公开(公告)号：US08030762B2

公开(公告)日：2011-10-04

申请号：US11730966

申请日：2007-04-05

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L23/34 ,  H01L33/00

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Abstract translation: 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

公开(公告)号：US07998879B2

公开(公告)日：2011-08-16

申请号：US11723236

申请日：2007-03-19

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L21/31

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract translation: 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US20110083885A1

公开(公告)日：2011-04-14

申请号：US12630478

申请日：2009-12-03

Applicant: Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

Inventor： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/38 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C25D5/10 ,  H01L23/142 ,  H01L23/498 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/053 ,  H05K3/24 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/09436 ,  H05K2203/072 ,  H01L2924/00

Abstract: Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.

Abstract translation: 这里公开了一种金属布线结构，包括：形成在绝缘层上的无电镀镍层; 以及形成在无电镀镍层上的表面处理层及其制造方法。 金属布线结构具有优异的粘附性，而不考虑基板的种类并且可以容易地制造。

公开(公告)号：US20100279803A1

公开(公告)日：2010-11-04

申请号：US12770266

申请日：2010-04-29

Applicant: Young Ki LEE

Inventor： Young Ki LEE

IPC: F42B6/08 ,  F42B6/06

CPC classification number: F42B6/06 ,  F42B6/08

Abstract: Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.

Abstract translation: 这里公开了一种狩猎的箭头。 箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。 多个羽毛被定位成与箭头轴的nock相邻。 连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。 箭头以与连接螺纹部分相对的方式连接到连接器。 穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。 弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。

公开(公告)号：US07566912B2

公开(公告)日：2009-07-28

申请号：US11717154

申请日：2007-03-13

Applicant: Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

Abstract: A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

Abstract translation: 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。

公开(公告)号：US20090039005A1

公开(公告)日：2009-02-12

申请号：US11906754

申请日：2007-10-03

Applicant: Jong-Won Park ,  Young-Ki Lee

Inventor： Jong-Won Park ,  Young-Ki Lee

IPC: C02F9/00

CPC classification number: C02F1/5236 ,  C02F1/001 ,  C02F1/76 ,  C02F2201/008

Abstract: There is provide a portable apparatus for purifying waste water, which comprises: a first filter for primarily filtering contaminated water, a tank for sterilizing the contaminated water flowing through the first filter and for generating a precipitate by cohering impurities contained in the contaminated water by use of a composite precipitator including a plurality of elements, and a second filter for secondarily filtering the contaminated water flowing from the tank, to extract drinking water, wherein the tank uses a pump to repeatedly circulate the contaminated water through the first filter and the tank and to agitate the contaminated water with the composite precipitator being put into the tank at a predetermined time, and the tank includes a first jet pipe and a second jet pipe which form a number of spray nozzles to protrude from their outer surfaces in different orientation to form a vortex in the tank, and wherein only the single pump is used for all of the inflow and sterilization of the contaminated water and the circulation and agitation upon the precipitation and the extraction of the drinking water, thereby providing a simple structure that one tank solves a multi-step process, making it easy to move and install the apparatus, and reducing the manufacturing costs thereof.

Abstract translation: 提供了一种用于净化废水的便携式设备，其包括：用于主要过滤污染水的第一过滤器，用于对流过第一过滤器的污染水进行灭菌并通过使用污染水中包含的杂质结合产生沉淀物的罐 包括多个元件的复合除尘器和用于二次过滤从罐流出的污染水的第二过滤器，以提取饮用水，其中所述罐使用泵将污染水反复循环通过所述第一过滤器和所述罐，以及 以预定时间将复合除尘器放入容器中搅拌污染的水，并且罐包括第一喷射管和第二喷射管，其形成多个喷嘴以从其外表面以不同的方向突出以形成 罐中的涡流，其中只有单个泵用于所有的流入和灭菌 受污染的水和饮用水的沉淀和提取后的循环和搅动，从而提供一个罐体解决多步骤过程的简单结构，使其易于移动和安装设备，并减少制造 费用。

公开(公告)号：US20070235743A1

公开(公告)日：2007-10-11

申请号：US11730966

申请日：2007-04-05

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L33/00

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Abstract translation: 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

公开(公告)号：US07268014B2

公开(公告)日：2007-09-11

申请号：US11314003

申请日：2005-12-22

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

IPC: H01L21/00

CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2933/0075 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

Abstract translation: 本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。 在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。 然后，将发光装置安装在凹部的底部。 优选地，封装衬底是由Al或Al基金属制成的金属衬底。

公开(公告)号：US06488730B2

公开(公告)日：2002-12-03

申请号：US09850209

申请日：2001-05-07

Applicant: Kil Sung Lee ,  Jae Seok Lee ,  Seok Jin Kim ,  Young Ki Lee ,  Tu Won Chang

Inventor： Kil Sung Lee ,  Jae Seok Lee ,  Seok Jin Kim ,  Young Ki Lee ,  Tu Won Chang

IPC: B24D300

CPC classification number: H01L21/31053

Abstract: The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine. This polishing composition can be used in a chemical mechanical polishing of thin films in integrated circuit manufacturing and has an effect of minimizing the occurrence of microscratches on the thin film after polishing. Thereby it can be applied to the manufacturing process of highly integrated circuits such as Shallow Trench Isolation.

Abstract translation: 本发明涉及一种抛光组合物，其包含30-99重量％的去离子水，0.1-50重量％的金属氧化物粉末和0.01-20重量％的环胺。 该抛光组合物可用于集成电路制造中的薄膜的化学机械抛光，并且具有最小化抛光后薄膜上的微细纹差的发生的效果。 因此，它可以应用于诸如浅沟槽隔离的高度集成电路的制造过程。

公开(公告)号：USD852499S1

公开(公告)日：2019-07-02

申请号：US29582757

申请日：2016-10-31

Applicant: Young Ki Lee

Designer： Young Ki Lee