公开(公告)号：US20110083885A1

公开(公告)日：2011-04-14

申请号：US12630478

申请日：2009-12-03

申请人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/09 ,  B05D5/12

CPC分类号： H05K3/38 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/32 ,  C25D5/10 ,  H01L23/142 ,  H01L23/498 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/053 ,  H05K3/24 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/09436 ,  H05K2203/072 ,  H01L2924/00

摘要： Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.

摘要翻译： 这里公开了一种金属布线结构，包括：形成在绝缘层上的无电镀镍层; 以及形成在无电镀镍层上的表面处理层及其制造方法。 金属布线结构具有优异的粘附性，而不考虑基板的种类并且可以容易地制造。

公开(公告)号：US20110031608A1

公开(公告)日：2011-02-10

申请号：US12562829

申请日：2009-09-18

申请人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/24 ,  H01L23/04 ,  H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided.

摘要翻译： 公开了一种功率器件封装，其具有高散热性能，并且包括阳极氧化金属基板，其包括金属板，金属板的一个表面上形成有空腔，阳极氧化层形成在金属板的表面和金属板的内壁上 空腔和形成在金属板上的电路层，安装在金属板的空腔中以连接到电路层的功率器件，以及填充在金属板的空腔中的树脂密封材料。 还提供了制造功率器件封装的方法。

公开(公告)号：US20110067902A1

公开(公告)日：2011-03-24

申请号：US12614405

申请日：2009-11-07

申请人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

发明人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

IPC分类号： H05K1/00 ,  H05K7/20

CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。

公开(公告)号：US20120273558A1

公开(公告)日：2012-11-01

申请号：US13540504

申请日：2012-07-02

申请人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

发明人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

IPC分类号： B23K1/20

CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。

公开(公告)号：US20120106109A1

公开(公告)日：2012-05-03

申请号：US13007485

申请日：2011-01-14

申请人： Tae Hyun KIM ,  Yong Hui Joo ,  Seog Moon CHOI

发明人： Tae Hyun KIM ,  Yong Hui Joo ,  Seog Moon CHOI

IPC分类号： H05K7/02 ,  B23K31/02 ,  B23K1/20

CPC分类号： H01L24/83 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29366 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012 ,  H01L2224/37099

摘要： Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.

摘要翻译： 这里公开了使用烧结管芯附着的功率模块及其制造方法。 功率模块包括：具有形成在金属板的表面上的绝缘层的基板; 形成在所述基板上并且包括布线图案和电极图案的电路层; 安装在所述布线图案上的装置; 在所述布线图案和所述器件之间施加金属膏的烧结片附着层，烧结所述金属膏以将所述布线图案与所述器件接合; 以及将该器件电连接到电极图案的引线框架，由此使得可以简化和便利工艺，提高电效率和改善辐射特性，并制造牢固可靠的电源模块。

公开(公告)号：US20120015484A1

公开(公告)日：2012-01-19

申请号：US13246615

申请日：2011-09-27

申请人： Shan GAO ,  Seog Moon CHOI ,  Tae Hyun KIM ,  Ju Pyo HONG ,  Bum Sik JANG ,  Ji Hyun PARK

发明人： Shan GAO ,  Seog Moon CHOI ,  Tae Hyun KIM ,  Ju Pyo HONG ,  Bum Sik JANG ,  Ji Hyun PARK

IPC分类号： H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20120122278A1

公开(公告)日：2012-05-17

申请号：US13007530

申请日：2011-01-14

申请人： Kwan Ho LEE ,  Yong Hui Joo ,  Tae Hyun KIM ,  Seog Moon CHOI

发明人： Kwan Ho LEE ,  Yong Hui Joo ,  Tae Hyun KIM ,  Seog Moon CHOI

IPC分类号： H01L21/98

CPC分类号： H01L24/83 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/82801 ,  H01L2224/83192 ,  H01L2224/83238 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/3494 ,  H05K2201/09681 ,  H05K2203/1115 ,  H05K2203/1121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012

摘要： Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate.

