元，该阈值确定单元基于拜耳图案图像的每个像素计算每个区域的亮度值并确定边缘确定阈值;边缘信息计算单元，其计算多个方向的像素值变化 通过使用包括在每个区域中的像素的像素值和通过使用多方向像素值变化的关于每个区域的边缘信息来设置区域;区域确定单元，通过使用边缘确定阈值和边缘信息来确定边缘类型，以及 颜色插值单元，其根据边缘类型将根据边缘类型预先设置的颜色插值滤波器应用于相应区域。 区域确定单元使用绿色信息或中心像素的内插绿色信息，这取决于中心像素的颜色是否为绿色。

公开(公告)号：US20150137278A1

公开(公告)日：2015-05-21

申请号：US14086919

申请日：2013-11-21

Applicant: Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

Inventor： Stanley Job Doraisamy ,  Soon Kang Chan ,  Soo Choong Chee

IPC: H01L23/31 ,  H01L29/84 ,  H01L21/56

CPC classification number: H01L29/84 ,  H01L21/50 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.

Abstract translation: 使用改变设置在包装中的空腔中的凝胶材料的形状的夹具来组装半导体器件封装。 在一个实施例中，将具有凹底表面的夹具插入到设置在包装壳体中的空腔内的未固化的凝胶材料上，以将凝胶的顶表面从凹形变为凸形。 然后将凝胶用夹具固化就位。 当夹具随后被去除时，固化的凝胶保持凸形，这有助于避免任何接合线暴露。 重新形成的凝胶材料在热循环期间降低内部应力，因此可以减少由于这种热循环导致的对包装的永久性损坏。

公开(公告)号：US20140319701A1

公开(公告)日：2014-10-30

申请号：US14132516

申请日：2013-12-18

Applicant: Yong-hoon Kim ,  Hyo-soon Kang ,  Hee-seok Lee ,  Jang-ho Cho

Inventor： Yong-hoon Kim ,  Hyo-soon Kang ,  Hee-seok Lee ,  Jang-ho Cho

IPC: H01L25/18 ,  H01L23/50

CPC classification number: H01L25/18 ,  G11C5/025 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

Abstract translation: 一种半导体芯片，包括衬底，布置在衬底上的第一数据焊盘和布置在衬底上的第一控制/寻址焊盘，其中第一数据焊盘布置在衬底的边缘区域中，并且第一控制/地址焊盘 布置在基板的中心区域中。

公开(公告)号：US08796917B2

公开(公告)日：2014-08-05

申请号：US13552731

申请日：2012-07-19

Applicant: Dong-Min Kang ,  Myeong-Soon Kang ,  Nam-Soo Kim ,  Chang-Ju Shin ,  Nam-Heon Lee ,  Ho-Kuk Jung ,  Mi-Young Chae

Inventor： Dong-Min Kang ,  Myeong-Soon Kang ,  Nam-Soo Kim ,  Chang-Ju Shin ,  Nam-Heon Lee ,  Ho-Kuk Jung ,  Mi-Young Chae

IPC: C07D401/10 ,  C07D413/10 ,  H05B33/14

CPC classification number: C09K11/06 ,  C09B57/00 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1044 ,  C09K2211/1059 ,  H01L51/0072 ,  H01L51/5012 ,  H01L51/5072 ,  Y02E10/549

Abstract: A compound for an organic optoelectronic device, an organic light emitting diode, and a display device, the compound being represented by the following Chemical Formula 1:

Abstract translation: 用于有机光电子器件的化合物，有机发光二极管和显示器件，该化合物由以下化学式1表示：

公开(公告)号：US08732832B2

公开(公告)日：2014-05-20

申请号：US13310215

申请日：2011-12-02

Applicant: Hak Suh Kim ,  Kyoung Soon Kang ,  Gang Uk Hwang ,  Hyeon Je Cho ,  Myung Woo Lee

Inventor： Hak Suh Kim ,  Kyoung Soon Kang ,  Gang Uk Hwang ,  Hyeon Je Cho ,  Myung Woo Lee

IPC: H04L29/06 ,  G06F15/16

CPC classification number: H04L63/1458 ,  G06F21/554 ,  H04L63/1416

Abstract: Routing apparatus and method for detecting a server attack are disclosed. The routing apparatus includes: a reception unit configured to receive a packet transmitted in a network; a transmission unit configured to transmit the packet along a transmission path; a memory unit configured to store data and/or information required for an operation; and a controller configured to set the transmission path of the packet in the network and perform packet switching along the set transmission path, wherein the reception unit receives server state information from servers at every certain time, the memory unit stores the received server state information, and the controller calculates a change in the state of the servers based on the received server state information, and determines that a server is attacked when a change in the state of the server is greater than a certain threshold value.

