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    PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    用于塑料元件的包装基材及其制造方法

    公开(公告)号：US20120225508A1

    公开(公告)日：2012-09-06

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/48

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    Heat-dissipating substrate and fabricating method thereof
    3.
    发明授权
    Heat-dissipating substrate and fabricating method thereof 有权
    散热基板及其制造方法

    公开(公告)号：US08686295B2

    公开(公告)日：2014-04-01

    申请号：US12614407

    申请日：2009-11-07

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

    IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

    CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

    摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

    Method of manufacturing package substrate for optical element
    4.
    发明授权
    Method of manufacturing package substrate for optical element 有权
    制造光学元件封装基板的方法

    公开(公告)号：US08603842B2

    公开(公告)日：2013-12-10

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/62

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于光学元件的封装基板及其制造方法

    公开(公告)号：US20110140144A1

    公开(公告)日：2011-06-16

    申请号：US12721539

    申请日：2010-03-10

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/00 ,  H01L31/00

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    Method forming a semiconductor light emitting device with perforations formed within
    10.
    发明授权
    Method forming a semiconductor light emitting device with perforations formed within 有权
    形成其中形成有穿孔的半导体发光器件的方法

    公开(公告)号：US08476090B2

    公开(公告)日：2013-07-02

    申请号：US12952760

    申请日：2010-11-23

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L33/52 ,  H05K3/10

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

    摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。