摘要翻译： 本发明公开了一种制造半导体封装板的方法，包括：提供包括形成在其一侧上的连接部分的基板，所述连接部分设置有焊料层; 在焊料层上配置配有电流布线的导电发热体; 向当前布线施加电流，从而加热焊料层以将半导体芯片附接到连接部分; 并从导电热发生器去除当前布线。 该方法的优点在于，通过向导电发热体的电流布线施加电流而将半导体芯片附接到基板，以仅局部加热焊料层，从而降低热应力并防止基板的变形。

公开(公告)号：US20120118615A1

公开(公告)日：2012-05-17

申请号：US13091016

申请日：2011-04-20

申请人： Kwan Ho LEE ,  Seog Moon CHOI ,  Tae Hyun KIM

发明人： Kwan Ho LEE ,  Seog Moon CHOI ,  Tae Hyun KIM

IPC分类号： H05K1/03 ,  B32B37/24 ,  B32B15/04 ,  B32B7/02 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： B82Y30/00 ,  B32B15/08 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2264/108 ,  B32B2457/00 ,  Y10T428/2495 ,  Y10T428/31678

摘要： Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate.

摘要翻译： 本文公开了一种金属覆层压板，其制造方法和使用其的散热基板。 金属复合层压板具有增加的粘附性，因为在上金属箔和下金属箔的接合表面之间形成一层碳纳米颗粒与预浸料，并且由于预浸料坯具有掺入碳纤维，所以具有改善的导热性能和机械性能。 此外，其中结合有碳纳米纤维的树脂构件可以交替地层叠有金属层，并且金属层可以插入预浸料中，从而改善导热性能，并且堆叠层的数量可以根据最终用途而变化，从而控制导热性能 和金属包覆层压板的机械性能。

公开(公告)号：US20110089553A1

公开(公告)日：2011-04-21

申请号：US12637755

申请日：2009-12-15

申请人： Tae Hyun KIM ,  Gyu Han KIM

发明人： Tae Hyun KIM ,  Gyu Han KIM

IPC分类号： H01L25/16 ,  H01L23/52

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15157 ,  H01L2924/15159 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00014

摘要： Provided are a stack-type solid-state drive (SSD) capable of reducing a size thereof by mounting semiconductor chips in a recess region formed in a substrate, and a method of fabricating the stack-type SSD. The stack-type SSD includes a substrate including one or more recess regions; one or more passive electronic elements mounted in the one or more recess regions; one or more control semiconductor chips mounted in the one or more recess regions; one or more non-volatile memory semiconductor chips mounted on a first surface of the substrate so as to overlap the one or more passive electronic elements, the one or more control semiconductor chips, or all the passive electronic elements and the control semiconductor chips; and an external connection terminal located on a side of the substrate.

摘要翻译： 提供了一种能够通过将半导体芯片安装在形成在基板中的凹部区域中而能够减小其尺寸的堆叠型固态驱动器（SSD），以及制造叠层型SSD的方法。 堆叠型SSD包括包括一个或多个凹部区域的基板; 安装在所述一个或多个凹部区域中的一个或多个无源电子元件; 安装在所述一个或多个凹部区域中的一个或多个控制半导体芯片; 一个或多个非易失性存储器半导体芯片，其安装在所述基板的第一表面上，以便与所述一个或多个无源电子元件，所述一个或多个控制半导体芯片或所有无源电子元件和所述控制半导体芯片重叠; 以及位于基板一侧的外部连接端子。

公开(公告)号：US20220107112A1

公开(公告)日：2022-04-07

申请号：US17311653

申请日：2019-12-27

申请人： Tae Hyun KIM

发明人： Tae Hyun KIM

IPC分类号： F24F13/02 ,  F24F13/06 ,  F16B2/24

摘要： The present invention relates to a pipe connection structure of an air conditioning system, wherein a corrugated pipe (200) is detachably decoupled from/coupled to an object (100) to be coupled, the pipe connection structure comprising: a fixing plate (320) fixed to the object (100) to be coupled; and a clip (300) having a pressing protrusion (350) that is connected to the fixing plate (320) and is convexly formed in a direction facing the fixing plate (320), wherein in the state where the fixing plate (320) is fixed to the object (100) to be coupled, the end of the corrugated pipe (200) is inserted between the fixing plate (320) and the pressing projection (350) and is pressed by the pressing projection (350) so as not to be separated therefrom.