Abstract translation: 公开了用于检测服务器攻击的路由设备和方法。 路由装置包括：接收单元，被配置为接收在网络中发送的分组; 发送单元，被配置为沿着发送路径发送所述分组; 存储单元，被配置为存储操作所需的数据和/或信息; 以及控制器，被配置为设置网络中的分组的传输路径并且沿着设置的传输路径执行分组交换，其中接收单元在每个特定时间从服务器接收服务器状态信息，存储单元存储所接收的服务器状态信息， 并且控制器基于接收到的服务器状态信息来计算服务器的状态的变化，并且当服务器的状态的改变大于某个阈值时，确定服务器被攻击。

公开(公告)号：US08606034B2

公开(公告)日：2013-12-10

申请号：US13092438

申请日：2011-04-22

Applicant: Joo Young Ha ,  Won Tae Choi ,  Bong Soon Kang ,  Byung Hyun Kim ,  Joo Hyun Kim ,  Sun Mi Sin ,  Won Woo Jang ,  Hak Yong Han ,  Gi Dong Lee

Inventor： Joo Young Ha ,  Won Tae Choi ,  Bong Soon Kang ,  Byung Hyun Kim ,  Joo Hyun Kim ,  Sun Mi Sin ,  Won Woo Jang ,  Hak Yong Han ,  Gi Dong Lee

IPC: G06K9/40

CPC classification number: G06T5/003 ,  G06T7/13 ,  G06T2207/20192

Abstract: There is provided an apparatus for improving the sharpness of an image, which may prevent occurrence of distortion of an image in an edge enhancement process of the image by applying an active weight in accordance with a two-dimensional (2D) high pass filtering value of the image. The apparatus may include: a 2D high pass filter outputting a high frequency element value for the luminance values of pixels of an input image; a weight generating unit generating a weight changed depending on a magnitude of the high frequency element value; a weight applying unit applying the weight to the high frequency element value; and an edge enhancement image generating unit adding, to the luminance values of the pixels of the input image, the high frequency element value to which the weight is applied to thereby output an image of which an edge is enhanced.

Abstract translation: 提供了一种用于提高图像的清晰度的装置，其可以通过根据二维（2D）高通滤波值施加有效权重来防止图像的边缘增强处理中的图像失真的发生 图片。 所述装置可以包括：输出用于输入图像的像素的亮度值的高频元素值的2D高通滤波器; 权重生成单元，生成根据高频元素值的大小而变化的权重; 加权单元，将所述权重应用于所述高频元素值; 以及边缘增强图像生成单元，对输入图像的像素的亮度值加上加权的高频单元值，从而输出边缘增强的图像。

公开(公告)号：US08599690B2

公开(公告)日：2013-12-03

申请号：US12911972

申请日：2010-10-26

Applicant: Kyoung-Soon Kang ,  Hak Suh Kim ,  Hyunjoo Kang ,  Boo Geum Jung ,  Ki Cheol Jeon ,  Byungjun Ahn

Inventor： Kyoung-Soon Kang ,  Hak Suh Kim ,  Hyunjoo Kang ,  Boo Geum Jung ,  Ki Cheol Jeon ,  Byungjun Ahn

IPC: H04L12/26

CPC classification number: H04L47/20 ,  H04L41/5009 ,  H04L43/026 ,  H04L43/16 ,  H04L47/17 ,  Y02D50/30

Abstract: A method and an apparatus for fairly allocating resources to network users are provided. The method for fair resource allocation to network users allows the resource allocation apparatus to collect flow information between a user terminal and a service server and aggregates the flow information based on at least one of a user terminal address, a service server address, a user terminal, a service server address, and a service. The allocation resource of the user is controlled to the predetermined recommended bandwidth by using the ratio of the aggregated flow information.

Abstract translation: 提供了一种用于向网络用户公平分配资源的方法和装置。 用于公平资源分配给网络用户的方法允许资源分配装置在用户终端和服务服务器之间收集流信息，并基于用户终端地址，服务服务器地址，用户终端中的至少一个来聚合流信息 ，服务服务器地址和服务。 通过使用聚合流信息的比例将用户的分配资源控制到预定的推荐带宽。